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1. 发明授权

US09450042B2 Integrated circuits with metal-insulator-metal (MIM) capacitors and methods for fabricating same 有权
标题翻译：具有金属绝缘体金属（MIM）电容器的集成电路及其制造方法
公开(公告)号：US09450042B2
公开(公告)日：2016-09-20
申请号：US13567853
申请日：2012-08-06
申请人： Matthias Lehr
发明人： Matthias Lehr
IPC分类号： H01L21/02 , H01L21/8242 , H01L49/02 , H01L23/522
CPC分类号： H01L28/75 , H01L23/5223 , H01L2924/0002 , H01L2924/00
摘要： Integrated circuits with metal-insulator-metal (MIM) capacitors and methods for fabricating such integrated circuits are provided. In an embodiment, an integrated circuit includes a dielectric material layer overlying a semiconductor substrate. A surface conditioning layer overlies the dielectric material layer. Further, a metal layer is formed directly on the surface conditioning layer. A MIM capacitor is positioned on the metal layer. The MIM capacitor includes a first conductive layer formed directly on the metal layer with a smooth upper surface, an insulator layer formed directly on the smooth upper surface of the first conductive layer, and a second conductive layer formed directly on the insulator layer with a smooth lower surface.
摘要翻译：提供了具有金属 - 绝缘体 - 金属（MIM）电容器的集成电路和用于制造这种集成电路的方法。在一个实施例中，集成电路包括覆盖半导体衬底的电介质材料层。表面调理层覆盖在介电材料层上。此外，在表面调理层上直接形成金属层。 MIM电容器位于金属层上。 MIM电容器包括直接在金属层上形成的具有平滑上表面的第一导电层，直接形成在第一导电层的平滑上表面上的绝缘体层，以及直接形成在绝缘体层上的平滑的第二导电层，下表面。

2. 发明授权

US08482123B2 Stress reduction in chip packaging by using a low-temperature chip-package connection regime 有权
标题翻译：通过使用低温芯片封装连接方式降低芯片封装的压力
公开(公告)号：US08482123B2
公开(公告)日：2013-07-09
申请号：US13179643
申请日：2011-07-11
申请人： Michael Grillberger , Matthias Lehr , Thomas Werner
发明人： Michael Grillberger , Matthias Lehr , Thomas Werner
IPC分类号： H01L23/48
CPC分类号： H01L23/49811 , H01L21/4853 , H01L23/562 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/81 , H01L2224/0401 , H01L2224/05571 , H01L2224/11452 , H01L2224/11462 , H01L2224/11464 , H01L2224/11622 , H01L2224/11825 , H01L2224/13007 , H01L2224/13011 , H01L2224/13012 , H01L2224/13014 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13186 , H01L2224/1319 , H01L2224/1357 , H01L2224/13644 , H01L2224/14051 , H01L2224/16225 , H01L2224/16227 , H01L2224/17517 , H01L2224/17519 , H01L2224/81141 , H01L2224/81345 , H01L2224/81898 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01073 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/1306 , H01L2924/14 , H01L2924/00012 , H01L2924/00 , H01L2224/05552
摘要： A semiconductor chip and a package substrate may be directly connected on the basis of form closure by providing appropriately shaped complementary contact structures in the semiconductor chip and the package substrate. Consequently, solder material may no longer be required and thus any elevated temperatures during the assembly process may be avoided, which may conventionally result in significant stress forces, thereby creating damage, in particular in very complex metallization systems.
摘要翻译：半导体芯片和封装基板可以通过在半导体芯片和封装基板中提供适当形状的互补的接触结构，在形式闭合的基础上直接连接。因此，可能不再需要焊料材料，因此可以避免组装过程中的任何升高的温度，这常常会导致显着的应力，从而造成损坏，特别是在非常复杂的金属化系统中。

3. 发明授权

US08392573B2 Transport of customer flexibility changes in a multi-tenant environment 有权
标题翻译：在多租户环境中运输客户灵活性变化
公开(公告)号：US08392573B2
公开(公告)日：2013-03-05
申请号：US12847746
申请日：2010-07-30
申请人： Matthias Lehr , Stefan Baeuerle , Karsten Fanghaenel , Bernhard Thimmel , Uwe Schlarb , Olaf Meincke , Volker Driesen , Juergen Specht
发明人： Matthias Lehr , Stefan Baeuerle , Karsten Fanghaenel , Bernhard Thimmel , Uwe Schlarb , Olaf Meincke , Volker Driesen , Juergen Specht
IPC分类号： G06F15/173
CPC分类号： H04L67/02 , G06F17/3089
摘要： Transporting of flexibility changes of customer content between tenants in a multi-tenant computing system can be performed by exporting customer content from a first tenant of the multi-tenant computing system, transporting the customer content exported from the first tenant to a second tenant of the multi-tenant computing system, importing the customer content into a staging area in the second tenant to enable a user associated with second tenant to access the customer content via the staging area based on a content extraction trigger, and activating selected customer content from the staging area in a productive component of the second tenant. The content extraction trigger can characterize an extraction of at least some of the customer content from the staging area. Related methods, systems, and articles of manufacture are also disclosed.
摘要翻译：可以通过从多租户计算系统的第一租户输出客户内容，将从第一租户输出的客户内容传送到第一租户的第二租户，来执行在多租户计算系统中的租户之间的客户内容的灵活性变化的传送多租户计算系统，将所述客户内容导入所述第二租户中的暂存区域，以使得与第二租户相关联的用户能够基于内容提取触发器经由所述登台区域访问所述客户内容，以及从所述分段激活所选择的客户内容第二租户生产部分的区域。内容提取触发器可以表征从分段区域提取至少一些客户内容。还公开了相关方法，系统和制品。

4. 发明申请

US20120235285A1 PROTECTION OF REACTIVE METAL SURFACES OF SEMICONDUCTOR DEVICES DURING SHIPPING BY PROVIDING AN ADDITIONAL PROTECTION LAYER 有权
标题翻译：通过提供附加保护层在运输期间保护半导体器件的反应性金属表面
公开(公告)号：US20120235285A1
公开(公告)日：2012-09-20
申请号：US13421154
申请日：2012-03-15
申请人： Matthias Lehr , Joerg Hohage , Andreas Ott
发明人： Matthias Lehr , Joerg Hohage , Andreas Ott
IPC分类号： H01L23/58 , H01L21/28
CPC分类号： H01L24/05 , H01L23/3107 , H01L23/3171 , H01L24/03 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/04042 , H01L2224/05647 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48647 , H01L2224/48747 , H01L2224/48847 , H01L2224/85205 , H01L2224/85375 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01068 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/1306 , H01L2924/00014 , H01L2924/00
摘要： When forming complex metallization systems on the basis of copper, the very last metallization layer may receive contact regions on the basis of copper, the surface of which may be passivated on the basis of a dedicated protection layer, which may thus allow the patterning of the passivation layer stack prior to shipping the device to a remote manufacturing site. Hence, the protected contact surface may be efficiently re-exposed in the remote manufacturing site on the basis of an efficient non-masked wet chemical etch process.
摘要翻译：当基于铜形成复杂的金属化系统时，最后的金属化层可以基于铜接收接触区域，铜的表面可以在专用保护层的基础上被钝化，因此可以使图案化在将设备运送到远程制造现场之前的钝化层堆叠。因此，受保护的接触表面可以在有效的非掩蔽的湿化学蚀刻工艺的基础上有效地再次暴露在远程制造现场。

5. 发明申请

US20120051392A1 Applying Thermal Mechanical Characteristics of Complex Semiconductor Devices by Integrated Heating Systems 有权
标题翻译：通过综合加热系统应用复杂半导体器件的热机械特性
公开(公告)号：US20120051392A1
公开(公告)日：2012-03-01
申请号：US13187203
申请日：2011-07-20
申请人： Michael Grillberger , Matthias Lehr , Frank Kuechenmeister , Steffen Koch
发明人： Michael Grillberger , Matthias Lehr , Frank Kuechenmeister , Steffen Koch
IPC分类号： G01N3/60 , H01L23/48
CPC分类号： H01L22/34 , H01L22/12 , H01L23/345 , H01L24/16 , H01L2224/131 , H01L2924/01019 , H01L2924/1306 , H01L2924/14 , H01L2924/014 , H01L2924/00
摘要： In a semiconductor device or test structure, appropriate heating elements, for instance in the form of resistive structures, are implemented so as to obtain superior area coverage, thereby enabling a precise evaluation of the thermal conditions within a complex semiconductor device. In particular, the device internal heating elements may allow the evaluation of hot spots and the response of a complex metallization system to specific temperature profiles, in particular at critical areas, such as edge regions in which mechanical stress forces are typically highest in contact regimes in which the package substrate and the metallization system are directly connected.
摘要翻译：在半导体器件或测试结构中，实施适当的加热元件，例如以电阻结构的形式，以获得优异的面积覆盖，从而能够对复杂半导体器件内的热条件进行精确评估。特别地，设备内部加热元件可以允许评估热点和复杂金属化系统对特定温度分布的响应，特别是在关键区域，例如边界区域，其中机械应力通常在接触方式中最高封装衬底和金属化系统直接连接。

6. 发明申请

US20120049350A1 Stress Reduction in Chip Packaging by Using a Low-Temperature Chip-Package Connection Regime 有权
标题翻译：使用低温芯片封装连接方式降低芯片封装的应力
公开(公告)号：US20120049350A1
公开(公告)日：2012-03-01
申请号：US13179643
申请日：2011-07-11
申请人： Michael Grillberger , Matthias Lehr , Thomas Werner
发明人： Michael Grillberger , Matthias Lehr , Thomas Werner
IPC分类号： H01L23/48 , H01L21/50 , H01L23/482
CPC分类号： H01L23/49811 , H01L21/4853 , H01L23/562 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/81 , H01L2224/0401 , H01L2224/05571 , H01L2224/11452 , H01L2224/11462 , H01L2224/11464 , H01L2224/11622 , H01L2224/11825 , H01L2224/13007 , H01L2224/13011 , H01L2224/13012 , H01L2224/13014 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13186 , H01L2224/1319 , H01L2224/1357 , H01L2224/13644 , H01L2224/14051 , H01L2224/16225 , H01L2224/16227 , H01L2224/17517 , H01L2224/17519 , H01L2224/81141 , H01L2224/81345 , H01L2224/81898 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01073 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/1306 , H01L2924/14 , H01L2924/00012 , H01L2924/00 , H01L2224/05552
摘要： A semiconductor chip and a package substrate may be directly connected on the basis of form closure by providing appropriately shaped complementary contact structures in the semiconductor chip and the package substrate. Consequently, solder material may no longer be required and thus any elevated temperatures during the assembly process may be avoided, which may conventionally result in significant stress forces, thereby creating damage, in particular in very complex metallization systems.
摘要翻译：半导体芯片和封装基板可以通过在半导体芯片和封装基板中提供适当形状的互补的接触结构，在形式闭合的基础上直接连接。因此，可能不再需要焊料材料，因此可以避免组装过程中的任何升高的温度，这常常会导致显着的应力，从而造成损坏，特别是在非常复杂的金属化系统中。

7. 发明申请

US20120030581A1 Mashup Component Framework for Business Enterprise User Interfaces 审中-公开
标题翻译：企业用户界面的Mashup组件框架
公开(公告)号：US20120030581A1
公开(公告)日：2012-02-02
申请号：US12845270
申请日：2010-07-28
申请人： Weiyi Cui , Xiao Xu , Gregor Karl Frey , Karsten Fanghänel , Sven Schwerin-Wenzel , Zhijian Wang , Matthias Lehr , Stefan A. Baeuerle
发明人： Weiyi Cui , Xiao Xu , Gregor Karl Frey , Karsten Fanghänel , Sven Schwerin-Wenzel , Zhijian Wang , Matthias Lehr , Stefan A. Baeuerle
IPC分类号： G06F3/01
CPC分类号： G06F8/36 , G06F8/38 , G06F9/451 , G06Q10/067
摘要： According to some embodiments, a business user interface page associated with a business service provider may be established. The user interface page may have, for example, at least one in-port to receive data from components and at least one out-port to provide data to components. A mashup component may be embedded within the business user interface page, and may also have at least one out-port to provide data to components. A display of the user interface page to a client may then be facilitated, including the embedded mashup component, wherein the mashup component combines and displays data received from a plurality of external data sources.
摘要翻译：根据一些实施例，可以建立与业务服务提供商相关联的业务用户界面页面。用户界面页面可以具有例如至少一个端口以从组件和至少一个输出端口接收数据以向组件提供数据。混搭组件可以嵌入在业务用户界面页面中，并且还可以具有至少一个外部端口以向组件提供数据。然后可以促进向客户端的用户界面页面的显示，包括嵌入式混搭组件，其中混搭组件组合并显示从多个外部数据源接收的数据。

8. 发明申请

US20120030580A1 Stable Anchors In User Interface to Support Life Cycle Extensions 有权
标题翻译：稳定的锚点在用户界面支持生命周期扩展
公开(公告)号：US20120030580A1
公开(公告)日：2012-02-02
申请号：US12847311
申请日：2010-07-30
申请人： Uwe Schlarb , Ioannis Grammatikakis , Gregor Karl Frey , Matthias Lehr , Markus Viol , Stefan A. Baeuerle , Bernhard Thimmel , Karsten Fanghinel
发明人： Uwe Schlarb , Ioannis Grammatikakis , Gregor Karl Frey , Matthias Lehr , Markus Viol , Stefan A. Baeuerle , Bernhard Thimmel , Karsten Fanghinel
IPC分类号： G06F3/01 , G06F15/16
CPC分类号： G06F9/4443 , G06F9/451
摘要： According to some embodiments, a business service provider may define a stable user interface anchor entity associated with a business object data structure. A reference field may be associated with the stable user interface anchor, the reference field representing a path to a persistent node of the business object data structure. An end user adaptation to a user interface may then be applied in connection with the business object data structure, the adaptation referencing the stable user interface anchor entity.
摘要翻译：根据一些实施例，业务服务提供商可以定义与业务对象数据结构相关联的稳定的用户界面锚实体。参考字段可以与稳定用户界面锚相关联，该引用字段表示到业务对象数据结构的持久节点的路径。然后可以结合业务对象数据结构应用对用户界面的最终用户适配，引用稳定用户界面锚实体的自适应。

9. 发明申请

US20120030312A1 TRANSPORT OF CUSTOMER FLEXIBILITY CHANGES IN A MULTI-TENANT ENVIRONMENT 有权
标题翻译：客户灵活变更在多重环境中的运输
公开(公告)号：US20120030312A1
公开(公告)日：2012-02-02
申请号：US12847746
申请日：2010-07-30
申请人： Matthias Lehr , Stefan Baeuerle , Karsten Fanghaenel , Bernhard Thimmel , Uwe Schlarb , Olaf Meincke , Volker Driesen , Juergen Specht
发明人： Matthias Lehr , Stefan Baeuerle , Karsten Fanghaenel , Bernhard Thimmel , Uwe Schlarb , Olaf Meincke , Volker Driesen , Juergen Specht
IPC分类号： G06F15/16
CPC分类号： H04L67/02 , G06F17/3089
摘要： Transporting of flexibility changes of customer content between tenants in a multi-tenant computing system can be performed by exporting customer content from a first tenant of the multi-tenant computing system, transporting the customer content exported from the first tenant to a second tenant of the multi-tenant computing system, importing the customer content into a staging area in the second tenant to enable a user associated with second tenant to access the customer content via the staging area based on a content extraction trigger, and activating selected customer content from the staging area in a productive component of the second tenant. The content extraction trigger can characterize an extraction of at least some of the customer content from the staging area. Related methods, systems, and articles of manufacture are also disclosed.
摘要翻译：可以通过从多租户计算系统的第一租户输出客户内容，将从第一租户输出的客户内容传送到第一租户的第二租户，来执行在多租户计算系统中的租户之间的客户内容的灵活性变化的传送多租户计算系统，将所述客户内容导入所述第二租户中的暂存区域，以使得与第二租户相关联的用户能够基于内容提取触发器经由所述登台区域访问所述客户内容，并且从所述分段激活所选择的客户内容第二租户生产部分的区域。内容提取触发器可以表征从分段区域提取至少一些客户内容。还公开了相关方法，系统和制品。

10. 发明申请

US20120016910A1 FIELD EXTENSIBILITY USING GENERIC BOXED COMPONENTS 有权
标题翻译：使用通用盒式组件的现场可扩展性
公开(公告)号：US20120016910A1
公开(公告)日：2012-01-19
申请号：US12838594
申请日：2010-07-19
申请人： Uwe Schlarb , Stefan A. Baeuerle , Bernhard Thimmel , Matthias Lehr , Karsten Fanghänel , Johannes Haselberger , Anne Jacobi , Bertram Vielsack
发明人： Uwe Schlarb , Stefan A. Baeuerle , Bernhard Thimmel , Matthias Lehr , Karsten Fanghänel , Johannes Haselberger , Anne Jacobi , Bertram Vielsack
IPC分类号： G06F17/30
CPC分类号： G06F17/30864
摘要： A system may include reception of a definition of an extension field to be added to a business object node, generation of metadata for a data type enhancement object associated with the extension field, and generation of an ABAP dictionary proxy object based on the data type enhancement object, wherein the ABAP dictionary proxy object describes the extension field in a sub-structure of a first field of the ABAP dictionary proxy object.
摘要翻译：系统可以包括接收要添加到业务对象节点的扩展字段的定义，生成与扩展字段相关联的数据类型增强对象的元数据，以及基于数据类型增强生成ABAP字典代理对象对象，其中ABAP字典代理对象描述ABAP字典代理对象的第一字段的子结构中的扩展字段。

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