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    • 5. 发明申请
    • MINIATURE MULTILAYER RADIATIVE COOLING CASE WTIH HIDDEN QUICK RELEASE SNAPS
    • 微型多层式放射性冷却箱WTIH HIDDEN快速释放
    • US20120307455A1
    • 2012-12-06
    • US13580482
    • 2011-02-22
    • Darin Bradley RitterMickey Jay HuntMark William Gysin
    • Darin Bradley RitterMickey Jay HuntMark William Gysin
    • H05K7/20
    • H05K7/20445G06F1/1656H01L23/4006H01L2924/0002H05K7/20436H05K13/00H01L2924/00
    • A passive cooling arrangement for an electronic housing assembly is disclosed which comprises a frame disposed in the housing assembly; a circuit board supported in the frame; a heat generating component disposed on the circuit board; and a heat sink configured with a substantially flat peripheral portion and a depression portion, the substantially flat peripheral portion facing and being nearly coextensive with an outer wall of said housing assembly, and the depression portion being in thermal engagement with the heat generating component on the circuit board, whereby heat generated by the heat generating component can be passively thermally conducted through the depression portion and into the substantially flat peripheral portion of the heat sink, and thereafter dissipated in a generally uniform manner through the outer wall of the housing assembly. The frame comprises a base with embosses which support the circuit board in a position enabling the thermal engagement of the heat generating component and the depression portion of the heat sink. The outer wall of the housing assembly is preferably unvented and the housing assembly is preferably oriented in use with the outer wall facing upwardly.
    • 公开了一种用于电子壳体组件的被动冷却装置,其包括设置在壳体组件中的框架; 支撑在框架中的电路板; 设置在电路板上的发热部件; 以及散热器,其配置有基本上平坦的周边部分和凹陷部分,所述基本上平坦的周边部分面向并与所述壳体组件的外壁几乎共同延伸,并且所述凹陷部分与所述发热部件热接合 由此,由发热部件产生的热量可以被动地通过该凹陷部分热传导到散热片的大致平坦的周边部分,然后通过壳体组件的外壁以大致均匀的方式散发。 该框架包括具有压花的基座,其将电路板支撑在能够发热部件与散热器的凹陷部分的热接合的位置。 壳体组件的外壁优选地不被排出,并且壳体组件优选地定向成使用而外壁面向上。