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1. 发明授权

US5903041A Integrated two-terminal fuse-antifuse and fuse and integrated two-terminal fuse-antifuse structures incorporating an air gap 失效
公开(公告)号：US5903041A
公开(公告)日：1999-05-11
申请号：US263920
申请日：1994-06-21
申请人： Michael David La Fleur , Ralph Whitten , Chun-Mai Liu , Alan E. Comer , Scott Graham , Yu-Lin Lee
发明人： Michael David La Fleur , Ralph Whitten , Chun-Mai Liu , Alan E. Comer , Scott Graham , Yu-Lin Lee
IPC分类号： H01L21/768 , H01L23/525 , H01L29/04 , H01L27/10 , H01L29/00
CPC分类号： H01L21/7682 , H01L23/5252 , H01L23/5256 , H01L2924/0002
摘要： A two-terminal fuse-antifuse structure comprises a horizontal B-fuse portion and a vertical A-fuse portion disposed between two metallization layers of an integrated circuit device. The two-terminal fuse-antifuse can be programmed with a relatively high current applied across the two terminals to blow the B-fuse, or with a high voltage applied across the two terminals to program the A-fuse. Such a device, connected between two circuit nodes, initially does not provide an electrical connection between the two circuit nodes. It may then be programmed with a relatively high voltage to blow the A-fuse, causing it to conduct between the two circuit nodes. Then, upon application of a relatively high current between the two circuit nodes, the B-fuse will blow, making the device permanently non-conductive. An improvement permitting higher current programming of B-fuses either alone or as part of Ab-fuse structures, incorporates an air gap which provides a pocket of space either above, below or both above and below the B-fuse portion of the device. This air gap provides a place for material disrupted (melted or vaporized) by a fuse or Ab-fuse programming event to go, eliminates direct contact between the dielectric material and the fuse-portion of the device, and also thermally isolates the melted fuse material from the dielectric, thus reducing the physical stress within the dielectric itself associated with high current programming and avoiding undesired collateral damage normally associated with high current programming events. The creation of an air gap around the fuse neck is accomplished by the removal of a sacrificial layer of an oxidizable polymer material in a gaseous and/or plasma state through a small hole in the dielectric referred to as a sacrificial via opening or just "sacrificial via". After removal of the oxidizable polymer material through the sacrificial via, the sacrificial via is sealed with a passivation layer formed of a polymeric material to prevent damage to the underlying structure. The integration of the air gap and sacrificial via sealing into the current fuse process manufacturing requires the following additional processing steps: (1) Air gap definition; (2) Air gap evacuation with oxygen plasma; (3) the application of the sealing polymer; and (4) the curing of the sealing polymer.

2. 发明授权

US5838060A Stacked assemblies of semiconductor packages containing programmable interconnect 失效
公开(公告)号：US5838060A
公开(公告)日：1998-11-17
申请号：US571290
申请日：1995-12-12
申请人： Alan E. Comer
发明人： Alan E. Comer
IPC分类号： H01L23/498 , H01L25/10 , H01L23/02
CPC分类号： H01L23/49827 , H01L25/105 , H01L2224/05554 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2225/1005 , H01L2225/1058 , H01L2225/1064 , H01L2225/1094 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/14 , H01L2924/1515 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/30107
摘要： A stackable semiconductor package is described which has external contact points (pins, pads, solder-bumps, etc.), which are arranged in arrays on the top and bottom surfaces of the package. This package also has internal contact points (bond pads) for connection to an integrated circuit die. The external and internal connection points are connected by a programmable interconnection matrix, which may be manufactured separately from the package body and then assembled within the package. The internal contact points can each be selectively connected to the external contact points, and selective connections can also be made linking pairs of the external contact points. Stacks of such packages, containing different dice, may be formed, creating large, tightly-coupled circuit blocks. A presently-preferred embodiment of the programmable package is described in which the package body and programmable matrix are manufactured as a unit. The described embodiment comprises a package body (12) with a formed recess (14) for receiving a package lid (50) surrounding a deeper die cavity (16), both on the package's top surface. After mounting, an integrated circuit die (20) is connected through internal contact points (24) to a first metal trace layer (28) formed on the package's bottom surface. A second metal trace layer (30) is connected to the package external contact points, consisting of a horseshoe-shaped array of solder bumps (38) on the package bottom, a matching array of solder-contacts (42) on the top, a linear array of solder bumps (34) along one edge of the package, and a matching linear array of solder-contacts (36) along the opposite edge of the package. A flange on lid (50) is bonded to lid recess (14), and the lid body is bonded to the surface of IC die (20) with a material which is thermally conductive, but electrically insulating. The lid conducts heat away from the IC die, and extends beyond the package body to act as a cooling fin for the package. If further cooling is required, a hole (52) bored through the lid beyond the package body may be used to bolt the lid to a heat sink. Alternatively, a heat sink or heat dissipation device might be connected to the lid using a conductive epoxy.

3. 发明授权

US5341267A Structures for electrostatic discharge protection of electrical and other components 失效
标题翻译：电气和其他部件的静电放电保护结构
公开(公告)号：US5341267A
公开(公告)日：1994-08-23
申请号：US763964
申请日：1991-09-23
申请人： Ralph G. Whitten , Ta-Pen Guo , Amr Mohsen , Alan E. Comer
发明人： Ralph G. Whitten , Ta-Pen Guo , Amr Mohsen , Alan E. Comer
IPC分类号： H01L23/60 , H02H9/00 , H01H37/76
CPC分类号： H01L23/60 , H01L2924/0002 , H01L2924/3011
摘要： A first passive ESD protection device for an electronic component in a microcircuit includes a fuse element shunting the component to be protected and includes a passive programming path from the outside of the microcircuit to the fuse element. A second passive ESD protection device is deactivatable and reactivatable and includes a first fuse element shunted by a second fuse element in series with a first antifuse element. Shunting the second fuse element with a third fuse element in series with a second antifuse element permits a second deactivation and reactivation to be performed. Additional deactivation/reactivation cycles may be permitted by providing additional series combinations of fuse elements and antifuse elements shunting the preceding fuse element. Combinations of the passive protection device and dual elements comprise ESD protection schemes which may be deactivated and activated multiple times.
摘要翻译：用于微电路中的电子部件的第一无源ESD保护装置包括分流待保护的部件的熔丝元件，并且包括从微电路的外部到熔丝元件的无源编程路径。第二无源ESD保护装置是可去激活的并且可再生的，并且包括由与第一反熔丝元件串联的第二熔丝元件分流的第一熔丝元件。利用与第二反熔丝元件串联的第三熔丝元件来分流第二熔丝元件允许执行第二失活和重新激活。可以通过提供分流前一个熔丝元件的熔丝元件和反熔丝元件的附加串联组合来允许附加的去激活/重新激活循环。被动保护装置和双重元件的组合包括ESD保护方案，其可以被多次停用和激活。

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