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1. 发明授权

US5124782A Integrated circuit package with molded cell 失效
标题翻译：具有模制电池的集成电路封装
公开(公告)号：US5124782A
公开(公告)日：1992-06-23
申请号：US617500
申请日：1990-11-21
申请人： Michael J. Hundt , Michael J. Hundt
发明人： Michael J. Hundt , Michael J. Hundt
IPC分类号： G11C11/413 , H01L23/495 , H01L25/00
CPC分类号： H01L23/49593 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L24/45 , H01L24/49 , H01L2924/01014 , H01L2924/01055 , H01L2924/01079 , H01L2924/14 , H01L2924/19041
摘要： An integrated circuit package encapsulates a volatile memory chip and a backup battery for preserving data in the event of loss of main power supply. The package includes a lead frame assembly encapsulated within a body of non-conductive material, with the memory chip being mounted onto a base plate on one side of the lead frame. The battery is supported in offset relation by axial power leads on the opposite side of the lead frame. The integrated circuit chip, the battery, the lead frame assembly and the gold interconnect wires are completely encapsulated within the molded package body.
摘要翻译：预充电池组件支持易失性存储器芯片和可替换的备用电池，用于在主电源丢失的情况下保存数据。该包装包括一体形成的外部插座，用于接收可替换的备用电池，其可以在模制封装和金属装饰工作完成之后手动地插入插座中或从插座中移除。插座组件包括接口电池腔，其允许备用电池的负极接合负电力指尖。正电池端子由正型引线的弹性端子接触部分接合，该正极引线在模制封装的外部突出。正电源引线的端子接触部分用作与插座肩部结合的保持器，用于将备用电池保持在插座内。

2. 发明授权

US07304362B2 Molded integrated circuit package with exposed active area 有权
公开(公告)号：US07304362B2
公开(公告)日：2007-12-04
申请号：US10151656
申请日：2002-05-20
申请人： Tiao Zhou , Michael J. Hundt
发明人： Tiao Zhou , Michael J. Hundt
IPC分类号： H01L31/0203 , H01L31/0232 , H01L23/28
CPC分类号： H01L21/565 , H01L23/3121 , H01L24/73 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/14 , H01L2924/00012 , H01L2924/00
摘要： An integrated circuit die having an active area that must remain exposed after packaging is secured by a compliant die attachment by which the integrated circuit die is held in position within a transfer mold during encapsulation. The compliant die attachment may comprise a flexible, compressible tape having pressure-sensitive adhesive, alone or with a rigid substrate support, or a compliant adhesive preferably applied only around a periphery of the die attach area. Deformation of the compliant die attachment under mold clamping pressure allows complete contact of the mold with the active area, preventing bleeding of the encapsulating material under the edge of a mold portion onto the active area.

3. 发明授权

US07244967B2 Apparatus and method for attaching an integrating circuit sensor to a substrate 有权
标题翻译：用于将集成电路传感器附接到基板的装置和方法
公开(公告)号：US07244967B2
公开(公告)日：2007-07-17
申请号：US10889725
申请日：2004-07-13
申请人： Michael J. Hundt , Tiao Zhou
发明人： Michael J. Hundt , Tiao Zhou
IPC分类号： H01L33/00
CPC分类号： H01L21/565 , H01L23/3121 , H01L2924/0002 , H01L2924/00
摘要： A method of fabricating an integrated circuit sensor package. The method comprises the steps of: 1) mounting a substrate on a first mold block, the substrate comprising a substantially planar material having a first substrate surface and a second substrate surface that contacts a mounting surface of the first mold block; 2) placing an adhesive on the first substrate surface; 3) placing an integrated circuit sensor on the adhesive; and 4) pressing a second mold block against the first substrate surface. The second mold block comprising a cavity portion for receiving the integrated circuit sensor, a contact surface surrounding the cavity portion, and a compliant layer mounted with the cavity portion. Pressing the second mold block against the first substrate surface causes the contact surface to form with the first substrate surface a seal surrounding the integrated circuit sensor. Pressing also causes the compliant layer to press against a sensor array surface of the integrated circuit sensor, thereby pressing the integrated circuit sensor into the adhesive and the first substrate surface.
摘要翻译：一种制造集成电路传感器封装的方法。该方法包括以下步骤：1）将基板安装在第一模块上，该基板包括具有第一基板表面的基本上平面的材料和与第一模块的安装表面接触的第二基板表面; 2）将粘合剂放置在第一基板表面上; 3）将集成电路传感器放置在粘合剂上; 以及4）将第二模具块压靠在所述第一基板表面上。第二模块包括用于接收集成电路传感器的空腔部分，围绕空腔部分的接触表面以及安装有空腔部分的顺应层。将第二模具块压靠第一基板表面使得接触表面与第一基板表面形成围绕集成电路传感器的密封件。按压也使得柔性层压在集成电路传感器的传感器阵列表面上，从而将集成电路传感器压入粘合剂和第一基板表面。

4. 发明授权

US5590462A Process for dissipating heat from a semiconductor package 失效
标题翻译：从半导体封装散热的工艺
公开(公告)号：US5590462A
公开(公告)日：1997-01-07
申请号：US449675
申请日：1995-05-24
申请人： Michael J. Hundt , Carlo Cognetti
发明人： Michael J. Hundt , Carlo Cognetti
IPC分类号： H01L23/367 , H01L23/373 , H05K1/02 , H05K3/30 , H05K3/40 , H05K3/34
CPC分类号： H05K3/305 , H01L23/3677 , H01L23/3737 , H05K1/0206 , H01L2924/15151 , H05K2201/0209 , H05K2201/09072 , H05K2201/09536 , H05K2201/0959 , H05K2201/09909 , H05K2201/10689 , H05K3/4069 , Y02P70/613 , Y10T29/4913 , Y10T29/49144
摘要： A dam is provided on a surface of a circuit board to which an integrated circuit device is to be mounted. The dam defines a region between the integrated circuit package and the circuit board, and a material is injected into this region after the device has been mounted on the circuit board. This material preferably is a good thermal conductor, assisting in the removal of heat from the device. The injected material also preferably acts as an adhesive, more firmly bonding the device the circuit board.
摘要翻译：在要安装集成电路装置的电路板的表面上设置一个坝。大坝限定集成电路封装和电路板之间的区域，并且在器件已经安装在电路板上之后将材料注入该区域。该材料优选是良好的导热体，有助于从装置中除去热量。注入的材料也优选用作粘合剂，更牢固地将电路板粘合到电路板上。

5. 发明授权

US5489752A Process for dissipating heat from a semiconductor package 失效
标题翻译：从半导体封装散热的工艺
公开(公告)号：US5489752A
公开(公告)日：1996-02-06
申请号：US144300
申请日：1993-10-28
申请人： Carlo Cognetti , Michael J. Hundt
发明人： Carlo Cognetti , Michael J. Hundt
IPC分类号： H01L23/367 , H01L23/373 , H05K1/02 , H05K3/30 , H05K3/40 , H05K1/11
CPC分类号： H05K3/305 , H01L23/3677 , H01L23/3737 , H05K1/0206 , H01L2924/15151 , H05K2201/0209 , H05K2201/09072 , H05K2201/09536 , H05K2201/0959 , H05K2201/09909 , H05K2201/10689 , H05K3/4069 , Y02P70/613 , Y10T29/4913 , Y10T29/49144
摘要： A dam is provided on a surface of a circuit board to which an integrated circuit device is to be mounted. The dam defines a region between the integrated circuit package and the circuit board, and a material is injected into this region after the device has been mounted on the circuit board. This material preferably is a good thermal conductor, assisting in the removal of heat from the device. The injected material also preferably acts as an adhesive, more firmly bonding the device the circuit board.
摘要翻译：在要安装集成电路装置的电路板的表面上设置一个坝。大坝限定集成电路封装和电路板之间的区域，并且在器件已经安装在电路板上之后将材料注入该区域。该材料优选是良好的导热体，有助于从装置中除去热量。注入的材料也优选用作粘合剂，更牢固地将电路板粘合到电路板上。

6. 发明授权

US5403782A Surface mountable integrated circuit package with integrated battery mount 失效
标题翻译：带有集成电池座的表面贴装集成电路封装
公开(公告)号：US5403782A
公开(公告)日：1995-04-04
申请号：US995665
申请日：1992-12-21
申请人： D. Craig Dixon , Michael J. Hundt
发明人： D. Craig Dixon , Michael J. Hundt
IPC分类号： H01L25/00 , H01L23/495 , H01L23/58 , H01M2/10 , H01M2/20 , H01L21/60
CPC分类号： H01L23/58 , H01L23/49593 , H01M2/1044 , H01M2/20 , H01L2224/48091 , H01L24/48 , H01L2924/00014 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/14 , H01L2924/1532 , H01L2924/16152 , H01L2924/16195 , Y10S257/924 , Y10T29/49121 , Y10T29/49171
摘要： An integrated circuit package of the surface-mountable type within which a battery is mounted is disclosed. Battery leads extend from the side of the package body opposite that which is adjacent the circuit board when mounted, and between which a conventional battery may be placed. Standoffs are located on the package body for supporting the battery above the package body, so that a gap is present therebetween. A housing is attached to the package over the battery, and has standoffs attached to its inner surface so that a gap is also present between the housing and the battery. The gaps may be air gaps or filled with a low thermal conductivity material. The gaps thermally insulate the battery from the package body and housing, so that the circuit may be subjected to solder reflow mounting to a circuit board, while insulating the high temperatures from the battery.
摘要翻译：公开了一种其中安装有电池的可表面安装型集成电路封装。电池引线在安装时从封装主体的与电路板相邻的侧面相对延伸，并且可以放置常规电池。支架位于封装主体上，用于将电池支撑在封装主体上方，从而在其间存在间隙。壳体通过电池连接到封装上，并且具有附接到其内表面的支座，使得壳体和电池之间也存在间隙。间隙可以是气隙或填充有低导热性材料。间隙使电池与封装主体和外壳热绝缘，使得电路可以经受回流焊安装到电路板上，同时将高温与电池隔离。

7. 发明授权

US5289034A IC package having replaceable backup battery 失效
标题翻译： IC封装具有可替换的备用电池
公开(公告)号：US5289034A
公开(公告)日：1994-02-22
申请号：US34584
申请日：1993-03-22
申请人： Michael J. Hundt
发明人： Michael J. Hundt
IPC分类号： H01L23/495 , H01L23/48 , G11C7/00 , H01L23/02 , H01L23/12
CPC分类号： H01L23/49593 , H01L2224/45144 , H01L2224/48091 , Y10S257/924
摘要： A premolded battery package supports a volatile memory chip and a replaceable backup battery for preserving data in the event of loss of main power supply. The package includes an integrally formed external socket for receiving a replaceable backup battery which can be manually inserted into or removed from the socket after molding encapsulation and metal trim work have been completed. The socket assembly includes an interface battery cavity which permits the negative terminal of a backup battery to engage a negative power finger lead. The positive battery terminal is engaged by a resilient terminal contact portion of a positive finger lead which projects externally of the molded package. The terminal contact portion of the positive power lead serves as a retainer in combination with socket shoulder portions for retaining the backup battery within the socket.
摘要翻译：预充电池组件支持易失性存储器芯片和可替换的备用电池，用于在主电源丢失的情况下保存数据。该包装包括一体形成的外部插座，用于接收可替换的备用电池，其可以在模制封装和金属装饰工作完成之后手动地插入插座中或从插座移除。插座组件包括接口电池腔，其允许备用电池的负极接合负电力指尖。正电池端子由正型引线的弹性端子接触部分接合，该正极引线在模制封装的外部突出。正电源引线的端子接触部分与用于将备用电池保持在插座内的插座肩部结合起来用作保持器。

8. 发明授权

US5283717A Circuit assembly having interposer lead frame 失效
标题翻译：具有插入器引线框架的电路组件
公开(公告)号：US5283717A
公开(公告)日：1994-02-01
申请号：US986117
申请日：1992-12-04
申请人： Michael J. Hundt
发明人： Michael J. Hundt
IPC分类号： H01L23/12 , H01L21/822 , H01L23/31 , H01L23/495 , H01L23/498 , H01L23/50 , H01L27/04 , H05K5/02
CPC分类号： H01L23/49589 , H01L23/3107 , H01L23/49503 , H01L23/49838 , H01L23/49894 , H01L2224/05554 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48237 , H01L2224/48247 , H01L24/45 , H01L24/48 , H01L2924/01079 , H01L2924/14 , H01L2924/1433 , H01L2924/19041 , H01L2924/19107 , H01L2924/30107 , H01L2924/3025
摘要： A circuit assembly includes a finger lead assembly having structure for supporting an interposer substrate assembly and an electronic circuit device, the substrate assembly having conductive elements for providing electrical connection between finger leads of the lead assembly and respective circuit sections within the circuit device. The circuit device is mounted proximate to an upper surface of the substrate assembly. At least one decoupling capacitor is mounted on a lower surface of the substrate assembly at a level below that of the finger leads and electrically connected, through circuitry within the substrate assembly including inter-level via connectors, to respective circuits within the circuit device.
摘要翻译：电路组件包括具有用于支撑插入器基板组件和电子电路装置的结构的指状导线组件，所述基板组件具有用于在引线组件的指状引线和电路装置内的相应电路部分之间提供电连接的导电元件。电路装置安装在基板组件的上表面附近。至少一个去耦电容器安装在基板组件的下表面上，其水平低于手指引线的下表面，并通过包括级间通孔连接器的基板组件内的电路电连接到电路装置内的相应电路。

9. 发明申请

US20100019374A1 BALL GRID ARRAY PACKAGE 审中-公开
标题翻译：球网阵列包
公开(公告)号：US20100019374A1
公开(公告)日：2010-01-28
申请号：US12180003
申请日：2008-07-25
申请人： Michael J. Hundt
发明人： Michael J. Hundt
IPC分类号： H01L23/488
CPC分类号： H01L23/50 , H01L23/3128 , H01L23/36 , H01L23/49805 , H01L23/49816 , H01L24/28 , H01L24/48 , H01L2224/2919 , H01L2224/32506 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01078 , H01L2924/01322 , H01L2924/0781 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/181 , H01L2924/0665 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A thermally conductive ball grid array (BGA) package for integrated circuits having improved ground path employs a printed circuit substrate. The substrate has an array of solder balls disposed on the bottom side. There is an opening in the substrate corresponding to the integrated circuit die. A grounding ring covers the vertical walls of the opening and includes an upper ground collar on the top side of the substrate and a lower ground collar on the bottom side of the substrate. A thermally and electrically conductive heat spreader is attached to the lower ground collar on the bottom side of the BGA package, covering the opening in the substrate. The integrated circuit die is mounted on the heat spreader, with the active side up, within the opening in the substrate. Ground pads on the active side of the die are attached to the upper ground collar by wire bonds, to provide a continuous ground path from the ground pads to the heat spreader. Molded plastic covers the semiconductor device and the top side of the substrate.
摘要翻译：用于具有改进的接地路径的集成电路的导热球栅阵列（BGA）封装采用印刷电路衬底。衬底具有设置在底侧的焊球阵列。在与集成电路管芯相对应的衬底中有一个开口。接地环覆盖开口的垂直壁，并且包括在基板的顶侧上的上接地环和底板底部的下接地环。导热导热散热器安装在BGA封装底部的下接地套环上，覆盖衬底中的开口。集成电路管芯安装在散热器上，主动面朝上，位于衬底的开口内。裸片活动侧的接地焊盘通过引线接合连接到上接地环，从而提供从接地焊盘到散热器的连续接地路径。模制塑料覆盖半导体器件和衬底的顶侧。

10. 发明申请

US20080290557A1 Mold with compensating base 有权
标题翻译：带补偿底座的模具
公开(公告)号：US20080290557A1
公开(公告)日：2008-11-27
申请号：US12154726
申请日：2008-05-27
申请人： Michael J. Hundt , Tiao Zhou
发明人： Michael J. Hundt , Tiao Zhou
IPC分类号： B29C70/72
CPC分类号： H01L21/565 , H01L23/3121 , H01L24/73 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/14 , Y10S425/044 , H01L2924/00012 , H01L2924/00
摘要： The bottom mold portion for a transfer molding system is covered with a deformable material. During mold clamping, the deformable material contacts the bottom surface of the packaging substrate on which the integrated circuit die is mounted. Deformation of this relatively soft covering on the bottom mold portion accommodates thickness variations in the packaging substrate, as well as non-planarity of the adhesive layer between the integrated circuit die and packaging substrate in exposed active area integrated circuits.
摘要翻译：用于传递模制系统的底部模具部分被可变形材料覆盖。在模具夹紧期间，可变形材料接触其上安装有集成电路管芯的封装衬底的底表面。在底部模具部分上的这种相对软的覆盖物的变形适应于封装衬底中的厚度变化，以及暴露的有源区域集成电路中集成电路管芯和封装衬底之间的粘合剂层的非平面性。

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