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1. 发明授权

US07595560B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US07595560B2
公开(公告)日：2009-09-29
申请号：US11354124
申请日：2006-02-15
申请人： Mitsuru Ohta , Tomoki Kato
发明人： Mitsuru Ohta , Tomoki Kato
IPC分类号： H01L23/48
CPC分类号： H01L24/48 , H01L23/293 , H01L23/3171 , H01L24/05 , H01L24/45 , H01L24/85 , H01L2224/02166 , H01L2224/04042 , H01L2224/05624 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/45164 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48453 , H01L2224/48465 , H01L2224/48507 , H01L2224/48624 , H01L2224/73265 , H01L2924/00011 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01202 , H01L2924/10253 , H01L2924/15311 , H01L2924/181 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/013 , H01L2924/20757 , H01L2924/00015 , H01L2924/00013 , H01L2924/00012 , H01L2924/01049 , H01L2924/01006
摘要： An improved reliability of a junction region between a bonding wire and an electrode pad in an operation at higher temperature is presented. A semiconductor device 100 includes a semiconductor chip 102 provided on a lead frame 121, which are encapsulated with an encapsulating resin 115. Lead frames 119 are provided in both sides of the lead frame 121. A portion of the lead frame 119 is encapsulated with the encapsulating resin 115 to function as an inner lead 117. The encapsulating resin 115 is composed of a resin composition that contains substantially no halogen. Further, an exposed portion of the Al pad 107 provided in the semiconductor chip 102 is electrically connected to the inner lead 117 via the AuPd wire 111.
摘要翻译：提出了在较高温度下的操作中，接合线和电极焊盘之间的接合区域的可靠性得到改善。半导体器件100包括设置在引线框架121上的半导体芯片102，其被封装树脂115封装。引线框架119设置在引线框架121的两侧。引线框架119的一部分被封装在封装树脂115用作内引线117.封装树脂115由基本上不含卤素的树脂组合物构成。此外，设置在半导体芯片102中的Al焊盘107的露出部分经由AuPd布线111电连接到内引线117。

2. 发明申请

US20060186553A1 Semiconductor device 有权
公开(公告)号：US20060186553A1
公开(公告)日：2006-08-24
申请号：US11354124
申请日：2006-02-15
申请人： Mitsuru Ohta , Tomoki Kato
发明人： Mitsuru Ohta , Tomoki Kato
IPC分类号： H01L23/48 , H01L21/44
CPC分类号： H01L24/48 , H01L23/293 , H01L23/3171 , H01L24/05 , H01L24/45 , H01L24/85 , H01L2224/02166 , H01L2224/04042 , H01L2224/05624 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/45164 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48453 , H01L2224/48465 , H01L2224/48507 , H01L2224/48624 , H01L2224/73265 , H01L2924/00011 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01202 , H01L2924/10253 , H01L2924/15311 , H01L2924/181 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/013 , H01L2924/20757 , H01L2924/00015 , H01L2924/00013 , H01L2924/00012 , H01L2924/01049 , H01L2924/01006
摘要： An improved reliability of a junction region between a bonding wire and an electrode pad in an operation at higher temperature is presented. A semiconductor device 100 includes a semiconductor chip 102 provided on a lead frame 121, which are encapsulated with an encapsulating resin 115. Lead frames 119 are provided in both sides of the lead frame 121. A portion of the lead frame 119 is encapsulated with the encapsulating resin 115 to function as an inner lead 117. The encapsulating resin 115 is composed of a resin composition that contains substantially no halogen. Further, an exposed portion of the Al pad 107 provided in the semiconductor chip 102 is electrically connected to the inner lead 117 via the AuPd wire 111.

3. 发明授权

US08044521B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US08044521B2
公开(公告)日：2011-10-25
申请号：US12379178
申请日：2009-02-13
申请人： Mitsuru Ohta , Tomoki Kato
发明人： Mitsuru Ohta , Tomoki Kato
IPC分类号： H01L21/48
CPC分类号： H01L24/48 , H01L23/293 , H01L23/3171 , H01L24/05 , H01L24/45 , H01L24/85 , H01L2224/02166 , H01L2224/04042 , H01L2224/05624 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/45164 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48453 , H01L2224/48465 , H01L2224/48507 , H01L2224/48624 , H01L2224/73265 , H01L2924/00011 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01202 , H01L2924/10253 , H01L2924/15311 , H01L2924/181 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/013 , H01L2924/20757 , H01L2924/00015 , H01L2924/00013 , H01L2924/00012 , H01L2924/01049 , H01L2924/01006
摘要： An improved reliability of a junction region between a bonding wire and an electrode pad in an operation at higher temperature is presented. A semiconductor device includes a semiconductor chip provided on a lead frame, which are encapsulated with an encapsulating resin. Lead frames are provided in both sides of the lead frame. A portion of the lead frame is encapsulated with the encapsulating resin to function as an inner lead. The encapsulating resin is composed of a resin composition that contains substantially no halogen. Further, an exposed portion of the Al pad provided in the semiconductor chip is electrically connected to the inner lead via the AuPd wire.
摘要翻译：提出了在较高温度下的操作中，接合线和电极焊盘之间的接合区域的可靠性得到改善。半导体器件包括设置在引线框架上的半导体芯片，其被封装树脂封装。引线框架设置在引线框架的两侧。引线框架的一部分用封装树脂封装起到内引线的作用。封装树脂由基本上不含卤素的树脂组合物组成。此外，设置在半导体芯片中的Al焊盘的暴露部分经由AuPd线电连接到内引线。

4. 发明申请

US20090152729A1 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US20090152729A1
公开(公告)日：2009-06-18
申请号：US12379178
申请日：2009-02-13
申请人： Mitsuru Ohta , Tomoki Kato
发明人： Mitsuru Ohta , Tomoki Kato
IPC分类号： H01L23/52 , H01L21/50
CPC分类号： H01L24/48 , H01L23/293 , H01L23/3171 , H01L24/05 , H01L24/45 , H01L24/85 , H01L2224/02166 , H01L2224/04042 , H01L2224/05624 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/45164 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48453 , H01L2224/48465 , H01L2224/48507 , H01L2224/48624 , H01L2224/73265 , H01L2924/00011 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01202 , H01L2924/10253 , H01L2924/15311 , H01L2924/181 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/013 , H01L2924/20757 , H01L2924/00015 , H01L2924/00013 , H01L2924/00012 , H01L2924/01049 , H01L2924/01006
摘要： An improved reliability of a junction region between a bonding wire and an electrode pad in an operation at higher temperature is presented. A semiconductor device includes a semiconductor chip provided on a lead frame, which are encapsulated with an encapsulating resin. Lead frames are provided in both sides of the lead frame. A portion of the lead frame is encapsulated with the encapsulating resin to function as an inner lead. The encapsulating resin is composed of a resin composition that contains substantially no halogen. Further, an exposed portion of the Al pad provided in the semiconductor chip is electrically connected to the inner lead via the AuPd wire.
摘要翻译：提出了在较高温度下的操作中，接合线和电极焊盘之间的接合区域的可靠性得到改善。半导体器件包括设置在引线框架上的半导体芯片，其被封装树脂封装。引线框架设置在引线框架的两侧。引线框架的一部分用封装树脂封装起到内引线的作用。封装树脂由基本上不含卤素的树脂组合物组成。此外，设置在半导体芯片中的Al焊盘的暴露部分经由AuPd线电连接到内引线。

5. 发明授权

US08587133B2 Semiconductor device 有权
公开(公告)号：US08587133B2
公开(公告)日：2013-11-19
申请号：US13222564
申请日：2011-08-31
申请人： Mitsuru Ohta , Tomoki Kato
发明人： Mitsuru Ohta , Tomoki Kato
IPC分类号： H01L21/02
CPC分类号： H01L24/48 , H01L23/293 , H01L23/3171 , H01L24/05 , H01L24/45 , H01L24/85 , H01L2224/02166 , H01L2224/04042 , H01L2224/05624 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45139 , H01L2224/45144 , H01L2224/45164 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48453 , H01L2224/48465 , H01L2224/48507 , H01L2224/48624 , H01L2224/73265 , H01L2924/00011 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01202 , H01L2924/10253 , H01L2924/15311 , H01L2924/181 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/20756 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/013 , H01L2924/20757 , H01L2924/00015 , H01L2924/00013 , H01L2924/00012 , H01L2924/01049 , H01L2924/01006
摘要： An improved reliability of a junction region between a bonding wire and an electrode pad in an operation at higher temperature is presented. A semiconductor device includes a semiconductor chip provided on a lead frame, which are encapsulated with an encapsulating resin. Lead frames are provided in both sides of the lead frame. A portion of the lead frame is encapsulated with the encapsulating resin to function as an inner lead. The encapsulating resin is composed of a resin composition that contains substantially no halogen. Further, an exposed portion of the Al pad provided in the semiconductor chip is electrically connected to the inner lead via the AuPd wire.

6. 发明申请

US20080241488A1 Thermally conductive sheet and method of manufacturing the same 有权
标题翻译：导热片及其制造方法
公开(公告)号：US20080241488A1
公开(公告)日：2008-10-02
申请号：US12079399
申请日：2008-03-26
申请人： Mitsuru Ohta , Motoki Ozawa , Yoshiaki Okabayashi
发明人： Mitsuru Ohta , Motoki Ozawa , Yoshiaki Okabayashi
IPC分类号： B32B3/10 , B32B7/02 , B32B37/00
CPC分类号： H01L23/3735 , H01L23/3733 , H01L23/3737 , H01L2224/29499 , H01L2924/0002 , H01L2924/12044 , Y10T156/10 , Y10T428/24802 , Y10T428/24826 , Y10T428/24851 , Y10T428/24893 , Y10T428/24942 , H01L2924/00
摘要： A thermally conductive sheet comprises a thermally conductive polymer layer, an adhesive layer provided on an outer surface of the thermally conductive polymer layer, and a thermal diffusion layer, which is a functional layer provided on the adhesive layer. The thermally conductive polymer layer is formed of a thermally conductive polymer composition containing a polymer matrix and a thermally conductive filler. The coefficient of static friction of the thermally conductive polymer layer is 1.0 or lower. The adhesive layer has an outer shape smaller than that of the thermally conductive polymer layer.
摘要翻译：导热片包括导热聚合物层，设置在导热聚合物层的外表面上的粘合剂层和作为设置在粘合剂层上的功能层的热扩散层。导热聚合物层由含有聚合物基质和导热填料的导热聚合物组合物形成。导热性聚合物层的静摩擦系数为1.0以下。粘合剂层的外形小于导热聚合物层的外形。

7. 发明授权

US07390990B2 Heating device 有权
标题翻译：加热装置
公开(公告)号：US07390990B2
公开(公告)日：2008-06-24
申请号：US11689654
申请日：2007-03-22
申请人： Mitsuru Ohta , Masao Nishioka
发明人： Mitsuru Ohta , Masao Nishioka
IPC分类号： F27D11/00 , H05B3/68
CPC分类号： H05B3/143 , H01L21/67103 , H05B2214/04
摘要： A heating device is provided, including an insulating ceramic base having a heating surface for heating an object. A high frequency electrode is embedded in the insulating ceramic base in the vicinity of the heating surface, and a heating body is embedded in the base in a location that is further from the heating surface than the location of the high frequency electrode. A low resistance ceramic member is provided so as to be exposed to a part of the heating surface of the insulating ceramic base and to be connected to a conductive member inside of the insulating ceramic base. A main component of the material of the low resistance ceramic member is common to that of the insulating ceramic base, and the respective thermal expansion coefficients are equivalent.
摘要翻译：提供一种加热装置，包括具有用于加热物体的加热表面的绝缘陶瓷基座。高频电极埋设在加热面附近的绝缘陶瓷基体中，并且加热体嵌入在比加热面更靠近高频电极的位置的基部。提供低电阻陶瓷部件，以暴露于绝缘陶瓷基体的加热面的一部分，并与绝缘陶瓷基体内部的导电部件连接。低电阻陶瓷元件材料的主要成分与绝缘陶瓷基体的材料相同，各自的热膨胀系数相等。

8. 发明申请

US20070284366A1 Thermally conductive body and method of manufacturing the same 有权
标题翻译：导热体及其制造方法
公开(公告)号：US20070284366A1
公开(公告)日：2007-12-13
申请号：US11810707
申请日：2007-06-07
申请人： Mitsuru Ohta
发明人： Mitsuru Ohta
IPC分类号： H05B3/10
CPC分类号： H01L23/373 , H01L23/3733 , H01L23/3737 , H01L23/433 , H01L24/29 , H01L2224/2929 , H01L2224/29386 , H01L2224/29393 , H01L2224/29499 , H01L2224/32245 , H01L2924/09701 , H01L2924/12042 , H01L2924/00
摘要： The thermally conductive body for use by being placed between a heat generating body and a heat radiating body, in which the body is molded from a thermally conductive polymer composition. The thermally conductive polymer composition contains a polymer matrix and a thermally conductive filler. At least part of the thermally conductive filler is formed in the shape of fibers and oriented in a certain direction. In the body, ends of the thermally conductive filler formed in the shape of fibers are exposed on the outer surface intersecting the direction of the orientation. Protrusions extending along the outer surface are formed thereat. In case, the body is placed between the heat generating body and the heat radiating body so that the outer surface contacts at least one of the heat generating body and the heat radiating body.
摘要翻译：通过放置在发热体和散热体之间使用的导热体，其中主体由导热聚合物组合物成型。导热聚合物组合物含有聚合物基质和导热填料。导热填料的至少一部分形成为纤维的形状并沿一定方向取向。在本体中，形成为纤维形状的导热填料的端部在与取向方向相交的外表面上露出。沿着外表面延伸的突起形成在其上。在这种情况下，主体被放置在发热体和散热体之间，使得外表面接触发热体和散热体中的至少一个。

9. 发明授权

US06791180B2 Ceramic circuit board and power module 有权
标题翻译：陶瓷电路板和电源模块
公开(公告)号：US06791180B2
公开(公告)日：2004-09-14
申请号：US10386325
申请日：2003-03-11
申请人： Yukihiro Kitamura , Takayuki Takahashi , Mitsuru Ohta , Yuji Ogawa
发明人： Yukihiro Kitamura , Takayuki Takahashi , Mitsuru Ohta , Yuji Ogawa
IPC分类号： H01L2312
CPC分类号： H05K1/0271 , C04B37/021 , C04B2237/343 , C04B2237/366 , C04B2237/368 , C04B2237/402 , C04B2237/407 , C04B2237/64 , C04B2237/704 , C04B2237/706 , H01L23/15 , H01L23/3735 , H01L2924/0002 , H01L2924/13055 , H01L2924/3511 , H05K1/0306 , H05K2201/0355 , H05K2201/068 , H05K2201/09018 , H01L2924/00
摘要： In a ceramic circuit board having a ceramic substrate and a metal circuit plate bonded to one surface of the ceramic substrate, assuming that the warpage of the ceramic circuit board is a difference in height between the center and edge of the metal circuit plate and is positive (+) when the circuit board warps so as to be concave on the side of the metal circuit plate, the warpage of the ceramic circuit board is in the range of from −0.1 mm to +0.3 mm when the ceramic circuit board is heated to 350° C., and in the range of from +0.05 mm to +0.6 mm when the temperature of the ceramic circuit board is returned to a room temperature after the ceramic circuit board is heated to 350° C. The initial warpage of the ceramic circuit board is in the range of from +0.05 mm to +0.6 mm.
摘要翻译：在具有陶瓷基板和与陶瓷基板的一个表面接合的金属电路板的陶瓷电路基板中，假设陶瓷电路板的翘曲是金属电路板的中心和边缘之间的高度差，并且是正的（+）当电路板翘曲以在金属电路板的侧面凹陷时，当陶瓷电路板被加热到陶瓷电路板的翘曲范围为-0.1mm至+ 0.3mm时当陶瓷电路板被加热到350℃之后，当陶瓷电路板的温度恢复到室温时，在+0.05mm至+ 0.6mm的范围内。陶瓷的初始翘曲电路板的电压范围为+0.05 mm至+0.6 mm。

10. 发明授权

US5230977A Developer material toner containing inorganic oxide particle coating 失效
标题翻译：含有无机氧化物颗粒涂层的显影剂材料调色剂
公开(公告)号：US5230977A
公开(公告)日：1993-07-27
申请号：US617594
申请日：1990-11-26
申请人： Mitsuru Ohta
发明人： Mitsuru Ohta
IPC分类号： G03G9/08 , G03G9/09 , G03G9/097
CPC分类号： G03G9/09733 , G03G9/0825 , G03G9/0928 , G03G9/09708 , G03G9/09725 , Y10T428/2993
摘要： A developer material toner comprising powdered developer material color-reactable with dye or dye precursor and powdered inorganic oxide covering the surface of the powdered developer material.
摘要翻译：一种显影剂材料调色剂，其包含与染料或染料前体可颜色反应的粉末显影剂材料和覆盖粉状显影剂材料表面的无机氧化物粉末。

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