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1. 发明申请

US20220386466A1 ELECTRONIC COMPONENT 有权
公开(公告)号：US20220386466A1
公开(公告)日：2022-12-01
申请号：US17752896
申请日：2022-05-25
申请人： Murata Manufacturing Co., Ltd.
发明人： Satoshi YOKOMIZO , Shinobu CHIKUMA , Yohei MUKOBATA
IPC分类号： H05K1/18 , H01G4/008 , H01G4/012 , H01G4/12 , H01G4/30
摘要： An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at multilayer body end surfaces and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surfaces and the board side surfaces. One of the board main surfaces is in a vicinity of the electronic element and is joined with one of the multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. A maximum length of the interposer board is smaller than a length of the electronic element. A width of the interposer board is smaller than a width of the electronic element.

2. 发明申请

US20220384100A1 ELECTRONIC COMPONENT 有权
公开(公告)号：US20220384100A1
公开(公告)日：2022-12-01
申请号：US17752902
申请日：2022-05-25
申请人： Murata Manufacturing Co., Ltd.
发明人： Satoshi YOKOMIZO , Shinobu CHIKUMA , Yohei MUKOBATA
IPC分类号： H01G2/06 , H01G4/30 , H01G4/248 , H01G4/232 , H01G4/12 , H01G4/008
摘要： An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at a pair of multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surfaces and the board side surfaces. One of the pair of board main surfaces is located in a vicinity of the electronic element and joined with one of the multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. A solder layer is provided between the electronic element and the interposer board, joins the electronic element with the interposer board, and includes a solder unfilled region.

3. 发明申请

US20210335543A1 MULTILAYER CERAMIC CAPACITOR 有权
公开(公告)号：US20210335543A1
公开(公告)日：2021-10-28
申请号：US17236022
申请日：2021-04-21
申请人： Murata Manufacturing Co., Ltd.
发明人： Satoshi YOKOMIZO
IPC分类号： H01G4/012 , H01G4/30 , H01G4/12 , H01G2/02
摘要： A multilayer ceramic capacitor includes, on a side of a first external electrode in a length direction of an interposer, a first joining electrode on a first surface and a first mounting electrode on a second surface, a first through conductive portion penetrating the interposer, and a first conductive joining agent providing electrical conduction between the first external electrode and the first joining electrode, and includes on a side of a second external electrode, a second joining electrode on the first surface and a second mounting electrode on the second surface, a second through conductive portion penetrating the interposer, and a second conductive joining agent providing electrical conduction between the second external electrode and the second joining electrode. A first joining region joining the first external electrode and the first conductive joining agent extends directly above an end at an upper end of the first through conductive portion, and a second joining region joining the second external electrode and the second conductive joining agent extends directly above an end at an upper end of the second through conductive portion.

4. 发明申请

US20200312554A1 MULTILAYER CERAMIC CAPACITOR 审中-公开
公开(公告)号：US20200312554A1
公开(公告)日：2020-10-01
申请号：US16822065
申请日：2020-03-18
申请人： Murata Manufacturing Co., Ltd.
发明人： Satoshi YOKOMIZO , Toshihiro HARADA
IPC分类号： H01G4/12 , H01G4/012 , H01G4/232
摘要： A multilayer ceramic capacitor includes a laminate and an external electrode. The laminate includes a central layer portion in which first and second internal electrode layers are alternately laminated with a dielectric ceramic layer therebetween, a peripheral layer portion sandwiching the central layer portion in a lamination direction, and a side margin sandwiching the central layer portion and the peripheral layer portion in a width direction. When viewing the laminate and the first external electrode through a cross-section parallel to the width direction and the lamination direction at a central portion in a length direction of the first external electrode, W1>R1 is satisfied and T1>R1 is satisfied.

5. 发明公开

US20240186065A1 ELECTRONIC COMPONENT 审中-公开
公开(公告)号：US20240186065A1
公开(公告)日：2024-06-06
申请号：US18442330
申请日：2024-02-15
申请人： Murata Manufacturing Co., Ltd.
发明人： Satoshi YOKOMIZO , Shinobu CHIKUMA , Yohei MUKOBATA
IPC分类号： H01G2/06 , H01G4/008 , H01G4/12 , H01G4/232 , H01G4/30
CPC分类号： H01G2/065 , H01G4/008 , H01G4/2325 , H01G4/30 , H01G2/06 , H01G4/1227 , H01G4/232
摘要： An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at multilayer body end surfaces of the multilayer body and connected to internal electrode layers. One of the board main surfaces is in a vicinity of the electronic element and joined with a multilayer body main surface in a vicinity of the interposer board. The interposer board is an alumina board. At least one notch is in end regions including a board end surface, a board side surface in a vicinity thereof, a board main surface in a vicinity thereof, ridge portions between the board end surface and the board side surface, between the board end surface and the board main surface, and between the board side surface and the board main surface, and a corner portion between the board end surface, the board side surface, and the board main surface.

6. 发明公开

US20240136122A1 ELECTRONIC COMPONENT 审中-公开
公开(公告)号：US20240136122A1
公开(公告)日：2024-04-25
申请号：US18400401
申请日：2023-12-29
申请人： Murata Manufacturing Co., Ltd.
发明人： Satoshi YOKOMIZO , Shinobu CHIKUMA , Yohei MUKOBATA
IPC分类号： H01G2/06 , H01G4/232 , H01G4/30
CPC分类号： H01G2/06 , H01G4/2325 , H01G4/30 , H01G4/008
摘要： An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes each at a respective one of multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surface and the board side surface. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. The external electrodes each include a first Sn plated layer that covers an outer surface of the interposer board in a vicinity of at least one board end surface.

7. 发明申请

US20220384097A1 ELECTRONIC COMPONENT 有权
公开(公告)号：US20220384097A1
公开(公告)日：2022-12-01
申请号：US17752897
申请日：2022-05-25
申请人： Murata Manufacturing Co., Ltd.
发明人： Satoshi YOKOMIZO , Shinobu CHIKUMA , Yohei MUKOBATA
IPC分类号： H01G2/06 , H01G4/30 , H01G4/248 , H01G4/12 , H01G4/008 , H01G4/232
摘要： An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at a pair of multilayer body end surfaces and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surfaces and the board side surfaces. One of the board main surfaces is in a vicinity of the electronic element and joined with one of the multilayer body main surfaces in a vicinity of the board. The interposer board is an alumina board. The board main surface in the vicinity of the electronic element includes a fired layer thereon in the vicinity of the pair of board end surfaces of the interposer board.

8. 发明申请

US20220108844A1 MULTILAYER CERAMIC CAPACITOR 有权
公开(公告)号：US20220108844A1
公开(公告)日：2022-04-07
申请号：US17489887
申请日：2021-09-30
申请人： Murata Manufacturing Co., Ltd.
发明人： Satoshi YOKOMIZO , Shinobu CHIKUMA , Yohei MUKOBATA
IPC分类号： H01G4/30 , H01G2/06 , H01G4/232
摘要： A multilayer ceramic capacitor includes a capacitor main body including a multilayer body including dielectric layers and internal electrode layers alternately laminated therein, and external electrodes each at one of two end surfaces of the multilayer body and connected to the internal electrode layers, and two interposers on a surface of the capacitor main body, and opposed and spaced apart from each other. The two interposers include a nickel-plated layer and a tin-plated layer on an outer periphery thereof. The two interposers each include a non-plated region without the nickel-plated layer on an end surface at which the two interposers face each other.

9. 发明申请

US20220108841A1 MULTILAYER CERAMIC CAPACITOR 有权
公开(公告)号：US20220108841A1
公开(公告)日：2022-04-07
申请号：US17489876
申请日：2021-09-30
申请人： Murata Manufacturing Co., Ltd.
发明人： Satoshi YOKOMIZO , Shinobu CHIKUMA , Yohei MUKOBATA
IPC分类号： H01G4/30 , H01G2/06 , H01G4/232
摘要： A multilayer ceramic capacitor includes a capacitor main body including a multilayer body including dielectric layers and internal electrode layers alternately laminated, and external electrodes at two end surfaces of the multilayer body and connected to the internal electrode layers, and two interposers on a surface of the capacitor main body in a lamination direction and opposed and spaced apart from each other. The interposers each include a first surface at or adjacent to the capacitor main body, and a second surface parallel or substantially parallel to each other, and the first surface is sloped with respect to the second surface at a predetermined angle approaching the surface of the capacitor main body toward a side at which the two interposers face each other.

10. 发明公开

US20230360857A1 MULTILAYER CERAMIC CAPACITOR 审中-公开
公开(公告)号：US20230360857A1
公开(公告)日：2023-11-09
申请号：US18222513
申请日：2023-07-17
申请人： Murata Manufacturing Co., Ltd.
发明人： Satoshi YOKOMIZO , Shinobu CHIKUMA , Yohei MUKOBATA
IPC分类号： H01G4/30 , H01G2/06 , H01G4/232
CPC分类号： H01G4/30 , H01G2/06 , H01G4/2325
摘要： A multilayer ceramic capacitor includes a capacitor main body including a multilayer body including dielectric layers and internal electrode layers alternately laminated therein, and external electrodes each at one of two end surfaces of the multilayer body and connected to the internal electrode layers, and two interposers on a surface in a lamination direction of the capacitor main body, and opposed and spaced apart from each other in a length direction connecting the two end surfaces. The two interposers each include a first recess portion on an end surface of the interposer opposed to an end surface facing the other interposer, in an area around a middle portion of the interposer in a width direction, and second recess portions on both sides in the width direction of the first recess portion, and each having a thickness of about ±10% of a half of a thickness of the interposer.

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