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1. 发明授权

US09813595B2 Camera module including multilayer base body, image sensor IC, lens unit, peripheral circuit components, and connector element and electronic device including same 有权
公开(公告)号：US09813595B2
公开(公告)日：2017-11-07
申请号：US14840103
申请日：2015-08-31
申请人： Murata Manufacturing Co., Ltd.
发明人： Shigeru Tago , Hirofumi Shinagawa , Jerry Hsieh , Satoshi Sasaki , Jun Sasaki , Nobuo Ikemoto , Yuki Wakabayashi
IPC分类号： H04N5/225
CPC分类号： H04N5/2253 , H04N5/2254 , H04N5/2257
摘要： A camera module includes a multilayer base body including a first mounting portion, a second mounting portion, and a connecting portion. The first mounting portion and the second mounting portion are connected to the connecting portion. A connector element is arranged in the second mounting portion. The first mounting portion includes a cavity, and a penetration hole penetrating from the cavity to one surface of the first mounting portion. An image sensor IC is arranged in the cavity, and the lens unit is arranged on the one surface of the first mounting portion at a location at or near the penetration hole. Peripheral circuit components and conductor patterns are mounted to or incorporated in the first mounting portion.

2. 发明授权

US09774070B2 High-frequency signal line and manufacturing method thereof 有权
公开(公告)号：US09774070B2
公开(公告)日：2017-09-26
申请号：US14537059
申请日：2014-11-10
申请人： Murata Manufacturing Co., Ltd.
发明人： Nobuo Ikemoto , Yuki Wakabayashi , Shigeru Tago
IPC分类号： H01P3/08 , H01P11/00 , H05K1/02 , H05K1/11 , H05K1/14 , H05K3/36 , H01R12/62 , H05K3/00 , H05K3/46 , H01R103/00 , H01R24/50
CPC分类号： H01P3/082 , H01P3/08 , H01P11/003 , H01R12/62 , H01R24/50 , H01R2103/00 , H05K1/0219 , H05K1/0225 , H05K1/024 , H05K1/0242 , H05K1/0253 , H05K1/115 , H05K1/118 , H05K1/147 , H05K3/0052 , H05K3/363 , H05K3/4623 , H05K3/4632 , H05K2201/07 , H05K2201/09154 , H05K2201/0919 , H05K2201/09481 , H05K2201/09527 , H05K2201/096 , H05K2201/09618 , H05K2201/097 , H05K2201/09845 , H05K2201/10037 , H05K2201/10204 , Y10T29/49016
摘要： In a high frequency signal line, a first signal line extends along a first dielectric element assembly, a first reference ground conductor extends along the first signal line, a second signal line is provided in or on the second dielectric element assembly and extends along the second dielectric element assembly, a second reference ground conductor is provided in or on the second dielectric element assembly and extends along the second signal line. A portion of a bottom surface at an end of the first dielectric element assembly and a portion of the top surface at an end of the second dielectric element assembly are joined together such that a joint portion of the first and second dielectric element assemblies includes a corner. The second signal line and the first signal line are electrically coupled together. The first and second reference ground conductors are electrically coupled together.

3. 发明授权

US09437559B2 High-frequency module 有权
标题翻译：高频模块
公开(公告)号：US09437559B2
公开(公告)日：2016-09-06
申请号：US14686922
申请日：2015-04-15
申请人： Murata Manufacturing Co., Ltd.
发明人： Yuki Wakabayashi
IPC分类号： H01L23/58 , H01L23/66 , H05K1/02 , H01L23/538 , H01L25/16 , H04B5/00 , H05K1/11 , H05K1/18 , H01L23/498
CPC分类号： H01L23/66 , H01L23/49822 , H01L23/5384 , H01L25/165 , H01L2223/6616 , H01L2223/6655 , H01L2223/6677 , H01L2224/16225 , H01L2924/1421 , H01L2924/15313 , H01L2924/19105 , H01L2924/3025 , H04B5/0056 , H05K1/0218 , H05K1/0243 , H05K1/0298 , H05K1/11 , H05K1/181 , H05K2201/09354 , H05K2201/09618
摘要： A high-frequency module includes a laminate, a bottom surface electrode, and internal electrodes that provide grounding. The bottom surface electrode is provided on a bottom surface of the laminate. The laminate includes a wiring region through which wiring of a high-frequency circuit passes. The internal electrodes that provide grounding are provided between layers of the laminate and connected to the bottom surface electrode, respectively. The internal electrodes that provide grounding each include a line including ends extending outside of the wiring region along an outer edge of the laminate. The internal electrodes that provide grounding are endlessly continuous with each other when seen in a lamination direction of the laminate.
摘要翻译：高频模块包括层叠体，底面电极和提供接地的内部电极。底面电极设置在层叠体的底面上。层叠体包括高频电路的布线通过的布线区域。提供接地的内部电极分别设置在层压体的层之间并分别连接到底面电极。提供接地的内部电极包括沿着层压体的外边缘延伸到布线区域外侧的端部的线。当层叠体的层叠方向观察时，提供接地的内部电极彼此连续地连续。

4. 发明授权

US09986139B2 Camera module including multilayer base body, image sensor IC, lens unit, peripheral circuit components, and connector element and electronic device including same 有权
公开(公告)号：US09986139B2
公开(公告)日：2018-05-29
申请号：US15722007
申请日：2017-10-02
申请人： Murata Manufacturing Co., Ltd.
发明人： Shigeru Tago , Hirofumi Shinagawa , Jerry Hsieh , Satoshi Sasaki , Jun Sasaki , Nobuo Ikemoto , Yuki Wakabayashi
IPC分类号： H04N5/225
CPC分类号： H04N5/2253 , H04N5/2254 , H04N5/2257
摘要： A camera module includes a multilayer base body including a first mounting portion, a second mounting portion, and a connecting portion. The first mounting portion and the second mounting portion are connected to the connecting portion. A connector element is arranged in the second mounting portion. The first mounting portion includes a cavity, and a penetration hole penetrating from the cavity to one surface of the first mounting portion. An image sensor IC is arranged in the cavity, and the lens unit is arranged on the one surface of the first mounting portion at a location at or near the penetration hole. Peripheral circuit components and conductor patterns are mounted to or incorporated in the first mounting portion.

5. 发明授权

US09854685B2 Electronic component, method for manufacturing the electronic component, and circuit board 有权
公开(公告)号：US09854685B2
公开(公告)日：2017-12-26
申请号：US14838562
申请日：2015-08-28
申请人： Murata Manufacturing Co., Ltd.
发明人： Nobuo Ikemoto , Makoto Osamura , Satoshi Sasaki , Yuki Wakabayashi
IPC分类号： H05K7/10 , H05K7/12 , H05K3/30 , H01L27/146 , H05K1/18 , H05K3/46 , H04N5/225 , H05K1/02 , H05K1/11 , H05K3/32 , H01L23/00 , H05K3/40
CPC分类号： H05K3/301 , H01L24/13 , H01L24/16 , H01L24/81 , H01L27/14618 , H01L2224/13144 , H01L2224/81205 , H01L2224/81444 , H01L2224/81801 , H01L2924/15151 , H01L2924/15153 , H01L2924/15159 , H01L2924/15162 , H01L2924/15787 , H04N5/225 , H04N5/2254 , H04N5/2257 , H05K1/0296 , H05K1/113 , H05K1/181 , H05K1/184 , H05K1/186 , H05K3/328 , H05K3/403 , H05K3/4617 , H05K2201/09036 , H05K2201/09454 , H05K2201/10121 , H05K2201/10151 , H05K2203/0285 , H05K2203/063 , Y10T29/49146 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A camera module includes an image sensor IC including terminal electrodes, and a circuit board on which the image sensor IC is mounted. The circuit board includes mount electrodes to which the terminal electrodes are ultrasonically welded, a flat film member provided with the mount electrodes, and a base member to which the flat film member is bonded. An elastic modulus of the flat film member is higher than that of the base member.

6. 发明授权

US09699908B2 Component-embedded board and communication terminal device 有权
公开(公告)号：US09699908B2
公开(公告)日：2017-07-04
申请号：US14627194
申请日：2015-02-20
申请人： Murata Manufacturing Co., Ltd.
发明人： Takahiro Baba , Yuki Wakabayashi
IPC分类号： H05K1/18 , H01L23/00 , H05K3/46 , H05K1/02 , H05K1/03
CPC分类号： H05K1/183 , H01L24/19 , H01L24/20 , H01L2224/0401 , H01L2224/04105 , H01L2224/16225 , H01L2224/73267 , H01L2924/12042 , H01L2924/1531 , H01L2924/19105 , H05K1/0243 , H05K1/0298 , H05K1/0326 , H05K1/181 , H05K1/186 , H05K3/4617 , H05K2201/0141 , H05K2201/09527 , H05K2201/096 , H05K2203/0278 , H05K2203/063 , H01L2924/00
摘要： A component-embedded board includes a multilayer board obtained by stacking resin layers and an electronic component in the multilayer board having terminal electrodes on at least one principal face. The resin layers include a first resin layer having a space to accommodate the electronic component and at least one first interlayer connector formed by solidifying a conductive paste outside each of at least three sides of a principal face of the electronic component and a second resin layer having second and third interlayer connectors formed by solidifying a conductive paste. At least one second interlayer connector is positioned outside the three sides of the principal face. The third interlayer connectors are joined to the terminal electrodes. The first resin layer and the second resin layer are adjacent to each other in a stacking direction within the multilayer board. The first interlayer connector and the second interlayer connector are joined.

7. 发明授权

US09666352B2 Inductor bridge and electronic device 有权
公开(公告)号：US09666352B2
公开(公告)日：2017-05-30
申请号：US14748615
申请日：2015-06-24
申请人： Murata Manufacturing Co., Ltd.
发明人： Kuniaki Yosui , Noboru Kato , Yuki Wakabayashi , Bunta Okamoto , Naoto Ikeda , Takeshi Kurihara
IPC分类号： H01F27/28 , H01Q9/42 , H01Q1/38 , H01Q1/50 , H03H7/01 , H01F27/40 , H05K1/02 , H05K1/14 , H05K1/16 , H01F27/29 , H05K3/00 , H01F17/00 , H01F27/36 , H04M1/02
CPC分类号： H01F38/14 , H01F1/34 , H01F27/245 , H01F27/2804 , H01F27/2885 , H01F27/29 , H01F27/36 , H01F27/40 , H01F2017/006 , H01F2027/2809 , H01F2027/295 , H01Q1/38 , H01Q1/50 , H01Q9/42 , H03H7/0115 , H03H7/0123 , H03H7/0138 , H03H7/1741 , H04M1/0277 , H05K1/0218 , H05K1/0225 , H05K1/0233 , H05K1/028 , H05K1/147 , H05K1/162 , H05K1/165 , H05K3/0061 , H05K2201/086 , H05K2201/09263 , H05K2201/10098 , H05K2201/10189
摘要： An inductor bridge is provided with a flexible flat plate-shaped element body, a first connector, and a second connector. The element body includes therein an inductor portion. The inductor portion is configured by a spiral conductor pattern. The first connector is provided on the element body and is connected to a first circuit. The second connector is provided on the element body and is connected to a second circuit.

8. 发明授权

US09484612B2 High-frequency signal line and electronic device including the same 有权
标题翻译：高频信号线和电子设备包括相同
公开(公告)号：US09484612B2
公开(公告)日：2016-11-01
申请号：US14532126
申请日：2014-11-04
申请人： Murata Manufacturing Co., Ltd.
发明人： Satoshi Sasaki , Yuki Wakabayashi
IPC分类号： H01P3/08 , H05K1/02 , H05K1/14
CPC分类号： H01P3/082 , H01P3/085 , H01P3/088 , H05K1/0225 , H05K1/0253 , H05K1/028 , H05K1/147 , H05K2201/09263 , H05K2201/09618 , H05K2201/09727
摘要： A high-frequency signal line includes a dielectric body including flexible dielectric sheets laminated in a direction of lamination and also including a first line portion, a second line portion extending along the first line portion, and a third line portion connecting ends in a specified direction of the first and second line portions. In the dielectric body, a signal line extends through the first, second and third line portions, and a first ground conductor and a second ground conductor face the signal line from both sides in the direction of lamination. One or more interlayer connection conductors are pierced in the dielectric sheets to connect the first ground conductor and the second ground conductor. None of the interlayer connection conductors is provided in a portion of the third line portion that is farther in a direction opposite to the specified direction than the signal line when viewed from the direction of lamination.
摘要翻译：高频信号线包括：电介质体，其包括沿层叠方向层叠的柔性电介质片，并且还包括第一线部分，沿着第一线部分延伸的第二线部分和沿指定方向连接端部的第三线部分的第一和第二线部分。在电介质体中，信号线延伸穿过第一，第二和第三线部分，并且第一接地导体和第二接地导体在层叠方向上从两侧面对信号线。在电介质片中刺穿一个或多个层间连接导体，以连接第一接地导体和第二接地导体。当从层叠方向观察时，层间连接导体中没有一个设置在第三线部分的比与信号线相反的方向相反的方向上的部分中。

9. 发明授权

US09167685B2 Circuit board 有权
标题翻译：电路板
公开(公告)号：US09167685B2
公开(公告)日：2015-10-20
申请号：US14634982
申请日：2015-03-02
申请人： Murata Manufacturing Co., Ltd.
发明人： Nobuo Ikemoto , Yuki Wakabayashi
IPC分类号： H05K1/00 , H05K1/02 , H05K3/46 , H05K1/11
CPC分类号： H05K1/0281 , H05K1/115 , H05K3/4691
摘要： A circuit board includes a plate-shaped dielectric body with a first and a second main surface and including a first area not to be bent and a second area to be bent such that the first main surface becomes an outer side, a first reinforcing member located in the first area nearer the first main surface in relation to a center of the second area in a thickness direction and away from the second area, and a second reinforcing member located in the first area nearer the second main surface in relation to the center of the second area and contacting with a border between the first and the second areas. The first main surface curves from an edge of the first reinforcing member closest to the second area, and the second main surface curves from an edge of the second reinforcing member on the border.
摘要翻译：电路板包括具有第一和第二主表面并且包括第一区域不被弯曲的板状电介质体和将第一主表面变成外侧的待弯曲的第二区域，第一加强构件位于所述第一区域相对于所述第二区域的中心在厚度方向上相对于所述第二区域更靠近所述第一主表面;以及第二加强构件，所述第二加强构件相对于所述第二区域的中心位于所述第二主表面第二区域并与第一和第二区域之间的边界接触。第一主表面从最靠近第二区域的第一加强构件的边缘弯曲，并且第二主表面从边界上的第二加强构件的边缘弯曲。

10. 发明授权

US09019048B1 High-frequency signal transmission line and electronic device 有权
标题翻译：高频信号传输线和电子设备
公开(公告)号：US09019048B1
公开(公告)日：2015-04-28
申请号：US14587097
申请日：2014-12-31
申请人： Murata Manufacturing Co., Ltd.
发明人： Kuniaki Yosui , Yuki Wakabayashi , Bunta Okamoto
IPC分类号： H03H7/38 , H01P3/08
CPC分类号： H01P3/08 , H01P1/20363 , H01P3/081 , H01P3/085 , H01P5/028 , H03H7/38 , H05K1/0225 , H05K1/0253 , H05K2201/09272 , H05K2201/09618 , H05K2201/09727
摘要： A high-frequency signal transmission line includes a plate-shaped dielectric element assembly, a linear signal line, and a first ground conductor. The linear signal line is provided at the dielectric element assembly and includes a plurality of thick portions and a plurality of thin portions with a smaller width than the thick portions. The first ground conductor is provided at the dielectric element assembly and positioned on one side in a normal direction to the dielectric element assembly relative to the signal line. The first ground conductor includes a plurality of openings overlapping with the signal line and also includes bridge portions provided between the openings so as to cross the thin portions. The bridge portions cross the thin portion obliquely when viewed in a plan view in the normal direction to the dielectric element assembly.
摘要翻译：高频信号传输线包括板状电介质元件组件，线性信号线和第一接地导体。线性信号线设置在电介质元件组件处，并且包括多个厚部分和多个具有比厚部分更小的宽度的薄部分。第一接地导体设置在电介质元件组件处并且相对于信号线位于电介质元件组件的法向方向的一侧。第一接地导体包括与信号线重叠的多个开口，并且还包括设置在开口之间以跨越薄部分的桥接部分。当在与电介质元件组件的法线方向的平面图中观察时，桥接部分倾斜地交叉。

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