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1. 发明授权

US10476150B2 Wireless communication device 有权
公开(公告)号：US10476150B2
公开(公告)日：2019-11-12
申请号：US15741892
申请日：2016-07-06
申请人： NEC CORPORATION
发明人： Hiroshi Toyao , Keishi Kosaka
IPC分类号： H01Q1/42 , H01Q1/44 , H01Q19/10 , H01Q21/06 , H01Q21/24
摘要： A wireless communication device includes a reflecting plate having a reflecting surface that reflects electromagnetic wave, a radome covering the reflecting plate so as to form an airflow path between the radome and the reflecting surface, and including an air inlet and an air outlet communicating with the airflow path, an array antenna provided on the reflecting surface and inside the airflow path, and including a plurality of antenna elements aligned on the reflecting surface with an interval from each other, and a communication circuit that transmits and receives a wireless signal by exciting the array antenna. The plurality of antenna elements each include an antenna pattern formed on a plate-shaped dielectric substrate extending from the reflecting surface in a direction orthogonal thereto. Dissipation effect of heat from the communication circuit can be improved, by causing air convection in the airflow path in the radome.

2. 发明授权

US10411351B2 Antenna and wireless communication device 有权
公开(公告)号：US10411351B2
公开(公告)日：2019-09-10
申请号：US15551814
申请日：2016-02-01
申请人： NEC CORPORATION
发明人： Tomoya Kaneko , Eiji Hankui , Hiroshi Toyao , Keishi Kosaka
IPC分类号： H01Q5/335 , H01Q1/50 , H01Q1/38 , H01Q1/24 , H04B1/00 , H04B1/40 , H04B1/18
摘要： To provide a compact antenna capable of corresponding to a plurality of frequency bands. In a first frequency characteristic adjustment unit, the susceptance thereof varies according to a frequency of an input signal. A second frequency characteristic adjustment unit is connected to the first frequency characteristic adjustment unit and the reactance thereof varies according to the frequency of the input signal. A third frequency characteristic adjustment unit is connected to the second frequency characteristic adjustment unit, the susceptance thereof varies according to the frequency of the input signal. A feeding unit is configured to input a signal of any frequency in a plurality of different frequencies to the second frequency characteristic adjustment unit. A sign of the reactance of the second frequency characteristic adjustment unit at the frequency of the signal input from the feeding unit is the same as those of the susceptances of the first frequency characteristic adjustment unit and the third frequency characteristic adjustment unit.

3. 发明授权

US09674942B2 Structure, wiring board and electronic device 有权
公开(公告)号：US09674942B2
公开(公告)日：2017-06-06
申请号：US14773090
申请日：2014-02-24
申请人： NEC CORPORATION
发明人： Yoshiaki Kasahara , Hiroshi Toyao
IPC分类号： H04B3/28 , H05K1/02 , H05K1/11
CPC分类号： H05K1/0236 , H05K1/115 , H05K2201/09236
摘要： A structure comprising: a first and a second conductor planes which are arranged in different layers and in a manner to face to each other; a first transmission line (103) which is arranged in a different layer from those of the first conductor plane and of the second conductor plane, faces to the second conductor plane, and has its one end being an open end; a first conductor via (104) which connects the other end of the first transmission line (103) with the first conductor plane; a second transmission line (105) which is formed in the same layer as that of the first transmission line, runs parallel to the first transmission line (103), and has its one end being an open end; and a second conductor via (106) which electrically connects the other end of the second transmission line (105) with either of the first and second conductor planes.

4. 发明授权

US10930989B2 Structural body, laminated structure of structural body, and antenna structure 有权
公开(公告)号：US10930989B2
公开(公告)日：2021-02-23
申请号：US16086094
申请日：2017-03-27
申请人： NEC Corporation
发明人： Takahide Yoshida , Hiroshi Toyao , Eiji Hankui
IPC分类号： H01Q13/10 , H01P3/08 , H01Q1/38
摘要： It has been difficult to suppress electromagnetic wave that propagates within a suspended substrate. The structure according to the present invention is provided with: a first conductor plane and a second conductor plane that are disposed parallel to each other; a dielectric plane that is disposed between the first and second conductor planes via a hollow region so as to be parallel to the first and second conductor planes; a first transmission line disposed on a surface that is of the dielectric plane and that opposes the first conductor plane; and a second transmission line disposed on a surface that is of the dielectric plane and that opposes the second conductor plane, wherein the first transmission line and the second transmission line are electrically connected to each other.

5. 发明授权

US10476172B2 Antenna, antenna array, and wireless communication device 有权
公开(公告)号：US10476172B2
公开(公告)日：2019-11-12
申请号：US15324920
申请日：2015-05-15
申请人： NEC CORPORATION
发明人： Keishi Kosaka , Hiroshi Toyao
IPC分类号： H01Q21/14 , H01Q1/52 , H01Q21/00 , H01Q7/00 , H01Q9/04 , H01Q9/26 , H01Q21/24 , H01Q1/22 , H01Q21/06
摘要： Provided are an antenna, an antenna array, and a wireless communication device with which it is possible to achieve size reduction while suppressing degradation in radiation efficiency. This antenna comprises two antenna elements and a conductor reflection plate. The antenna element includes: a C-shaped conductor which is a substantially C-shaped conductor in which a split part is formed such that a portion of an annular conductor is made discontinuous; and a conductor power feed line that is electrically connected to one of the two parts of the C-shaped conductor that oppose one another across the split part, the conductor power feed line constituting an electric circuit for feeding power to the C-shaped conductor. The two antenna elements are arranged substantially orthogonal to one another such that, when the elements are projected onto the conductor reflection plate, one antenna element and a portion of the other antenna element overlap one another.

6. 发明授权

US09960483B2 Antenna, printed circuit board, and wireless communication device 有权
公开(公告)号：US09960483B2
公开(公告)日：2018-05-01
申请号：US14770132
申请日：2013-12-06
申请人： NEC CORPORATION , NEC Platforms, Ltd.
发明人： Hiroshi Toyao , Jun Uchida
IPC分类号： H04B1/40 , H01Q1/36 , H01Q1/24 , H01Q9/28
CPC分类号： H01Q1/36 , H01Q1/243 , H01Q9/285 , H04B1/40
摘要： An antenna (10) includes: a first radiant element (3) and a second radiant element (4), which are connected to an antenna feeding point (2); a first branch part (5a), one end of which is connected to the first radiant element (3) at a position not corresponding to an end portion of the first radiant element (3); a second branch part (5b), one end of which is connected to the second radiant element (4) at a position not corresponding to an end portion of the second radiant element (4); and a connection element (7), which connects part of the first radiant element (3) and part of the second radiant element (4). A different end of the first branch part (5a) and a different end of the second branch part (5b) face each other and form a capacitor part. The capacitor part is positioned outside the area surrounded by the connection element (7), the first radiant element (3), and the second radiant element (4). Part of the first radiant element (3), part of the second radiant element (4), the first branch part (5a), the second branch part (5b), and the capacitor part form a split ring resonator (8).

7. 发明授权

US09351393B2 Interconnect substrate and electronic device 有权
标题翻译：互连基板和电子设备
公开(公告)号：US09351393B2
公开(公告)日：2016-05-24
申请号：US14630455
申请日：2015-02-24
申请人： NEC Corporation
发明人： Masashi Kawakami , Hiroshi Toyao
IPC分类号： H04B3/28 , H05K1/02 , H01L23/498 , H05K5/00 , H05K1/18 , H01P1/00 , H05K1/16
CPC分类号： H05K1/0216 , H01L23/49822 , H01L2224/16225 , H01L2224/16227 , H01L2924/00014 , H05K1/0224 , H05K1/0236 , H05K1/0243 , H05K1/0298 , H05K1/165 , H05K1/181 , H05K5/0091 , H01L2224/0401
摘要： An interconnect substrate comprising a laminated body, including an electric conductor and an insulator, over which an electronic element is disposed, wherein the laminated body includes a first layer having at least one first conductor separated in an island shape, a first connecting member which is buried in the laminated body in order to electrically connect the electronic element and the first conductor, a second layer having a third conductor which is provided opposite to at least a partial region of the first conductor, a second conductor which is provided opposite to at least one of the first conductor and the third conductor with a layer of the insulator interposed therebetween, and a second connecting member, buried in the laminated body, which electrically connects the second conductor and the first conductor or the third conductor.
摘要翻译：一种互连基板，包括层叠体，包括电导体和绝缘体，电子元件设置在所述层叠体上，其中所述层叠体包括具有岛状分离的至少一个第一导体的第一层，第一连接构件，埋置在层叠体中以便电连接电子元件和第一导体，第二层具有与第一导体的至少部分区域相对设置的第三导体，第二导体至少与第一导体相对设置第一导体和第三导体之一，绝缘体层插入其间;以及第二连接构件，其被埋置在层叠体中，其将第二导体和第一导体或第三导体电连接。

8. 发明申请

US20150173175A1 INTERCONNECT SUBSTRATE AND ELECTRONIC DEVICE 审中-公开
标题翻译：互连基板和电子器件
公开(公告)号：US20150173175A1
公开(公告)日：2015-06-18
申请号：US14630455
申请日：2015-02-24
申请人： NEC Corporation
发明人： Masashi Kawakami , Hiroshi Toyao
IPC分类号： H05K1/02 , H05K1/18
CPC分类号： H05K1/0216 , H01L23/49822 , H01L2224/16225 , H01L2224/16227 , H01L2924/00014 , H05K1/0224 , H05K1/0236 , H05K1/0243 , H05K1/0298 , H05K1/165 , H05K1/181 , H05K5/0091 , H01L2224/0401
摘要： An interconnect substrate comprising a laminated body, including an electric conductor and an insulator, over which an electronic element is disposed, wherein the laminated body includes a first layer having at least one first conductor separated in an island shape, a first connecting member which is buried in the laminated body in order to electrically connect the electronic element and the first conductor, a second layer having a third conductor which is provided opposite to at least a partial region of the first conductor, a second conductor which is provided opposite to at least one of the first conductor and the third conductor with a layer of the insulator interposed therebetween, and a second connecting member, buried in the laminated body, which electrically connects the second conductor and the first conductor or the third conductor.
摘要翻译：一种互连基板，包括层叠体，包括电导体和绝缘体，电子元件设置在所述层叠体上，其中所述层叠体包括具有岛状分离的至少一个第一导体的第一层，第一连接构件，埋置在层叠体中以便电连接电子元件和第一导体，第二层具有与第一导体的至少部分区域相对设置的第三导体，第二导体至少与第一导体相对设置第一导体和第三导体之一，绝缘体层插入其间;以及第二连接构件，其被埋置在层叠体中，其将第二导体和第一导体或第三导体电连接。

9. 发明申请

US20150155845A1 STRUCTURAL BODY AND WIRING BOARD 有权
标题翻译：结构体和接线板
公开(公告)号：US20150155845A1
公开(公告)日：2015-06-04
申请号：US14412311
申请日：2013-03-28
申请人： NEC CORPORATION
发明人： Yoshiaki Kasahara , Hiroshi Toyao
IPC分类号： H03H7/01
CPC分类号： H03H7/0161 , H01P1/2005 , H01P1/203 , H01P3/08 , H01Q15/0066 , H01Q15/008 , H03H7/0115 , H05K1/0236 , H05K1/162 , H05K2201/09254 , H05K2201/09263 , H05K2201/09672 , H05K2201/09727 , H05K2201/09781
摘要： A second conductor plane (102) is formed in a layer different from a layer in which a first conductor plane (101) is formed, and faces the first conductor plane (101). A first transmission line (104) is formed in a layer different from the layers in which the first conductor plane (101) and the second conductor plane (102) are formed, and faces the second conductor plane (102), and one end thereof is an open end. A conductor via (106) connects the other end of the first transmission line (104) and the first conductor plane (101). An insular conductor (112) is connected to a portion of the first transmission line (104) other than a portion thereof at which the transmission line (104) is attached to the conductor via (106), is located in a layer different from the layer in which the second conductor plane (102) is located, and faces the second conductor plane (102).
摘要翻译：第二导体平面（102）形成在与形成第一导体平面（101）的层不同的层中，并且面向第一导体平面（101）。第一传输线（104）形成在与形成第一导体平面（101）和第二导体平面（102）的层不同的层中，并且面向第二导体平面（102），并且其一端是一个开放的结局。导体通孔（106）连接第一传输线（104）的另一端和第一导体平面（101）。绝缘导体（112）连接到第一传输线（104）的除了传输线（104）附接到导体通路（106）的部分之外的部分，位于不同于层，其中第二导体平面（102）所在，并面向第二导体平面（102）。

10. 发明授权

US11095038B2 Polarization control plate 有权
公开(公告)号：US11095038B2
公开(公告)日：2021-08-17
申请号：US16757040
申请日：2017-10-23
申请人： NEC Corporation
发明人： Yoshiaki Kasahara , Eiji Hankui , Hiroshi Toyao , Keishi Kosaka , Mingqi Wu
IPC分类号： H01Q15/12 , H01Q15/00
摘要： The present invention provides a polarization control plate including n layers (n≥4) of overlapping admittance sheets (10-1 to 10-6) each of which includes a plurality of plane unit cells, in which an admittance of a first plane unit cell included in an admittance sheet in a layer a (1≤a≤n) and an admittance of a second plane unit cell being included in an admittance sheet in a layer b (1≤b≤n and b≠a) and overlapping the first plane unit cell are different from each other, and an admittance of the plane unit cell in an x direction and an admittance of the plane unit cell in a y direction are different from each other.

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