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1. 发明申请

US20230125153A1 BONDING SHEET 有权
公开(公告)号：US20230125153A1
公开(公告)日：2023-04-27
申请号：US17910492
申请日：2021-03-05
申请人： NITTO DENKO CORPORATION
发明人： Akiko TANAKA , Yuichiro SHISHIDO , Ayumi NISHIMARU
IPC分类号： B23K35/02 , H05K3/34 , B23K35/26 , C09J7/38 , C09J9/02
摘要： A bonding sheet (X) of the present invention includes a matrix resin, a plurality of solder particles, and a plurality of flux particles, and has a sheet thickness T. In the bonding sheet (X), a particle size D50 of the solder particles is 12 μm or less, a particle size D50 of the flux particles is 30 μm or less, and a ratio of a particle size D90 of the solder particles and a particle size D90 of the flux particles to the sheet thickness T is 0.95 or less.

2. 发明申请

US20170140972A1 LAMINATED BODY AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD 审中-公开
公开(公告)号：US20170140972A1
公开(公告)日：2017-05-18
申请号：US15349154
申请日：2016-11-11
申请人： NITTO DENKO CORPORATION
发明人： Ryuichi KIMURA , Yuichiro SHISHIDO , Naohide TAKAMOTO
IPC分类号： H01L21/683 , H01L23/31 , H01L21/78
CPC分类号： H01L21/6836 , C09J7/22 , C09J2201/622 , C09J2203/326 , C09J2421/00 , C09J2433/00 , H01L21/78 , H01L23/3171 , H01L23/562 , H01L2221/68322 , H01L2221/68327 , H01L2221/68377 , H01L2224/16225
摘要： A laminated body comprising a dicing sheet and a semiconductor backside protective film, in which the dicing sheet comprises a base layer and an adhesive layer arranged over the base layer, the semiconductor backside protective film is arranged over the adhesive layer, the dicing sheet is provided with a property such that application of heat thereto causes contraction thereof, and with a property such that heat treatment thereof for one minute at 100° C. causes a second length in an MD direction following heat treatment to be not greater than 95% when expressed as a percentage such that a first length in the MD direction prior to heat treatment is taken to be 100%.

3. 发明申请

US20140083760A1 METHOD FOR PRODUCTION OF SEALED BODY, FRAME-SHAPED SPACER FOR PRODUCTION OF SEALED BODY, SEALED BODY AND ELECTRONIC INSTRUMENT 审中-公开
标题翻译：用于生产密封体，用于生产密封体，密封体和电子仪器的框形隔板的方法
公开(公告)号：US20140083760A1
公开(公告)日：2014-03-27
申请号：US14025316
申请日：2013-09-12
申请人： NITTO DENKO CORPORATION
发明人： Tsuyoshi TORINARI , Yuichiro SHISHIDO
IPC分类号： H05K5/06
CPC分类号： H05K5/065 , H01L23/3107 , H01L23/4951 , H01L23/49551 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , Y10T156/10 , Y10T428/24273 , H01L2924/00014
摘要： Provided is a method for production of a sealed body which is capable of improving workability and reducing costs owing to resin-sealing in which a mold is not used, while an electronic instrument obtained has no performance failure and the like. The method for production of a sealed body according to the present invention includes: an adherend providing step of providing an adherend on which at least one electronic component is so mounted as to be displaced from a first main surface; a frame-shaped spacer providing step of providing a frame-shaped spacer having an opening formed at a position corresponding to the electronic component; a step of superimposing the frame-shaped spacer and a lead frame so that the electronic component is accommodated in the opening; a first pressure-bonding step of pressure-bonding a sheet-shaped thermosetting resin composition to a second main surface on a side opposite to the first main surface in a state of superimposing the frame-shaped spacer; a frame-shaped spacer removing step of removing the frame-shaped spacer; and a second pressure-bonding step of pressure-bonding a sheet-shaped thermosetting resin composition, which is the same as or different from the sheet-shaped thermosetting resin composition, to the first main surface so as to embed the electronic component.
摘要翻译：本发明提供一种生产密封体的方法，其中所获得的电子仪器不具有性能故障等，其能够提高可加工性并且由于不使用模具的树脂密封而降低成本。根据本发明的密封体的制造方法包括：被粘物提供工序，在该被粘物上设置有至少一个电子部件被安装成从第一主面移位的被粘物; 框架间隔件提供步骤，提供形成在对应于电子部件的位置处的开口的框形间隔件; 将所述框状间隔物和引线框架重叠的步骤，使得所述电子部件容纳在所述开口中; 在叠置框状间隔物的状态下将片状热固性树脂组合物压接在与第一主表面相反的一侧的第二主表面上的第一压接步骤; 移除框状隔离物的框状间隔物除去工序; 以及将与片状热固性树脂组合物相同或不同的片状热固性树脂组合物压接到第一主表面以嵌入电子部件的第二压接步骤。

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