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    • 2. 发明授权
    • Manufacturing method for a thermal head
    • 热头制造方法
    • US08372296B2
    • 2013-02-12
    • US12804954
    • 2010-08-03
    • Noriyoshi ShojiNorimitsu SanbongiToshimitsu MorookaKeitaro Koroishi
    • Noriyoshi ShojiNorimitsu SanbongiToshimitsu MorookaKeitaro Koroishi
    • H01L21/302B41J2/345
    • B41J2/3359Y10T29/49083
    • Provided is a manufacturing method for a thermal head, including: bonding a flat upper substrate in a stacked state onto a flat supporting substrate including a heat-insulating concave portion open to one surface thereof so that the heat-insulating concave portion is closed (bonding step (SA2)); thinning the upper substrate bonded onto the supporting substrate by the bonding step (SA2) (plate thinning step (SA3)); measuring a thickness of the upper substrate thinned by the plate thinning step (SA3) (measurement step (SA4)); deciding a target resistance value of heating resistors based on the thickness of the upper substrate, which is measured by the measurement step (SA4) (decision step (SA5)); and forming, at positions of a surface of the upper substrate thinned by the plate thinning step (SA3), the heating resistors having the target resistance value determined by the decision step (SA5), the positions being opposed to the heat-insulating concave portion (resistor forming step (SA6)). Thus, a high-efficiency thermal head capable of accurately outputting a target heating amount obtained by estimating an amount of heat wasted without being used is easily manufactured without using a special apparatus.
    • 本发明提供一种热敏头的制造方法,其特征在于,包括:将层叠状态的平坦的上部基板接合在具有向其一个表面开口的绝热凹部的平坦的支撑基板上,使得所述绝热凹部闭合(接合 步骤(SA2)); 通过接合步骤(SA2)(板薄化步骤(SA3))使结合到支撑衬底上的上衬底变薄; 测量通过板薄化步骤(SA3)变薄的上基板的厚度(测量步骤(SA4)); 基于通过测量步骤(SA4)测量的上基板的厚度(判定步骤(SA5)),确定加热电阻器的目标电阻值; 在由所述薄板稀化工序(SA3)变薄的所述上基板的表面的位置处,形成由所述判定工序(SA5)决定的所述目标电阻值的所述加热电阻体,与所述绝热凹部 (电阻形成工序(SA6))。 因此,在不使用特殊装置的情况下,容易制造能够精确地输出通过估计不使用而浪费的热量而获得的目标加热量的高效热头。
    • 3. 发明授权
    • Thermal head and printer
    • 热敏头和打印机
    • US08289354B2
    • 2012-10-16
    • US12807854
    • 2010-09-15
    • Toshimitsu MorookaKeitaro KoroishiNoriyoshi ShojiNorimitsu Sanbongi
    • Toshimitsu MorookaKeitaro KoroishiNoriyoshi ShojiNorimitsu Sanbongi
    • B41J2/335
    • B41J2/3355B41J2/33585
    • Provided are a thermal head that has a cavity portion at a position corresponding to heating resistors and is capable of improving thermal efficiency while ensuring strength of the cavity portion, and a printer including the thermal head. The thermal head (1) includes: a supporting substrate (3) including a concave portion (2) in a surface thereof; an upper substrate (5) bonded in a stacked state to the surface of the supporting substrate (3); and a heating resistor (7) provided at a position, which corresponds to the concave portion (2), of a surface of the upper substrate (5), in which a centerline average roughness of at least a region of a back surface of the upper substrate (5) is set to be less than 5 nm, the region being opposed to the concave portion (2).
    • 提供一种热敏头,其在对应于加热电阻器的位置处具有空腔部分,并且能够在确保空腔部分的强度的同时提高热效率,以及包括热敏头的打印机。 热敏头(1)包括:在其表面包括凹部(2)的支撑基板(3) 将上层基板(5)以堆叠状态接合到所述支撑基板(3)的表面; 以及设置在上基板(5)的表面的与凹部(2)对应的位置处的加热电阻器(7),其中,所述上基板(5)的背面的至少一个区域的中心线平均粗糙度 上基板(5)被设定为小于5nm,该区域与凹部(2)相对。
    • 6. 发明申请
    • Method of manufacturing thermal head
    • 制造热头的方法
    • US20120073122A1
    • 2012-03-29
    • US13200250
    • 2011-09-21
    • Keitaro KoroishiNoriyoshi ShojiNorimitsu SanbongiToshimitsu Morooka
    • Keitaro KoroishiNoriyoshi ShojiNorimitsu SanbongiToshimitsu Morooka
    • H01C17/00
    • H01C17/065B41J2/335B41J2/33585B41J2/3359
    • A method of manufacturing a thermal head, comprising: forming a concave portion opened in one surface of at least one of a support substrate and an upper substrate to be disposed on the support substrate in a stacked state, the support substrate and the upper substrate each being of a plate shape; measuring a width dimension of the concave portion; bonding the support substrate and the upper substrate to each other in the stacked state so as to close an opening of the concave portion; forming a heating resistor on a surface of the upper substrate bonded onto the support substrate, in a region opposed to the concave portion; and forming a protective film for covering and protecting the heating resistor on the upper substrate, at a thickness which is set based on the width dimension of the concave portion and a thickness dimension of the upper substrate.
    • 一种热敏头的制造方法,其特征在于,包括:在层叠状态下形成在支撑基板上设置在支撑基板和上基板中的至少一个的一个面的开口部的凹部,所述支撑基板和所述上基板各自 是板状; 测量凹部的宽度尺寸; 将支撑基板和上基板以堆叠状态彼此接合,以封闭凹部的开口; 在与所述凹部对置的区域中,在所述上基板的与所述支撑基板接合的表面上形成发热电阻体; 并且形成用于覆盖和保护上基板上的加热电阻器的保护膜,其厚度基于凹部的宽度尺寸和上基板的厚度尺寸设定。
    • 9. 发明申请
    • Thermal head and manufacturing method for the thermal head
    • 热敏头及其制造方法
    • US20110032320A1
    • 2011-02-10
    • US12804955
    • 2010-08-03
    • Noriyoshi ShojiNorimitsu SanbongiToshimitsu MorookaKeitaro Koroishi
    • Noriyoshi ShojiNorimitsu SanbongiToshimitsu MorookaKeitaro Koroishi
    • B41J2/34H01L21/00
    • B41J2/335B41J2/33585
    • Provided is a thermal head (1) including: a substrate body (12) constituted through bonding a flat supporting substrate (13) and a flat upper substrate (11), which are made of a glass material onto each other in a stacked state; a heating resistor (14) formed on a surface of the upper substrate (11); and a protective film (18) that partially covers the surface of the upper substrate (11) including the heating resistor (14) and protects the heating resistor (14), in which a heat-insulating concave portion (32) and thickness-measuring concave portions (34), which are open to a bonding surface between the supporting substrate and the upper substrate (11) and form cavities are provided in the supporting substrate (13), the heat-insulating concave portion (32) is formed at a position opposed to the heating resistor (14), and the thickness-measuring concave portions (34) is formed in a region that is prevented from being covered with the protective film (18). Thus, the thickness of the upper substrate is easily measured without decomposing the thermal head.
    • 本发明提供一种热敏头(1),其特征在于,包括:基板主体(12),其通过将平坦的支撑基板(13)和平坦的上基板(11)以层叠的状态彼此结合而形成; 形成在所述上基板(11)的表面上的加热电阻(14); 以及保护膜(18),其部分地覆盖包括所述加热电阻器(14)的所述上基板(11)的表面,并且保护所述加热电阻器(14),其中,绝热凹部(32)和厚度测量 在支撑基板(13)上设置有在支撑基板和上基板(11)之间的接合面开口并形成空腔的凹部(34),隔热凹部(32)形成在 位于与发热电阻体(14)相对的位置,厚度测定凹部(34)形成在防止被保护膜(18)覆盖的区域。 因此,容易测量上基板的厚度,而不会使热敏头分解。