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1. 发明授权

US09196606B2 Bonding transistor wafer to LED wafer to form active LED modules 有权
标题翻译：将晶体管晶圆连接到LED晶圆上，形成有源LED模块
公开(公告)号：US09196606B2
公开(公告)日：2015-11-24
申请号：US14207047
申请日：2014-03-12
申请人： Nthdegree Technologies Worldwide Inc.
发明人： Bradley S. Oraw
IPC分类号： H01L29/15 , H01L21/00 , H01L25/16 , H01L33/00
CPC分类号： H01L25/167 , H01L33/0079 , H01L2924/0002 , H01L2924/00
摘要： LED modules are disclosed having a control MOSFET, or other transistor, in series with an LED. In one embodiment, a MOSFET wafer, containing an array of vertical MOSFETS, is aligned and bonded to an LED wafer, containing a corresponding array of vertical LEDs, and singulated to form thousands of active 3-terminal LED modules with the same footprint as a single LED. Despite the different forward voltages of red, green, and blue LEDs, RGB modules may be connected in parallel and their control voltages staggered at 60 Hz or greater to generate a single perceived color, such as white. The RGB modules may be connected in a panel for general illumination or for a color display.
摘要翻译：公开了具有与LED串联的控制MOSFET或其它晶体管的LED模块。在一个实施例中，包含垂直MOSFETS阵列的MOSFET晶片被对准并结合到包含相应阵列的垂直LED的LED晶片上，并被单个化以形成数千个具有相同占空比的有源3端子LED模块单个LED。尽管红色，绿色和蓝色LED的正向电压不同，但是RGB模块可能并联连接，并且其控制电压以60Hz或更大的方式交错，以产生单个感知颜色，例如白色。 RGB模块可以连接在用于一般照明或彩色显示的面板中。

2. 发明授权

US09572222B2 Active LED module having integrated limiter 有权
标题翻译：有源LED模块具有集成限幅器
公开(公告)号：US09572222B2
公开(公告)日：2017-02-14
申请号：US14837934
申请日：2015-08-27
申请人： Nthdegree Technologies Worldwide Inc.
发明人： Bradley S. Oraw
IPC分类号： H01L33/32 , H05B33/08 , H01L33/00 , H01L27/15 , H01L23/00
CPC分类号： H05B33/0857 , H01L24/24 , H01L24/82 , H01L27/15 , H01L33/0041 , H01L2224/24137 , H01L2224/32225 , H01L2224/73267 , H01L2924/10272 , H01L2924/1033 , H01L2924/12035 , H01L2924/12041 , H01L2924/12042 , H01L2924/1301 , H01L2924/13033 , H01L2924/1305 , H01L2924/13055 , H01L2924/13062 , H01L2924/13063 , H01L2924/13064 , H01L2924/13091 , H05B33/083 , H01L2924/00
摘要： LED modules are disclosed having a control MOSFET, or other transistor, in series with an LED. In one embodiment, a MOSFET wafer is bonded to an LED wafer and singulated to form thousands of active 3-terminal LED modules with the same footprint as a single LED. Despite the different forward voltages of red, green, and blue LEDs, RGB modules may be connected in parallel and their control voltages staggered at 60 Hz or greater to generate a single perceived color, such as white. The RGB modules may be connected in a panel for general illumination or for a color display. A single dielectric layer in a panel may encapsulate all the RGB modules to form a compact and inexpensive panel. Various addressing techniques are described for both a color display and a lighting panel. Various circuits are described for reducing the sensitivity of the LED to variations in input voltage.
摘要翻译：公开了具有与LED串联的控制MOSFET或其它晶体管的LED模块。在一个实施例中，MOSFET晶片被结合到LED晶片并且被单片化以形成具有与单个LED相同的占空比的数千个有源3端子LED模块。尽管红色，绿色和蓝色LED的正向电压不同，但是RGB模块可能并联连接，并且其控制电压以60Hz或更大的方式交错，以产生单个感知颜色，例如白色。 RGB模块可以连接在用于一般照明或彩色显示的面板中。面板中的单个电介质层可以封装所有的RGB模块以形成紧凑且廉价的面板。对于彩色显示器和照明面板都描述了各种寻址技术。描述了各种电路，用于降低LED对输入电压变化的灵敏度。

3. 发明申请

US20150373809A1 FULL COLOR LED MODULE HAVING INTEGRATED DRIVER TRANSISTORS 有权
标题翻译：具有集成驱动器晶体管的全彩LED模块
公开(公告)号：US20150373809A1
公开(公告)日：2015-12-24
申请号：US14838011
申请日：2015-08-27
申请人： Nthdegree Technologies Worldwide Inc.
发明人： Bradley S. Oraw
IPC分类号： H05B33/08
CPC分类号： H05B33/0857 , H01L24/24 , H01L24/82 , H01L27/15 , H01L33/0041 , H01L2224/24137 , H01L2224/32225 , H01L2224/73267 , H01L2924/10272 , H01L2924/1033 , H01L2924/12035 , H01L2924/12041 , H01L2924/12042 , H01L2924/1301 , H01L2924/13033 , H01L2924/1305 , H01L2924/13055 , H01L2924/13062 , H01L2924/13063 , H01L2924/13064 , H01L2924/13091 , H05B33/083 , H01L2924/00
摘要： LED modules are disclosed having a control MOSFET, or other transistor, in series with an LED. In one embodiment, a MOSFET wafer is bonded to an LED wafer and singulated to form thousands of active 3-terminal LED modules with the same footprint as a single LED. Despite the different forward voltages of red, green, and blue LEDs, RGB modules may be connected in parallel and their control voltages staggered at 60 Hz or greater to generate a single perceived color, such as white. The RGB modules may be connected in a panel for general illumination or for a color display. A single dielectric layer in a panel may encapsulate all the RGB modules to form a compact and inexpensive panel. Various addressing techniques are described for both a color display and a lighting panel. Various circuits are described for reducing the sensitivity of the LED to variations in input voltage.
摘要翻译：公开了具有与LED串联的控制MOSFET或其它晶体管的LED模块。在一个实施例中，MOSFET晶片被结合到LED晶片并且被单片化以形成具有与单个LED相同的占空比的数千个有源3端子LED模块。尽管红色，绿色和蓝色LED的正向电压不同，但是RGB模块可能并联连接，并且其控制电压以60Hz或更大的方式交错，以产生单个感知颜色，例如白色。 RGB模块可以连接在用于一般照明或彩色显示的面板中。面板中的单个电介质层可以封装所有的RGB模块以形成紧凑且廉价的面板。对于彩色显示器和照明面板都描述了各种寻址技术。描述了各种电路，用于降低LED对输入电压变化的灵敏度。

4. 发明申请

US20140191246A1 BONDING TRANSISTOR WAFER TO LED WAFER TO FORM ACTIVE LED MODULES 有权
标题翻译：将晶体管波形耦合到LED波形，形成有源LED模块
公开(公告)号：US20140191246A1
公开(公告)日：2014-07-10
申请号：US14207047
申请日：2014-03-12
申请人： Nthdegree Technologies Worldwide Inc.
发明人： Bradley S. Oraw
IPC分类号： H01L33/00
CPC分类号： H01L25/167 , H01L33/0079 , H01L2924/0002 , H01L2924/00
摘要： LED modules are disclosed having a control MOSFET, or other transistor, in series with an LED. In one embodiment, a MOSFET wafer, containing an array of vertical MOSFETS, is aligned and bonded to an LED wafer, containing a corresponding array of vertical LEDs, and singulated to form thousands of active 3-terminal LED modules with the same footprint as a single LED. Despite the different forward voltages of red, green, and blue LEDs, RGB modules may be connected in parallel and their control voltages staggered at 60 Hz or greater to generate a single perceived color, such as white. The RGB modules may be connected in a panel for general illumination or for a color display.
摘要翻译：公开了具有与LED串联的控制MOSFET或其它晶体管的LED模块。在一个实施例中，包含垂直MOSFETS阵列的MOSFET晶片被对准并结合到包含相应阵列的垂直LED的LED晶片上，并被单个化以形成数千个具有相同占空比的有源3端子LED模块单个LED。尽管红色，绿色和蓝色LED的正向电压不同，但是RGB模块可能并联连接，并且其控制电压以60Hz或更大的方式交错，以产生单个感知颜色，例如白色。 RGB模块可以连接在用于一般照明或彩色显示的面板中。

5. 发明授权

US11490495B2 NFC-powered LED sticker with integral capacitor 有权
公开(公告)号：US11490495B2
公开(公告)日：2022-11-01
申请号：US16884295
申请日：2020-05-27
申请人： Nthdegree Technologies Worldwide Inc.
发明人： Rodger Whitby , Bradley S. Oraw
IPC分类号： H05B47/19 , H05B45/00 , H05B45/10 , A41D27/20 , G08B5/36 , G09F3/02 , G09F13/04 , H01L25/16
摘要： An LED sticker is disclosed that receives an NFC transmission from a nearby smartphone to energize LEDs in the sticker. A spiral (or loop) antenna is used in the sticker to generate power from the NFC transmission. The NFC signal is at 13.56 MHz, which is the resonant frequency of the NFC antenna circuit in the smartphone. The LED portion is formed by sandwiching pre-formed microscopic LEDs between two conductive layers to connect the LEDs in parallel. The conductive layers form a relatively large integral capacitor that is used to achieve the 13.56 MHz resonant frequency. So no additional capacitor is needed in the circuit to achieve a resonance of 13.56 MHz. This greatly reduces the design requirements of the antenna. The LED sticker may also contain an NFC tag having its own independent loop antenna and NFC chip. Various practical applications of the LED sticker are disclosed.

6. 发明申请

US20180114775A1 ULTRA-THIN DISPLAY USING PRINTED LEDS 审中-公开
公开(公告)号：US20180114775A1
公开(公告)日：2018-04-26
申请号：US15726739
申请日：2017-10-06
申请人： Nthdegree Technologies Worldwide Inc.
发明人： William Johnstone Ray , Mark David Lowenthal , Richard Austin Blanchard , Lixin Zheng , Xiaorong Cai , Bradley S. Oraw
IPC分类号： H01L25/065 , H01L25/16 , H01L33/62 , H01L25/00 , G09G3/32
CPC分类号： H01L25/0655 , G09G3/32 , G09G2320/0626 , H01L25/0753 , H01L25/167 , H01L25/50 , H01L27/15 , H01L33/505 , H01L33/62 , H01L2933/0033 , H01L2933/0066
摘要： Active LEDs have a control transistor in series with an LED and have a top electrode, a bottom electrode, and a control electrode. The active LEDs are microscopic and dispersed in an ink. A substrate has column lines, and the active LEDs are printed at various pixel locations so the bottom electrodes contact the column lines. A hydrophobic mask defines the pixel locations. Due to the printing process, there are different numbers of active LEDs in the various pixel locations. Row lines and control lines contact the top and control electrodes so that the active LEDs in each single pixel location are connected in parallel. If the LEDs emit blue light, red and green phosphors are printed over various pixel locations to create an ultra-thin color display. Any active LED may be addressed using row and column addressing, and the brightness may be controlled using the control lines.

7. 发明授权

US09661716B2 Full color LED module having integrated driver transistors 有权
公开(公告)号：US09661716B2
公开(公告)日：2017-05-23
申请号：US14838011
申请日：2015-08-27
申请人： Nthdegree Technologies Worldwide Inc.
发明人： Bradley S. Oraw
IPC分类号： H01L27/15 , H05B33/08 , H01L33/00 , H01L23/00
CPC分类号： H05B33/0857 , H01L24/24 , H01L24/82 , H01L27/15 , H01L33/0041 , H01L2224/24137 , H01L2224/32225 , H01L2224/73267 , H01L2924/10272 , H01L2924/1033 , H01L2924/12035 , H01L2924/12041 , H01L2924/12042 , H01L2924/1301 , H01L2924/13033 , H01L2924/1305 , H01L2924/13055 , H01L2924/13062 , H01L2924/13063 , H01L2924/13064 , H01L2924/13091 , H05B33/083 , H01L2924/00
摘要： LED modules are disclosed having a control MOSFET, or other transistor, in series with an LED. In one embodiment, a MOSFET wafer is bonded to an LED wafer and singulated to form thousands of active 3-terminal LED modules with the same footprint as a single LED. Despite the different forward voltages of red, green, and blue LEDs, RGB modules may be connected in parallel and their control voltages staggered at 60 Hz or greater to generate a single perceived color, such as white. The RGB modules may be connected in a panel for general illumination or for a color display. A single dielectric layer in a panel may encapsulate all the RGB modules to form a compact and inexpensive panel. Various addressing techniques are described for both a color display and a lighting panel. Various circuits are described for reducing the sensitivity of the LED to variations in input voltage.

8. 发明申请

US20150303177A1 THREE-TERMINAL PRINTED DEVICES INTERCONNECTED AS CIRCUITS 有权
标题翻译：三端印刷设备作为电路互连
公开(公告)号：US20150303177A1
公开(公告)日：2015-10-22
申请号：US14789454
申请日：2015-07-01
申请人： Nthdegree Technologies Worldwide Inc.
发明人： Richard Austin Blanchard , Bradley S. Oraw
IPC分类号： H01L25/07 , H01L21/77
CPC分类号： H01L25/072 , H01L21/6835 , H01L21/77 , H01L21/84 , H01L24/05 , H01L24/06 , H01L24/24 , H01L24/25 , H01L24/32 , H01L24/73 , H01L24/82 , H01L24/92 , H01L24/95 , H01L24/97 , H01L25/0655 , H01L25/0753 , H01L25/50 , H01L27/12 , H01L2221/68327 , H01L2221/68381 , H01L2224/05552 , H01L2224/05555 , H01L2224/06051 , H01L2224/06181 , H01L2224/24137 , H01L2224/25105 , H01L2224/25174 , H01L2224/32225 , H01L2224/73267 , H01L2224/82104 , H01L2224/92244 , H01L2224/95085 , H01L2224/95101 , H01L2224/95115 , H01L2224/95144 , H01L2224/95145 , H01L2924/10253 , H01L2924/12041 , H01L2924/1301 , H01L2924/13034 , H01L2924/1305 , H01L2924/13062 , H01L2924/13091 , H01L2924/00 , H01L2924/00014
摘要： A layer of microscopic, 3-terminal transistors is printed over a first conductor layer so that bottom electrodes of the transistors electrically contact the first conductor layer. A first dielectric layer overlies the first conductor layer, and a second conductor layer over the first dielectric layer contacts intermediate electrodes on the transistors between the bottom electrodes and top electrodes. A second dielectric layer overlies the second conductor layer, and a third conductor layer over the second dielectric layer contacts the top electrodes. The devices are thus electrically connected in parallel by a combination of the first conductor layer, the second conductor layer, and the third conductor layer. Separate groups of the devices may be interconnected to form more complex circuits. The resulting circuit may be a very thin flex-circuit.
摘要翻译：在第一导体层上印刷一层微观的3端子晶体管，使得晶体管的底部电极与第一导体层电接触。第一电介质层覆盖在第一导体层上，第一电介质层上的第二导体层接触底电极和顶电极之间的晶体管上的中间电极。第二电介质层覆盖在第二导体层上，第二电介质层上的第三导体层接触顶电极。因此，这些器件通过第一导体层，第二导体层和第三导体层的组合而并联连接。单独的设备组可以互连以形成更复杂的电路。所得到的电路可能是非常薄的柔性电路。

9. 发明申请

US20140170792A1 FORMING THIN FILM VERTICAL LIGHT EMITTING DIODES 审中-公开
标题翻译：形成薄膜垂直发光二极管
公开(公告)号：US20140170792A1
公开(公告)日：2014-06-19
申请号：US14103464
申请日：2013-12-11
申请人： Nthdegree Technologies Worldwide Inc.
发明人： Bradley S. Oraw
IPC分类号： H01L33/24 , H01L33/08
CPC分类号： H01L33/0079 , H01L33/0095
摘要： A thin film vertical light emitting diode (VLED) structure and process are described. Features of the design include the following: bonding multiple smaller diameter LED wafers to a larger diameter carrier wafer, which reduces the per LED fabrication cost; using thin film techniques to metalize the anode and cathode and using respective annealing steps prior to photolithography patterning of LED structures; enabling the thin film process by semi-permanent bonding techniques which provide thermal and chemical stability, while allowing bond release at an opportune time by thermal, optical, or chemical means; using epitaxial substrate removal techniques to separate the entire LED film from its growth substrate; and patterning various vertical LED devices which can emit light from the n-type side (cathode), p-type side (anode), side wall, or a combination of the surfaces by using mirror layers and electrically conductive and optically transmissive layers.
摘要翻译：描述了薄膜垂直发光二极管（VLED）结构和工艺。该设计的特点包括：将多个较小直径的LED晶片连接到较大直径的载体晶片，从而降低每个LED制造成本; 使用薄膜技术使阳极和阴极金属化，并且在LED结构的光刻图案化之前使用各自的退火步骤; 通过提供热和化学稳定性的半永久粘合技术实现薄膜过程，同时通过热，光学或化学方式在适当的时间允许粘合释放; 使用外延衬底去除技术将整个LED膜与其生长衬底分离; 并且通过使用镜面层和导电和光学透射层来构图可以从n型侧（阴极），p型侧（阳极），侧壁或表面的组合发射光的各种垂直LED器件。

10. 发明授权

US09368549B1 Printed mesh defining pixel areas for printed inorganic LED dies 有权
标题翻译：印刷网格定义印刷无机LED管芯的像素区域
公开(公告)号：US09368549B1
公开(公告)日：2016-06-14
申请号：US14843818
申请日：2015-09-02
申请人： Nthdegree Technologies Worldwide Inc.
发明人： Bradley S. Oraw , Brian D. Ogonowsky
IPC分类号： H01L33/00 , H01L27/15 , H01L33/62 , H01L33/60 , H01L33/50 , H01L33/48 , H01L33/52
CPC分类号： H01L27/156 , H01L25/0753 , H01L33/00 , H01L33/005 , H01L33/486 , H01L33/504 , H01L33/505 , H01L33/507 , H01L33/52 , H01L33/60 , H01L33/62 , H01L2224/24137 , H01L2224/32225 , H01L2224/73267 , H01L2224/82 , H01L2224/92244 , H01L2933/0058 , H01L2933/0066
摘要： Over a flexible substrate are formed column lines for a display. Over the substrate and column lines are formed a reflective hydrophobic mesh defining pixels. Over the mesh and column lines is printed an LED ink containing microscopic LED dies. The LED ink de-wets from the mesh. The ink is then cured to electrically connect the bottom electrodes of the LEDs to the column lines within the openings (cells) of the mesh. A dielectric then encapsulates the LEDs while exposing the top electrodes of the LEDs. Transparent row lines are then formed along the rows of the mesh to electrically contact the top electrodes in each row. The LEDs within any cell can be turned on by address in a pair of row and column lines. Phosphor dots may be printed to over blue-emitting LEDs to create red, green, and blue sub-pixels for a full color display.
摘要翻译：在柔性基板上形成用于显示器的列线。在衬底和柱线上形成了限定像素的反射疏水网眼。在网格和列线上印刷包含微型LED管芯的LED油墨。 LED油墨从网状物中脱湿。然后将油墨固化以将LED的底部电极电连接到网格的开口（单元）内的列线。然后电介质封装LED同时暴露LED的顶部电极。然后沿着网格的行形成透明行线，以与每行中的顶部电极电接触。任何单元格中的LED都可以通过一行行和列线中的地址打开。可以将荧光点打印到发蓝光的LED上以产生用于全色显示的红色，绿色和蓝色子像素。

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