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1. 发明授权

US09423109B2 Display module, display apparatus, and manufacturing methods thereof 有权
标题翻译：显示模块，显示装置及其制造方法
公开(公告)号：US09423109B2
公开(公告)日：2016-08-23
申请号：US13753962
申请日：2013-01-30
申请人： Oki Data Corporation
发明人： Ken-ichi Tanigawa , Takahito Suzuki
IPC分类号： H01J17/48 , F21V21/00 , G03B21/14 , G09F9/00 , H01L51/52 , H01L27/32 , H01L33/54
CPC分类号： F21V21/00 , G03B21/14 , G09F9/00 , H01L27/3288 , H01L33/54 , H01L51/5253 , H01L2251/566 , H01L2924/0002 , H01L2924/00
摘要： A display module includes a substrate, a plurality of light emitting elements provided on the substrate, a bank provided on the substrate at a position separated by a predetermined distance from an outer circumferential edge of a display region on which the plurality of light emitting elements are arranged, the bank being configured to enclose at least a part of the outer circumferential edge of the display region, and an outer circumference protection part provided on the bank and on an outer circumferential region of the bank, the outer circumference protection part being formed of a resin material.
摘要翻译：显示模块包括基板，设置在基板上的多个发光元件，设置在基板上的与多个发光元件在其上的显示区域的外周边缘分开预定距离的位置处的堤岸所述堤被构造成包围所述显示区域的外周缘的至少一部分，以及设置在所述堤坝和所述堤的外周区域上的外周保护部，所述外周保护部由树脂材料。

2. 发明授权

US09064721B2 Semiconductor light emission device, image formation apparatus and image display apparatus 有权
标题翻译：半导体发光装置，图像形成装置以及图像显示装置
公开(公告)号：US09064721B2
公开(公告)日：2015-06-23
申请号：US13686949
申请日：2012-11-28
申请人： Oki Data Corporation
发明人： Shintaro Tanaka , Takahito Suzuki
IPC分类号： H01L29/18 , H01L25/075 , B41J2/45 , H01L23/00 , H01L33/38 , H01L33/62
CPC分类号： H01L27/15 , B41J2/45 , H01L24/18 , H01L24/24 , H01L25/0753 , H01L33/38 , H01L33/62 , H01L2224/73267 , H01L2924/12041 , H01L2924/15747 , H01L2924/15787 , H01L2924/00
摘要： A semiconductor light emission device includes a substrate, and semiconductor light emission elements mounted on the substrate and each including an anode connection pad and a cathode connection pad. At least one of the anode connection pad and the cathode connection pad has a fine shaped portion. An image formation apparatus and an image display apparatus are described using the semiconductor light emission device.
摘要翻译：半导体发光器件包括衬底和安装在衬底上并且各自包括阳极连接焊盘和阴极连接焊盘的半导体发光元件。阳极连接焊盘和阴极连接焊盘中的至少一个具有细小的形状部分。使用半导体发光装置描述图像形成装置和图像显示装置。

3. 发明授权

US08743166B2 Light-emitting device and method of manufacturing the same 有权
标题翻译：发光装置及其制造方法
公开(公告)号：US08743166B2
公开(公告)日：2014-06-03
申请号：US13748675
申请日：2013-01-24
申请人： Oki Data Corporation
发明人： Eisuke Kuroki , Takahito Suzuki , Kenichi Tanigawa
IPC分类号： B41J2/45 , H01L29/18 , H01L33/00
CPC分类号： H01L33/54 , G03G15/04 , G03G15/04054 , H01L25/0753 , H01L27/15 , H01L33/56 , H01L2924/0002 , H01L2924/00
摘要： A light-emitting device includes a substrate; a light-emitting element formed on the substrate; a seal member sealing the light-emitting element, the seal member formed of a transparent dry film resist laminated on the substrate with the light-emitting element interposed therebetween.
摘要翻译：发光装置包括：基板; 形成在所述基板上的发光元件; 密封构件，其密封发光元件，所述密封构件由层叠在所述基板上的透明干膜抗蚀剂形成，所述透明干膜抗蚀剂之间插入有发光元件。

4. 发明授权

US10009501B2 Optical print head, image forming apparatus, and method of manufacturing the optical print head 有权
公开(公告)号：US10009501B2
公开(公告)日：2018-06-26
申请号：US15474116
申请日：2017-03-30
申请人： Oki Data Corporation
发明人： Takahito Suzuki , Manabu Imai , Masamitsu Nagamine
IPC分类号： H04N1/04 , H04N1/028
CPC分类号： H04N1/02845 , H04N2201/0094
摘要： An optical print head for illuminating an image carrier facing the optical print head includes: a substrate on which a light emitting element array is mounted; a lens array for focusing light emitted from the light emitting element array onto the image carrier; a holder holding the substrate and the lens array; and at least one spacer member, disposed on the holder, for maintaining a predetermined distance between the lens array and the image carrier, the at least one spacer member being made of curable resin that is cured under a predetermined condition or fixed to the holder with curable adhesive that is cured under a predetermined condition.

5. 发明授权

US09810816B2 Rod lens array unit, production method of rod lens array unit, LED print head, image sensor head, image forming apparatus, and image reader 有权
公开(公告)号：US09810816B2
公开(公告)日：2017-11-07
申请号：US15048327
申请日：2016-02-19
申请人： Oki Data Corporation
发明人： Takahito Suzuki
IPC分类号： H04N1/024 , H04N1/04 , G02B3/00
CPC分类号： G02B3/0075 , G02B3/0025 , G02B3/005 , H04N1/02445 , H04N1/0312 , H04N2201/0081
摘要： A rod lens array unit includes at least a rod lens array that includes a plurality of rod lenses arranged in a line, each of the rod lenses having an optical axis extending in an optical axis direction, and a pair of side plate parts stacked so as to sandwich the rod lens array. Wherein, end faces of the side plate parts in the optical axis direction of the rod lens array are positioned inside an end face of the rod lens array in the optical axis direction.

6. 发明授权

US09338890B2 Semiconductor device, and image forming apparatus and image reading apparatus using the same 有权
标题翻译：半导体装置，以及使用其的图像形成装置和图像读取装置
公开(公告)号：US09338890B2
公开(公告)日：2016-05-10
申请号：US14724286
申请日：2015-05-28
申请人： Oki Data Corporation
发明人： Takahito Suzuki , Eisuke Kuroki
IPC分类号： H05K1/18
CPC分类号： H05K1/181 , B41J2/447 , H05K2201/09827 , H05K2201/10106 , H05K2201/10522 , H05K2201/2036 , Y02P70/611
摘要： A semiconductor device includes: a printed wiring board; plural semiconductor array elements mounted on the printed wiring board in a row with an adhesive, each of the semiconductor array elements including plural semiconductor elements arranged in a row, the semiconductor array elements including a first semiconductor array element and a second semiconductor array element adjacent to the first semiconductor array element, the first semiconductor array element having a first facing surface, the second semiconductor array element having a second facing surface facing the first facing surface; a first contact prevention member that is made of organic material and disposed to project from the first facing surface; and a second contact prevention member that is made of organic material and disposed to project from the second facing surface. The first and second contact prevention members are disposed to abut each other or face each other with a gap therebetween.
摘要翻译：半导体器件包括：印刷线路板; 多个半导体阵列元件，其安装在具有粘合剂的一排的印刷线路板上，每个半导体阵列元件包括排列成一行的多个半导体元件，所述半导体阵列元件包括与第一半导体阵列元件相邻的第一半导体阵列元件和第二半导体阵列元件所述第一半导体阵列元件，所述第一半导体阵列元件具有第一面对表面，所述第二半导体阵列元件具有面对所述第一相对表面的第二面对表面; 第一接触防止构件，其由有机材料制成并且设置成从所述第一面向表面突出; 以及第二防止接触部件，其由有机材料制成并且设置成从所述第二相对表面突出。第一和第二接触防止构件被设置成彼此邻接或彼此面对地间隔开。

7. 发明授权

US09178115B2 Semiconductor light emitting apparatus, image displaying apparatus, mobile terminal, head-up display apparatus, image projector, head-mounted display apparatus, and image forming apparatus 有权
标题翻译：半导体发光装置，图像显示装置，移动终端，平视显示装置，图像投影仪，头戴式显示装置和图像形成装置
公开(公告)号：US09178115B2
公开(公告)日：2015-11-03
申请号：US13762719
申请日：2013-02-08
申请人： Oki Data Corporation
发明人： Takahito Suzuki , Taishi Kaneto , Satoshi Tanaka , Kenichi Tanigawa
IPC分类号： G09G5/10 , H01L33/36 , H01L25/075 , H01L33/62
CPC分类号： H01L33/36 , H01L24/24 , H01L25/0753 , H01L33/62 , H01L2224/32245 , H01L2224/32257 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2224/48464 , H01L2224/73265 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor light emitting apparatus includes a substrate. A plurality of first electrode wirings are formed on the surface of the substrate. At least one second electrode wiring is formed on the surface of the substrate. A light emitting section is connected between a corresponding one of the plurality of first electrode wirings and the at least one second electrode wiring. The light emitting section includes a plurality of light emitting elements.
摘要翻译：半导体发光装置包括基板。多个第一电极布线形成在基板的表面上。在基板的表面上形成至少一个第二电极布线。发光部分连接在所述多个第一电极布线和所述至少一个第二电极布线中的对应的一个之间。发光部分包括多个发光元件。

8. 发明授权

US10215889B2 Lens unit, lens unit holder, print head, image sensor head, image forming apparatus, image scanner apparatus 有权
公开(公告)号：US10215889B2
公开(公告)日：2019-02-26
申请号：US15654321
申请日：2017-07-19
申请人： Oki Data Corporation
发明人： Takahito Suzuki
IPC分类号： G02B7/02 , G01B3/00 , G02B3/00 , G02B7/00 , G02B13/24
摘要： A lens unit according to an embodiment includes: lens members in each of which lenses are linearly arrayed in a longitudinal direction; at least one light block member between the lens members; engagement sections arranged in the longitudinal direction, each of the engagement sections configured to mutually engage members including the lens members and the light block member and stacked with each other; and clamp members disposed in positions corresponding to at least one of the engagement sections in the longitudinal direction and configured to clamp the stacked members. All the stacked members are fixed with each other at only one portion in the longitudinal direction.

9. 发明授权

US09855766B2 Rod lens array, LED print head, contact image sensor head, image forming apparatus, and image reading apparatus 有权
公开(公告)号：US09855766B2
公开(公告)日：2018-01-02
申请号：US14861417
申请日：2015-09-22
申请人： Oki Data Corporation
发明人： Takahito Suzuki
IPC分类号： B41J2/45 , G02B7/02 , G02B3/06 , G02B3/00 , G02B13/24
CPC分类号： B41J2/451 , G02B3/005 , G02B3/0075 , G02B3/06 , G02B7/028 , G02B13/24
摘要： Provided is a rod lens array that includes: a plurality of lenses; and a pair of side plate sections interposing side surfaces of the respective lenses in between to hold the lenses, and each including a first side plate provided adjacent to the lenses, and a second side plate provided on outer side of the first side plate, and having machinability lower than machinability of the first side plate, and a linear expansion coefficient smaller than linear expansion coefficient of the first side plate.

10. 发明授权

US09614125B2 Composite element chip, a semiconductor device and manufacturing method thereof, a printing head, and an image forming apparatus 有权
公开(公告)号：US09614125B2
公开(公告)日：2017-04-04
申请号：US14673771
申请日：2015-03-30
申请人： Oki Data Corporation
发明人： Taishi Kaneto , Takahito Suzuki
IPC分类号： G03G15/04 , H01L33/24 , H01L25/075 , H01L25/16 , B41J2/45 , H01L27/15
CPC分类号： H01L33/24 , B41J2/45 , G03G15/04054 , H01L25/0753 , H01L25/167 , H01L27/156 , H01L2924/0002 , H01L2924/00
摘要： A composite element chip includes a substrate; and a plurality of semiconductor thin-films disposed on the substrate and arranged in a predetermined direction which is a first direction. Each semiconductor thin-film includes an array of a plurality of light emitting portions which are arranged so that adjacent light emitting portions are displaced from each other by a predetermined distance in a second direction which is perpendicular to the first direction, the plurality of light emitting portions being arranged along an imaginary line. Each semiconductor thin-film has a first end that is parallel to the second direction; and a second end that extends along a pattern in which the plurality of light emitting portions are arranged and is parallel to the imaginary line. A semiconductor device and manufacturing method thereof, a printing head, and an image forming apparatus are also disclosed.

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