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1. 发明授权

US10333277B2 Structure light module using vertical cavity surface emitting laser array 有权
公开(公告)号：US10333277B2
公开(公告)日：2019-06-25
申请号：US15795130
申请日：2017-10-26
申请人： OmniVision Technologies, Inc.
发明人： Tsung-Wei Wan , Wei-Ping Chen
IPC分类号： H01S5/183 , H01L21/02 , H01S3/08
摘要： A structure light module comprises: a VCSEL substrate comprising a VCSEL array comprising a plurality of individual VCSELs; a first spacer disposed on the VCSEL substrate; a wafer level lens comprising a glass substrate and at least a replicated lens on a first surface of the glass substrate disposed on the first spacer; a second spacer disposes on the wafer level lens; a DOE disposed on the second spacer, where a structure light is projected from the DOE on a target surface for 3D imaging.

2. 发明申请

US20180324336A1 CAMERA MODULE HAVING BAFFLE BETWEEN TWO GLASS SUBSTRATES 审中-公开
公开(公告)号：US20180324336A1
公开(公告)日：2018-11-08
申请号：US15585483
申请日：2017-05-03
申请人： OmniVision Technologies, Inc.
发明人： Tsung-Wei Wan , Wei-Ping Chen
IPC分类号： H04N5/225 , G03B17/08 , G02B23/24 , G02B5/20 , G02B13/00 , A61B1/05 , A61B1/00
CPC分类号： H04N5/2254 , A61B1/00096 , A61B1/00186 , A61B1/051 , G02B13/0055 , G02B13/0085 , G02B23/2407 , G02B23/2484 , G03B11/045 , G03B17/08 , H04N5/2257 , H04N2005/2255
摘要： A camera module comprises an image sensor and a lens module disposed on the image sensor. The lens module comprises a top glass structure at top of the lens module. The top glass structure includes a first glass substrate, a second glass substrate, and a baffle disposed immediately between the first and the second glass substrates. The top glass structure is an outermost layer of the camera module. The lens module also comprises a bottom glass substrate at bottom of the lens module. The bottom glass substrate is disposed on the image sensor.

3. 发明授权

US09386203B2 Compact spacer in multi-lens array module 有权
标题翻译：多镜头阵列模块中的紧凑型间隔器
公开(公告)号：US09386203B2
公开(公告)日：2016-07-05
申请号：US14064813
申请日：2013-10-28
申请人： OMNIVISION TECHNOLOGIES, INC.
发明人： Tsung-Wei Wan , Wei-Ping Chen , Jui-Yi Chiu
IPC分类号： H04N5/225 , H01L27/146
CPC分类号： H04N5/2254 , H01L27/14627 , H01L2224/48227 , H04N5/2252
摘要： An apparatus includes an image sensor partitioned into N image sensor regions. The image sensor is attached to a circuit board. A lens array having including N lenses is disposed proximate to the image sensor. Each one of the N lenses is arranged to focus a single image onto a respective one of the N image sensor regions. A spacer structure is stacked between to the lens array and the circuit board to separate the lens array from the image sensor, wherein the spacer structure surrounds a perimeter around all of the N image sensor regions and N lenses such that none of the spacer structure is disposed between any of the N lenses and N image sensor regions of the image sensor.
摘要翻译：一种装置包括分割成N个图像传感器区域的图像传感器。图像传感器连接到电路板。包括N个透镜的透镜阵列设置在图像传感器附近。 N个透镜中的每一个被布置成将单个图像聚焦到N个图像传感器区域中的相应一个上。间隔结构堆叠在透镜阵列和电路板之间以将透镜阵列与图像传感器分离，其中间隔结构围绕所有N个图像传感器区域和N个透镜周围的周边，使得不存在间隔物结构设置在图像传感器的N个透镜和N个图像传感器区域中的任一个之间。

4. 发明授权

US11280988B2 Structure light module using vertical cavity surface emitting laser array and folding optical element 有权
公开(公告)号：US11280988B2
公开(公告)日：2022-03-22
申请号：US16120966
申请日：2018-09-04
申请人： OmniVision Technologies, Inc.
发明人： Wei-Ping Chen , Tsung-Wei Wan , Jau-Jan Deng
IPC分类号： G02B17/02 , G02B27/42 , H01S5/42 , H01S5/00 , G03B35/00
摘要： A structure light module comprises: a VCSEL substrate comprising a VCSEL array comprising a plurality of individual VCSELs; a first spacer disposed on the VCSEL substrate; a first wafer level lens comprising a glass substrate and at least a replicated lens on a first surface of the glass substrate disposed on the first spacer; a FOE disposed on the first wafer level lens; a second spacer disposes on the FOE; a second wafer level lens comprising a glass substrate and at least a replicated lens on a first surface of the glass substrate disposed on the second spacer; a third spacer disposed on the second wafer level lens; a DOE disposed on the third spacer, where a structure light is projected from the DOE on a target surface for 3D imaging.

5. 发明授权

US09902120B2 Wide-angle camera using achromatic doublet prism array and method of manufacturing the same 有权
公开(公告)号：US09902120B2
公开(公告)日：2018-02-27
申请号：US14616925
申请日：2015-02-09
申请人： OmniVision Technologies, Inc.
发明人： Wei-Ping Chen , Jau-Jan Deng , Tsung-Wei Wan , Chuen-Yi Yin
IPC分类号： G02B3/00 , G02B5/04 , G02B13/00 , B29D11/00
CPC分类号： B29D11/0074 , B29K2995/0026 , G02B3/0006 , G02B3/0031 , G02B3/0056 , G02B5/045 , G02B13/006 , G02B13/0065
摘要： A wide-angle camera and fabrication method thereof includes a sensor with a plurality of pixel sub-arrays and an array of optical elements on a first side of a substrate. Each of the optical elements is capable of forming an image from a field of view onto a different one of the pixel sub-arrays. The wide-angle camera also includes an array of achromatic doublet prisms on a second side of the substrate, where each of the achromatic doublet prisms is aligned to provide a viewing angle with a different one of the optical elements. The sensor captures a wide-angle field of view while having a compact format.

6. 发明授权

US09467606B2 Wafer level stepped sensor holder 有权
标题翻译：晶圆级阶式传感器座
公开(公告)号：US09467606B2
公开(公告)日：2016-10-11
申请号：US14301124
申请日：2014-06-10
申请人： OMNIVISION TECHNOLOGIES, INC.
发明人： Tsung-Wei Wan , Jau-Jan Deng , Wei-Ping Chen
IPC分类号： H04N5/225
CPC分类号： H04N5/2254 , H04N5/2257
摘要： An apparatus includes an image sensor that is bonded to a spacer. The spacer has a thinned wall that defines a step and a recess in an interior wall at a first end of the spacer. The image sensor is bonded to the step within the recess of the spacer such that the image sensor is accepted completely within the recess of the spacer. A glass wafer is mounted on a second end of the spacer. A lens is mounted on the glass wafer such that light is to be directed through the lens to the image sensor.
摘要翻译：一种装置包括结合到间隔件的图像传感器。间隔件具有在隔离件的第一端处限定了内壁中的台阶和凹部的变薄的壁。图像传感器被结合到间隔件的凹部内的台阶上，使得图像传感器完全接受在间隔件的凹部内。玻璃晶片安装在间隔件的第二端上。透镜安装在玻璃晶片上，使得光被引导通过透镜到图像传感器。

7. 发明授权

US10437025B2 Wafer-level lens packaging methods, and associated lens assemblies and camera modules 有权
公开(公告)号：US10437025B2
公开(公告)日：2019-10-08
申请号：US14605298
申请日：2015-01-26
申请人： OmniVision Technologies, Inc.
发明人： Tsung-Wei Wan , Wei-Ping Chen , Jui-Yi Chiu , Jau-Jan Deng
IPC分类号： G02B13/00 , B29D11/00 , B29C45/00 , B29C45/14 , B29L11/00
摘要： A method for packaging applies to packaging a plurality of wafer-level lenses. Each wafer-level lens includes (a) a substrate with opposite facing first and second surfaces and (b) a respective lens element on at least one of the first and second surfaces. Each lens element has a lens surface facing away from the substrate. The method includes partially encasing the plurality of wafer-level lenses with a housing material to produce a wafer of packaged wafer-level lenses. In the wafer of packaged wafer-level lenses, the housing material supports each of the plurality of wafer-level lenses by contacting the respective substrate, and the housing is shaped to form a plurality of housings for the plurality of wafer-level lenses, respectively.

8. 发明授权

US09915763B2 Stacked-lens assembly and fabrication method for same 有权
公开(公告)号：US09915763B2
公开(公告)日：2018-03-13
申请号：US14941174
申请日：2015-11-13
申请人： OmniVision Technologies, Inc.
发明人： Wei-Ping Chen , Tsung-Wei Wan
IPC分类号： G02B9/04 , G02B3/00 , B32B37/12 , G02B13/00 , G03B17/12 , H01L27/146
CPC分类号： G02B3/0062 , B32B37/12 , B32B2551/00 , G02B3/0031 , G02B13/0085 , G03B17/12 , H01L27/14627 , H01L27/14632 , H01L27/14643 , H01L27/14685 , H01L27/14687
摘要： A stacked-lens assembly includes a lower substrate and an upper substrate. The lower substrate includes a lower-substrate top surface having thereon a lower element and an inner spacer, the inner spacer at least partially surrounding the lower element. The upper substrate includes an upper-substrate bottom surface opposite the lower-substrate top surface and having thereon an upper element and an outer spacer, the outer spacer (i) being attached to the inner spacer and (ii) at least partially surrounding the upper element. In any cross-section of the stacked-lens assembly parallel to the upper substrate and including both the inner spacer and the outer spacer, the entirety of the inner spacer is within a perimeter of the outer spacer.

9. 发明申请

US20170139086A1 Stacked-Lens Assembly And Fabrication Method For Same 有权
公开(公告)号：US20170139086A1
公开(公告)日：2017-05-18
申请号：US14941174
申请日：2015-11-13
申请人： OmniVision Technologies, Inc.
发明人： Wei-Ping Chen , Tsung-Wei Wan
IPC分类号： G02B3/00 , H01L27/146 , G02B13/00 , B32B37/12 , G03B17/12
CPC分类号： G02B3/0062 , B32B37/12 , B32B2551/00 , G02B3/0031 , G02B13/0085 , G03B17/12 , H01L27/14627 , H01L27/14632 , H01L27/14643 , H01L27/14685 , H01L27/14687
摘要： A stacked-lens assembly includes a lower substrate and an upper substrate. The lower substrate includes a lower-substrate top surface having thereon a lower element and an inner spacer, the inner spacer at least partially surrounding the lower element. The upper substrate includes an upper-substrate bottom surface opposite the lower-substrate top surface and having thereon an upper element and an outer spacer, the outer spacer (i) being attached to the inner spacer and (ii) at least partially surrounding the upper element. In any cross-section of the stacked-lens assembly parallel to the upper substrate and including both the inner spacer and the outer spacer, the entirety of the inner spacer is within a perimeter of the outer spacer.

10. 发明申请

US20170123190A1 Wafer-Level Hybrid Compound Lens And Method For Fabricating Same 有权
公开(公告)号：US20170123190A1
公开(公告)日：2017-05-04
申请号：US14932368
申请日：2015-11-04
申请人： OmniVision Technologies, Inc.
发明人： Tsung-Wei Wan , Wei-Ping Chen
IPC分类号： G02B13/00 , B29D11/00 , G02B1/04
CPC分类号： G02B13/0085 , B29D11/00307 , B29D11/00403 , B29K2995/0029 , G02B1/041 , G02B13/005
摘要： A hybrid compound lens includes a substrate lens and a resin lens. The substrate lens has a non-planar substrate surface surrounded by a flange having a flange surface bordering the non-planar substrate surface and forming an obtuse angle therewith. The resin lens has a non-planar resin surface adjoining the substrate lens along the non-planar substrate surface. A lens wafer includes a substrate wafer and resin lenses. The substrate wafer has a top surface having non-planar surface features each bordered by a planar region of the top surface and forming an obtuse angle therewith. Each resin lens has a non-planar resin surface adjoining the substrate wafer along a non-planar surface feature. A method for fabricating a wafer-level hybrid compound lens includes depositing a resin portion on a non-planar feature of a side of a substrate. The method also includes forming the resin portion into a lens on the non-planar feature.

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