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1. 发明授权

US10811383B2 Apparatus and method for manufacturing plurality of electronic circuits 有权
公开(公告)号：US10811383B2
公开(公告)日：2020-10-20
申请号：US16075829
申请日：2017-02-09
申请人： PRAGMATIC PRINTING LTD.
发明人： Neil Davies , Richard David Price , Stephen Devenport , Stuart Philip Speakman
IPC分类号： H01L23/00
摘要： A method of manufacturing a plurality of electronic circuits is disclosed. Each electronic circuit comprises a respective first portion, comprising a respective group of contact pads, and a respective integrated circuit, IC, comprising a respective group of terminals and mounted on the respective group of contact pads with each terminal in electrical contact with a respective contact pad. The method comprises: providing a first structure comprising the plurality of first portions; providing a second structure comprising the plurality of ICs and a common support arranged to support the plurality of ICs; transferring said ICs from the common support onto a first roller; transferring said ICs from the first roller onto a second roller; and transferring said ICs from the second roller onto the first structure such that each group of terminals is mounted on a respective group of contact pads.

2. 发明授权

US11177145B2 Apparatus and method for manufacturing plurality of electronic circuits 有权
公开(公告)号：US11177145B2
公开(公告)日：2021-11-16
申请号：US16621387
申请日：2018-06-18
申请人： PRAGMATIC PRINTING LTD.
发明人： Neil Davies , Richard Price , Stephen Devenport , Stuart Speakman
IPC分类号： H01L21/67 , H01L25/00
摘要： A method of manufacturing a plurality of electronic circuits is disclosed. Each electronic circuit comprises a respective first portion, comprising a respective group of contact pads, and a respective integrated circuit, IC, comprising a respective group of terminals and mounted on the respective group of contact pads with each terminal in electrical contact with a respective contact pad. The method comprises: providing a first structure comprising the plurality of first portions; providing a second structure comprising the plurality of ICs and a common support arranged to support the plurality of ICs; transferring said ICs from the common support onto a first roller having a removable surface portion; and transferring said ICs from the first roller onto the first structure such that each group of terminals is mounted on a respective group of contact pads.

3. 发明授权

US11406023B2 Methods for manufacturing a plurality of electronic circuits 有权
公开(公告)号：US11406023B2
公开(公告)日：2022-08-02
申请号：US16643642
申请日：2018-08-16
申请人： PRAGMATIC PRINTING LTD.
发明人： Richard Price , Stephen Devenport , Brian Cobb
IPC分类号： H05K3/36 , H05K3/00 , H05K3/32
摘要： The present invention relates to a method and apparatus for manufacturing a plurality of electronic circuits, each electronic circuit comprising a respective flexible first portion, comprising a respective group of contact pads (contacts), and a respective flexible integrated circuit, IC, comprising a respective group of terminals and mounted on the respective group of contact pads with each terminal in electrical contact with a respective contact pad, the method comprising: providing (e.g. manufacturing) a flexible first structure comprising the plurality of first portions; providing (e.g. manufacturing) a second structure comprising the plurality of flexible ICs and a common support arranged to support the plurality of flexible ICs; dispensing an adhesive onto the first structure and/or onto the flexible ICs; transferring said flexible ICs from the common support onto the flexible first structure such that each group of terminals is mounted on (brought into electrical contact with) a respective group of contact pads to form an electronic circuit, providing a heated surface and an opposing surface together having a gap therebetween, transferring the flexible first structure, comprising the electronic circuits, between the heated surface and the opposing surface such that the adhesive is cured by application of heat and pressure from the heated surface and the opposing surface thereby adhering the IC onto the respective first portion.

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