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1. 发明授权

US09035421B2 High quality factor inductor implemented in wafer level packaging (WLP) 有权
标题翻译：在晶圆级封装（WLP）中实现的高品质因数电感器
公开(公告)号：US09035421B2
公开(公告)日：2015-05-19
申请号：US13787219
申请日：2013-03-06
申请人： QUALCOMM Incorporated
发明人： Young K. Song , Yunseo Park , Xiaonan Zhang , Ryan D. Lane , Babak Nejati , Aristotele Hadjichristos , Xiaoming Chen
IPC分类号： H01L27/08 , H01L23/522 , H01L23/00 , H01L23/64 , H01L25/065 , H01L25/07 , H01L25/11
CPC分类号： H01L23/5227 , H01L23/645 , H01L24/02 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L25/0657 , H01L25/074 , H01L25/117 , H01L2224/02375 , H01L2224/0239 , H01L2224/0401 , H01L2224/05569 , H01L2224/131 , H01L2224/13147 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2225/06513 , H01L2225/1023 , H01L2225/1058 , H01L2924/15331 , H01L2924/014 , H01L2924/00014 , H01L2924/01029 , H01L2924/00012
摘要： Some novel features pertain to a first example provides a semiconductor device that includes a printed circuit board (PCB), asset of solder balls and a die. The PCB includes a first metal layer. The set of solder balls is coupled to the PCB. The die is coupled to the PCB through the set of solder balls. The die includes a second metal layer and a third metal layer. The first metal layer of the PCB, the set of solder balls, the second and third metal layers of the die are configured to operate as an inductor in the semiconductor device. In some implementations, the die further includes a passivation layer. The passivation layer is positioned between the second metal layer and the third metal layer. In some implementations, the second metal layer is positioned between the passivation layer and the set of solder balls.
摘要翻译：一些新颖特征涉及第一示例，提供了包括印刷电路板（PCB），焊球和裸片的资产的半导体器件。 PCB包括第一金属层。该组焊球与PCB相连。模具通过一组焊球耦合到PCB。模具包括第二金属层和第三金属层。 PCB的第一金属层，焊球集合，管芯的第二和第三金属层被配置为在半导体器件中作为电感器工作。在一些实施方式中，芯片还包括钝化层。钝化层位于第二金属层和第三金属层之间。在一些实施方案中，第二金属层位于钝化层和一组焊球之间。

2. 发明授权

US10262786B2 Stepped-width co-spiral inductor structure 有权
公开(公告)号：US10262786B2
公开(公告)日：2019-04-16
申请号：US15288967
申请日：2016-10-07
申请人： QUALCOMM Incorporated
发明人： Daeik Daniel Kim , Babak Nejati , Husnu Ahmet Masaracioglu
IPC分类号： H03H7/01 , H03H7/46 , H01F17/00 , H01F27/28 , H01F41/04 , H01L49/02 , H01L23/498 , H01L23/538 , H01L23/522 , H03H1/00
摘要： A stepped-width, co-spiral inductor structure includes a first exterior layer having a first exterior width. The stepped-width, co-spiral inductor structure also includes a first interior layer coupled to the first exterior layer. The first interior layer includes a first interior width that is wider than the first exterior width of the first exterior layer. The stepped-width, co-spiral inductor structure further includes a second exterior layer coupled to the first interior layer. The second exterior layer includes a second exterior width that is narrower than the first interior width of the first interior layer.

3. 发明授权

US11380471B2 RF damping structure in inductive device 有权
公开(公告)号：US11380471B2
公开(公告)日：2022-07-05
申请号：US16034653
申请日：2018-07-13
申请人： QUALCOMM Incorporated
发明人： Daniel Daeik Kim , Bonhoon Koo , Babak Nejati
IPC分类号： H01F27/28 , H01F17/02 , H03F1/08 , H01F17/00 , H03F3/19 , H03F3/21
摘要： A spiral inductor includes a spiral trace and a plurality of first projections extending along a first edge of the spiral trace. The spiral inductor may further include a plurality of second projections extending along a second edge of the spiral trace, the second edge being opposite the first edge.

4. 发明授权

US10832848B2 Low DC resistance and high RF resistance power amplifier choke inductor 有权
公开(公告)号：US10832848B2
公开(公告)日：2020-11-10
申请号：US15722446
申请日：2017-10-02
申请人： QUALCOMM Incorporated
发明人： Daeik Daniel Kim , Bonhoon Koo , Babak Nejati
IPC分类号： H01F17/00 , H01F41/04 , H05K1/16 , H01F27/28 , H05K3/46
摘要： A multi-layer spiral inductive array includes a first multi-layer spiral inductor with a second layer matching a spiral pattern of a first layer. The multi-layer spiral inductive array also includes a second multi-layer spiral inductor with a third layer matching a spiral pattern of a fourth layer. The second multi-layer spiral inductor is coupled in series with the first multi-layer spiral inductor.

5. 发明授权

US11011461B2 Perpendicular inductors integrated in a substrate 有权
公开(公告)号：US11011461B2
公开(公告)日：2021-05-18
申请号：US16254735
申请日：2019-01-23
申请人： QUALCOMM Incorporated
发明人： Shu Zhang , Daniel Daeik Kim , Chenqian Gan , Bonhoon Koo , Babak Nejati
IPC分类号： H01L23/522 , H01L49/02 , H01F27/28 , H01F41/04 , H01L23/64 , H01F17/02 , H01F17/00 , H01L23/498
摘要： Some features pertain to a substrate, and a first inductor integrated into the substrate. The first inductor includes a plurality of first inductor windings in a first metal layer and a second metal layer. A second inductor is integrated into the substrate. The second inductor includes a first spiral in a third metal layer. The first spiral is located at least partially inside the plurality of first inductor windings, wherein the second inductor is perpendicular to the first inductor.

6. 发明授权

US10978240B2 Inductor with embraced corner capture pad 有权
公开(公告)号：US10978240B2
公开(公告)日：2021-04-13
申请号：US15857478
申请日：2017-12-28
申请人： QUALCOMM Incorporated
发明人： Daeik Daniel Kim , Babak Nejati , Husnu Ahmet Masaracioglu
IPC分类号： H01F27/29 , H01F27/28 , H01F41/04 , H05K1/02 , H01F17/00 , H05K1/16 , H01F5/00 , H04B1/00 , H04B1/40 , H05K1/11 , H05K3/00 , H05K3/42
摘要： A laminate substrate inductor reduces insertion loss and improves isolation while reducing the area for integrating the laminate substrate inductor. The laminate substrate includes a spiral trace. The laminate substrate also includes a first capture pad at a first end of the spiral trace. The first end is located at a corner of the spiral trace. The first capture pad is substantially within a bounding box of the spiral trace. At least a portion of the first capture pad and an outer edge of the spiral trace have a same distance from a ground.

7. 发明申请

US20190189327A1 EMBEDDED VERTICAL INDUCTOR IN LAMINATE STACKED SUBSTRATES 审中-公开
公开(公告)号：US20190189327A1
公开(公告)日：2019-06-20
申请号：US16210594
申请日：2018-12-05
申请人： QUALCOMM Incorporated
发明人： Daniel Daeik Kim , Bonhoon Koo , Babak Nejati
IPC分类号： H01F17/00 , H01F41/04 , H04B1/40
CPC分类号： H01F17/0013 , H01F27/365 , H01F41/041 , H01F2017/002 , H01F2017/008 , H04B1/40
摘要： A vertical inductor structure includes a first laminate substrate forming a first portion of the vertical inductor structure and a second laminate substrate forming a second portion. Each laminate substrate includes a plurality of first traces embedded in a layer of the laminate substrate, a plurality of first vertical columns, and a plurality of second vertical columns. Each first vertical columns is coupled to a first end of a respective first trace, and each second vertical column is coupled to a second end of a respective first trace. The second laminate substrate is mounted on the first laminate substrate such that each first vertical column of the first laminate substrate is coupled to a respective first vertical column of the second laminate substrate, and each second vertical column of the first laminate substrate is coupled to a respective second vertical column of the second laminate substrate.

8. 发明申请

US20150171800A1 TUNABLE LOADLINE 有权
标题翻译：可以加载
公开(公告)号：US20150171800A1
公开(公告)日：2015-06-18
申请号：US14109239
申请日：2013-12-17
申请人： QUALCOMM Incorporated
发明人： Aristotele Hadjichristos , Calogero Davide Presti , Babak Nejati
IPC分类号： H03F1/56 , H03F3/19
CPC分类号： H03F1/565 , H03F3/19 , H03F3/191 , H03F3/195 , H03F3/245 , H03F2200/111 , H03F2200/378 , H03F2200/387 , H03F2200/391 , H03F2200/417 , H03F2200/423
摘要： A tunable loadline is disclosed. In an exemplary embodiment, an apparatus includes an amplifier configured to output an amplified signal having a selected power level and a first impedance network coupled to receive the amplified signal at an input terminal and generate a first output signal having a first power level at a first output terminal. The first impedance network being configured to load the amplified signal to convert the selected power level to the first power level. The apparatus also includes a second impedance network configured to selectively receive the first output signal and generate a second output signal having a second power level at a second output terminal. The second impedance network being configured to combine with the first impedance network to load the amplified signal to convert the selected power level to the second power level.
摘要翻译：公开了一种可调节负载线。在示例性实施例中，一种装置包括：放大器，被配置为输出具有选定功率电平的放大信号和耦合以在输入端接收放大信号的第一阻抗网络，并产生第一功率电平的第一输出信号输出端子。第一阻抗网络被配置为加载放大的信号以将所选择的功率电平转换为第一功率电平。该装置还包括配置成选择性地接收第一输出信号并且在第二输出端产生具有第二功率电平的第二输出信号的第二阻抗网络。第二阻抗网络被配置为与第一阻抗网络组合以加载放大的信号以将所选择的功率电平转换为第二功率电平。

9. 发明授权

US11817239B2 Embedded vertical inductor in laminate stacked substrates 有权
公开(公告)号：US11817239B2
公开(公告)日：2023-11-14
申请号：US16210594
申请日：2018-12-05
申请人： QUALCOMM Incorporated
发明人： Daniel Daeik Kim , Bonhoon Koo , Babak Nejati
IPC分类号： H01F27/36 , H01F17/00 , H01F41/04 , H04B1/40 , H04B1/04
CPC分类号： H01F17/0013 , H01F27/363 , H01F41/041 , H04B1/40 , H01F27/36 , H01F2017/002 , H01F2017/008 , H04B1/04
摘要： A vertical inductor structure includes a first laminate substrate forming a first portion of the vertical inductor structure and a second laminate substrate forming a second portion. Each laminate substrate includes a plurality of first traces embedded in a layer of the laminate substrate, a plurality of first vertical columns, and a plurality of second vertical columns. Each first vertical columns is coupled to a first end of a respective first trace, and each second vertical column is coupled to a second end of a respective first trace. The second laminate substrate is mounted on the first laminate substrate such that each first vertical column of the first laminate substrate is coupled to a respective first vertical column of the second laminate substrate, and each second vertical column of the first laminate substrate is coupled to a respective second vertical column of the second laminate substrate.

10. 发明授权

US10879191B2 Conformal shielding for solder ball array 有权
公开(公告)号：US10879191B2
公开(公告)日：2020-12-29
申请号：US16241958
申请日：2019-01-07
申请人： QUALCOMM Incorporated
发明人： Daniel Daeik Kim , Manuel Aldrete , Babak Nejati
IPC分类号： H01L23/552 , H01L23/00 , H05K1/02 , H01L25/065 , H01L23/538 , H01L25/07 , H01L25/11
CPC分类号： H01L23/552 , H01L23/538 , H01L24/17 , H01L24/49 , H01L25/0652 , H01L25/0657 , H01L25/071 , H01L25/074 , H01L25/112 , H01L25/117 , H05K1/023 , H01L2224/16227 , H01L2924/15311
摘要： An RF/EMI shield has a substrate, a plurality of solder balls on a first side of the substrate, and a plurality of wire-bonds on a periphery of the first side of the substrate to form a shield which can be soldered in a surface mount process directly around components needing shielding. Each of the plurality of wire-bonds has a width selected as a fraction of the wavelength of interest.

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