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    • 9. 发明申请
    • AIR HANDLING SYSTEM
    • 空气处理系统
    • US20100240295A1
    • 2010-09-23
    • US12407825
    • 2009-03-20
    • Salman Akhtar
    • Salman Akhtar
    • F24F13/04
    • F24F1/0007F24F1/00075F24F1/0047F24F2013/0612F24F2013/242
    • An air handling system adapted for mounting in a room of a building includes a double air inductor assembly having a first air inductor unit and a second air inductor unit adjacently arranged with the first air inductor unit. Each of the inductor units includes a plenum having a primary air inlet, a mixing chamber having a plurality of side surfaces with a return air inlet extending through one of the side surfaces and a supply air outlet extending through another of the sides, and a plurality of air nozzles that each span along a central axis between an inlet fluidly connected with the plenum and an outlet fluidly connected with the mixing chamber. The axes of the plurality of air nozzles of the first air inductor unit are arranged approximately parallel to the axes of the plurality of air nozzles of the second air inductor unit.
    • 适于安装在建筑物的房间中的空气处理系统包括具有第一空气感应器单元和与第一空气感应器单元相邻布置的第二空气感应单元的双重空气感应器组件。 每个电感器单元包括具有主空气入口的增压室,具有多个侧表面的混合室,具有延伸穿过其中一个侧表面的回流空气入口和延伸穿过另一侧的供气口;以及多个 每个空气喷嘴沿着中心轴线在与气室间流体连接的入口和与混合室流体连接的出口之间跨越。 第一空气电感器单元的多个空气喷嘴的轴线大致平行于第二空气电感器单元的多个空气喷嘴的轴线。
    • 10. 发明申请
    • Circuit board soldering method utilizing thermal mass compensating pallets
    • 利用热质量补偿托盘的电路板焊接方法
    • US20060102703A1
    • 2006-05-18
    • US10987391
    • 2004-11-12
    • Salman AkhtarScott Darrow
    • Salman AkhtarScott Darrow
    • B23K1/08
    • H05K3/3494B23K37/0408B23K2101/42H05K2203/0165
    • A pallet for supporting a circuit board during a soldering process. The pallet has a thermal mass that is varied to offset a thermal mass of the circuit board so as to minimize the difference in temperatures across the circuit board during the soldering process. The thermal mass of the pallet is varied by build up or removal of material of the pallet in selected areas, and/or through the use of materials having varying thermal properties. In addition, the total thermal mass of the pallet and the circuit board is maintained to stay within a set range in order to allow a soldering process to accommodate more than one type of circuit board with minimal to no adjustments in the process settings between boards. Construction of the pallet is preferably performed in an iterative process wherein temperature variations in the circuit board are measured during heating cycles and the pallet is modified in response to the differences in temperature at different areas.
    • 用于在焊接过程中支撑电路板的托盘。 托盘具有改变的热质量以抵消电路板的热质量,以便在焊接过程中使电路板的温度差最小化。 托盘的热质量通过在选定的区域中堆积或移除托盘的材料,和/或通过使用具有变化的热性质的材料来改变。 此外,托盘和电路板的总热质量保持在一定范围内,以便允许焊接过程容纳多于一种类型的电路板,而在板之间的过程设置中最少也不进行调整。 托盘的构造优选在迭代过程中进行,其中在加热循环期间测量电路板中的温度变化,并且响应于不同区域的温度差来修改托盘。