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1. 发明申请

US20130318325A1 COMPOSITE PROCESSORS 有权
标题翻译：复合处理器
公开(公告)号：US20130318325A1
公开(公告)日：2013-11-28
申请号：US13978039
申请日：2011-01-20
申请人： Raymond G. Beausoleil , Marco Fiorentino , Moray McLaren , Greg Astfalk , Nathan Lorenzo Binkert , David A. Fattal
发明人： Raymond G. Beausoleil , Marco Fiorentino , Moray McLaren , Greg Astfalk , Nathan Lorenzo Binkert , David A. Fattal
IPC分类号： G06F15/80
CPC分类号： G06F15/80 , G06E3/00 , G06F3/00 , G06F13/4063
摘要： In one example, a composite processor (100) includes a circuit board (1200), a first processor element package (1230), and a second processor element package (1240). The circuit board has an optical link (1211) and an electrical link (1221). The first processor element package (1230) includes a substrate (1231) with an integrated circuit (240), a sub-wavelength grating optical coupler (1232), and an electrical coupler (1233) coupled to the electrical link (1221) of the circuit board (1200). The second processor element package (1240) includes a substrate (1241) with an integrated circuit (240), a sub-wavelength grating optical coupler (1242), and an electrical coupler (1243) coupled to the electrical link (1221) of the circuit board (1220). The sub-wavelength grating optical coupler (1232) of the first processor element package (1230), the optical link (1211) of the circuit board (1220), and the sub-wavelength grating optical coupler (1242) of the second processor element package (1240) collectively define an optical communications path (1270) between the substrate (1231) of the first processor element package (1230) and the substrate (1241) of the second processor element package (1240).
摘要翻译：在一个示例中，复合处理器（100）包括电路板（1200），第一处理器元件封装（1230）和第二处理器元件封装（1240）。电路板具有光学链路（1211）和电连接（1221）。第一处理器元件封装（1230）包括具有集成电路（240）的基板（1231），子波长光栅光耦合器（1232）和耦合到所述电连接器（1221）的电耦合器（1233）电路板（1200）。第二处理器元件封装（1240）包括具有集成电路（240）的基板（1241），子波长光栅光耦合器（1242）和耦合到所述电连接器（1221）的电耦合器（1243）电路板（1220）。第一处理器元件封装（1230）的子波长光栅光耦合器（1232），电路板（1220）的光链路（1211）以及第二处理器元件的子波长光栅光耦合器（1242）封装（1240）共同地限定了第一处理器元件封装（1230）的衬底（1231）与第二处理器元件封装（1240）的衬底（1241）之间的光通信路径（1270）。

2. 发明授权

US08929694B2 Composite processors 有权
标题翻译：复合处理器
公开(公告)号：US08929694B2
公开(公告)日：2015-01-06
申请号：US13978039
申请日：2011-01-20
申请人： Raymond G Beausoleil , Marco Fiorentino , Moray McLaren , Greg Astfalk , Nathan Lorenzo Binkert , David A. Fattal
发明人： Raymond G Beausoleil , Marco Fiorentino , Moray McLaren , Greg Astfalk , Nathan Lorenzo Binkert , David A. Fattal
IPC分类号： G02B6/12 , G06F15/80 , G06F3/00
CPC分类号： G06F15/80 , G06E3/00 , G06F3/00 , G06F13/4063
摘要： In one example, a composite processor includes a circuit board, a first processor element package, and a second processor element package. The circuit board has an optical link and an electrical link. The first processor element package includes a substrate with an integrated circuit, a sub-wavelength grating optical coupler, and an electrical coupler coupled to the electrical link of the circuit board. The second processor element package includes a substrate with an integrated circuit, a sub-wavelength grating optical coupler, and an electrical coupler coupled to the electrical link of the circuit board. The sub-wavelength grating optical coupler of the first processor element package, the optical link of the circuit board, and the sub-wavelength grating optical coupler of the second processor element package collectively define an optical communications path between the substrate of the first processor element package and the substrate of the second processor element package.
摘要翻译：在一个示例中，复合处理器包括电路板，第一处理器元件封装和第二处理器元件封装。电路板具有光连接和电连接。第一处理器元件封装包括具有集成电路的基板，子波长光栅光耦合器和耦合到电路板的电连接器的电耦合器。第二处理器元件封装包括具有集成电路的衬底，子波长光栅光耦合器和耦合到电路板的电连接的电耦合器。第一处理器元件封装的子波长光栅光耦合器，电路板的光链路和第二处理器元件封装的子波长光栅光耦合器共同地限定第一处理器元件的衬底之间的光通信路径封装和第二处理器元件封装的衬底。

3. 发明授权

US4512944A Methods of and apparatus for insulating a conductor with a plastic material 失效
标题翻译：用塑料材料绝缘导体的方法和设备
公开(公告)号：US4512944A
公开(公告)日：1985-04-23
申请号：US507262
申请日：1983-06-23
申请人： Greg Astfalk , Timothy S. Dougherty , Montri Viriyayuthakorn
发明人： Greg Astfalk , Timothy S. Dougherty , Montri Viriyayuthakorn
IPC分类号： B29C47/02 , B29C47/28 , B29F3/10
CPC分类号： B29C47/28 , B29C47/02 , B29C47/0014 , B29C47/0023 , B29L2011/00
摘要： Extruder tooling for directing plastic materials to enclose a conductor (26) being advanced along a path of travel through a core tube (97) and aligned dies includes disc-like flow passages (107, 129) which are disposed concentrically about and perpendicularly to the conductor. This arrangement minimizes conductor tension in a pressure extrusion arrangement by significantly reducing the length of the plastic-to-conductor contact within the extruder. The length and width of each flow passage normal to and along a path of travel are sufficient to provide a uniform distribution of plastic material circumferentially about the conductor and to dissipate stresses which have been induced in the plastic materials. In a tubing arrangement, the length of a cantilevered portion of the core tube is reduced significantly which results in improved concentricity of the plastic material about the conductor.
摘要翻译：挤出机工具，用于引导塑料材料以封闭沿行进路径前进的导体（26）通过芯管（97）并且对准的模具包括盘状流动通道（107,129），其围绕并垂直于导体。这种布置通过显着减少挤出机内的塑料 - 导体接触的长度来最小化压力挤压装置中的导体张力。每个流动通道的长度和宽度垂直于和沿着行进路径足以提供围绕导体周向塑性材料的均匀分布并消散在塑料材料中引起的应力。在管道布置中，芯管的悬臂部分的长度显着减小，这导致塑料材料围绕导体的同心度提高。

4. 发明申请

US20120119795A1 SYSTEM INCLUDING DRIVER CIRCUIT FOR ELECTRICAL SIGNALING AND OPTICAL SIGNALING 有权
标题翻译：包括用于电子信号和光信号的驱动电路的系统
公开(公告)号：US20120119795A1
公开(公告)日：2012-05-17
申请号：US13386632
申请日：2010-01-11
申请人： Kirk M Bresniker , Greg Astfalk
发明人： Kirk M Bresniker , Greg Astfalk
IPC分类号： H02J1/00
CPC分类号： H04B10/801
摘要： A system including a driver circuit. The driver circuit is configured to provide first output signals in a first mode for electrical signaling and second output signals in a second mode for optical signaling. The driver circuit is configured to provide the first output signals in the first mode with at least one of a lower frequency and higher power and the second output signals in the second mode with at least one of a higher frequency and lower power.
摘要翻译：一种包括驱动电路的系统。驱动器电路被配置为以第一模式提供用于电信令的第一输出信号和用于光信令的第二模式中的第二输出信号。驱动器电路被配置为以第一模式提供具有较低频率和较高功率中的至少一个功率的第一输出信号，而第二模式中的第二输出信号具有较高频率和较低功率中的至少一个。

5. 发明授权

US09425902B2 System including driver circuit for electrical signaling and optical signaling 有权
标题翻译：系统包括用于电信令和光信令的驱动电路
公开(公告)号：US09425902B2
公开(公告)日：2016-08-23
申请号：US13386632
申请日：2010-01-11
申请人： Kirk M. Bresniker , Greg Astfalk
发明人： Kirk M. Bresniker , Greg Astfalk
IPC分类号： H03K3/00 , H04B10/80
CPC分类号： H04B10/801
摘要： A system including a driver circuit. The driver circuit is configured to provide first output signals in a first mode for electrical signaling and second output signals in a second mode for optical signaling. The driver circuit is configured to provide the first output signals in the first mode with at least one of a lower frequency and higher power and the second output signals in the second mode with at least one of a higher frequency and lower power.
摘要翻译：一种包括驱动电路的系统。驱动器电路被配置为以第一模式提供用于电信令的第一输出信号和用于光信令的第二模式中的第二输出信号。驱动器电路被配置为以第一模式提供具有较低频率和较高功率中的至少一个功率的第一输出信号，而第二模式中的第二输出信号具有较高频率和较低功率中的至少一个。

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