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1. 发明授权

US09449759B2 Multilayer ceramic capacitor and board having the same mounted thereon 有权
标题翻译：多层陶瓷电容器及其上安装的电路板
公开(公告)号：US09449759B2
公开(公告)日：2016-09-20
申请号：US14255397
申请日：2014-04-17
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Kyung Pyo Hong , Doo Young Kim , Chang Hoon Kim , Sang Hyun Park , Hae Sock Chung
IPC分类号： H01G2/06 , H01G4/012 , H01G4/30 , H01G4/12
CPC分类号： H01G2/065 , H01G4/012 , H01G4/12 , H01G4/30
摘要： A multilayer ceramic capacitor may include: a ceramic body including dielectric layers; first and second internal electrodes disposed in the ceramic body; and first and second external electrodes formed to end surfaces of the ceramic body. The ceramic body may includes an active layer, a capacitance formation portion, and a cover layer, a non-capacitance formation portion, the cover layer includes a plurality of dummy electrode layers. When the number of the first and second internal electrodes is defined as AL, a thickness of each of the first and second internal electrodes is defined as AT, a thickness of each of the dummy electrode layers is defined as DT, and the number of the dummy electrode layers is defined as DL, DL is equal to {(T×x)−(AL×AT)}/DT, x being 9.0% or more.
摘要翻译：多层陶瓷电容器可以包括：包括电介质层的陶瓷体; 布置在陶瓷体中的第一和第二内部电极; 以及形成在陶瓷体的端面的第一外部电极和第二外部电极。陶瓷体可以包括有源层，电容形成部分和覆盖层，非电容形成部分，覆盖层包括多个虚拟电极层。当第一和第二内部电极的数量被定义为AL时，第一和第二内部电极的厚度被定义为AT，每个虚拟电极层的厚度被定义为DT，并且虚拟电极层被定义为DL，DL等于{（T×x） - （AL×AT）} / DT，x为9.0％以上。

2. 发明授权

US09455085B2 Multilayer ceramic device having a crack guide pattern 有权
标题翻译：具有裂纹引导图案的多层陶瓷装置
公开(公告)号：US09455085B2
公开(公告)日：2016-09-27
申请号：US14175129
申请日：2014-02-07
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Hae Sock Chung , Doo Young Kim , Na Rim Ha , Chang Hoon Kim , Sang Hyun Park
IPC分类号： H01G4/002 , H01G4/30 , H01G4/012 , H01G13/00 , H01G4/12 , C23C8/12 , H01G4/008
CPC分类号： H01G4/002 , C23C8/12 , H01G4/008 , H01G4/012 , H01G4/12 , H01G4/30 , H01G4/306 , H01G13/00
摘要： Disclosed herein is a multilayer ceramic device. The multilayer ceramic device according to an exemplary embodiment of the present invention includes: a device body having sides which are spaced apart from each other and a circumferential surface which connects the sides; an internal electrode disposed in a longitudinal direction of the device body within the device body; an external electrode having a front part which covers the sides and a band part which extends from the front part to cover a portion of the circumferential surface; and a crack guide pattern disposed within the device body and guiding a progress direction of cracks occurring at the circumferential surface to the sides, wherein the crack guide pattern includes: a metal pattern; and an oxide layer formed on a surface of the metal pattern.
摘要翻译：本文公开了一种多层陶瓷器件。根据本发明的示例性实施例的多层陶瓷器件包括：具有彼此间隔开的侧面和连接侧面的圆周表面的器件主体; 设置在所述装置本体内的所述装置主体的纵向方向的内部电极; 外部电极，其具有覆盖所述侧面的前部和从所述前部延伸以覆盖所述周向表面的一部分的带部; 以及裂缝引导图案，其设置在所述装置主体内，并且引导在所述周面的侧面发生的裂纹的进行方向，其中，所述裂纹引导图案包括：金属图案; 以及形成在金属图案的表面上的氧化物层。

3. 发明授权

US09196421B2 Multilayer ceramic electronic component 有权
标题翻译：多层陶瓷电子元件
公开(公告)号：US09196421B2
公开(公告)日：2015-11-24
申请号：US14505239
申请日：2014-10-02
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Hae Sock Chung , Byoung Hwa Lee , Min Cheol Park , Eun Hyuk Chae
IPC分类号： H01G4/005 , H01G4/30 , H01G4/012 , H01G4/12 , H01G4/248 , H01G4/232
CPC分类号： H01G4/005 , H01G4/012 , H01G4/12 , H01G4/232 , H01G4/248 , H01G4/30
摘要： There is provided a multilayer ceramic electronic component, including: a ceramic body formed by laminating dielectric layers having an average thickness of 0.7 μm or less; external electrodes formed on external surfaces of the ceramic body; and internal electrodes respectively disposed on the dielectric layer so as to have a gap formed therebetween, wherein, when a narrowest gap between the internal electrode edges adjacent to one another is denoted by Gmin, 10 μm≦Gmin≦60 μm is satisfied.
摘要翻译：提供了一种多层陶瓷电子部件，其包括：通过层叠平均厚度为0.7μm以下的电介质层而形成的陶瓷体; 形成在陶瓷体的外表面上的外部电极; 以及分别设置在所述电介质层上以在其间形成间隙的内部电极，其中当彼此相邻的所述内部电极边缘之间的最窄间隙由Gmin表示时，满足10μm＆nlE; Gmin＆nlE;60μm。

4. 发明授权

US09318264B2 Multilayer ceramic device 有权
标题翻译：多层陶瓷器件
公开(公告)号：US09318264B2
公开(公告)日：2016-04-19
申请号：US14189915
申请日：2014-02-25
申请人： Samsung Electro-Mechanics Co., Ltd.
发明人： Hae Sock Chung , Doo Young Kim , Ki Won Kim , Tae Jin Jang , Hyun Hee Gu , Ji Hee Moon , Jin Hyung Lim , Youn Sik Jin , Byung Jun Jeon
IPC分类号： H01G4/258 , H01G4/30 , H01G4/232 , H01G4/005
CPC分类号： H01G4/258 , H01G4/005 , H01G4/2325 , H01G4/30
摘要： Disclosed herein is a multilayer ceramic device, including a device body; an inner electrode arranged in the device body; and an external electrode arranged at outside of the device body and being electrically connected to the inner electrode; wherein the external electrode includes: an inner layer covering the device body; an outer layer covering the inner layer and being exposed to the outside; and an intermediate layer arranged between the inner layer and the outer layer, and made of a mixture of a copper metal and a resin, a surface of the copper metal being coated with an oxide film.
摘要翻译：本文公开了一种多层陶瓷器件，包括器件本体; 布置在所述装置主体中的内部电极; 以及外部电极，其布置在所述器件主体的外部并且电连接到所述内部电极; 其中所述外部电极包括：覆盖所述装置主体的内层; 覆盖内层并暴露于外部的外层; 以及中间层，其设置在所述内层和所述外层之间，并且由铜金属和树脂的混合物构成，所述铜金属的表面被氧化物膜涂覆。

5. 发明授权

US09287044B2 Electronic component and fabrication method thereof 有权
标题翻译：电子元件及其制造方法
公开(公告)号：US09287044B2
公开(公告)日：2016-03-15
申请号：US13737504
申请日：2013-01-09
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Hae Sock Chung , Byoung Hwa Lee , Eun Hyuk Chae , Min Cheol Park
IPC分类号： H01G4/30 , H01G4/012 , H01G4/232
CPC分类号： H01G4/012 , H01G4/232 , H01G4/30
摘要： There are provided an electronic component and a fabrication method thereof. The electronic component includes: a ceramic main body including end surfaces in a length direction, side surfaces in a width direction and top and bottom surfaces in a thickness direction; first and second external electrodes formed on the end surfaces, respectively; third and fourth external electrodes formed on the side surfaces, respectively; first internal electrodes formed within the ceramic main body and connected to first and second external electrodes; and second internal electrodes alternately arranged with the first internal electrodes, while having a ceramic layer interposed therebetween, and connected to the third and fourth external electrodes, wherein thickness t1 and t2 of the first and second internal electrodes is 0.9 μm or less, while a roughness R1 of the first internal electrode is lower than a roughness R2 of the second internal electrode.
摘要翻译：提供了电子部件及其制造方法。电子部件包括：陶瓷主体，其包括长度方向的端面，宽度方向的侧面和厚度方向的上下表面; 第一和第二外部电极分别形成在端面上; 分别形成在侧表面上的第三和第四外部电极; 第一内部电极，形成在陶瓷主体内并连接到第一和第二外部电极; 以及与第一内部电极交替配置的第二内部电极，同时具有介于其间的陶瓷层，并且与第三和第四外部电极连接，其中第一和第二内部电极的厚度t1和t2为0.9μm以下，而第一内部电极的粗糙度R1低于第二内部电极的粗糙度R2。

6. 发明申请

US20150077898A1 MULTILAYER CERAMIC ELECTRONIC PART AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：多层陶瓷电子部件及其制造方法
公开(公告)号：US20150077898A1
公开(公告)日：2015-03-19
申请号：US14209416
申请日：2014-03-13
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Hae Sock Chung , Doo Young Kim , Na Rim Ha , Chang Hoon Kim , Kyung Pyo Hong , Sang Hyun Park
IPC分类号： H01G4/30 , H01G4/008
CPC分类号： H01G4/30 , H01G2/10 , H01G4/12 , H01G4/224 , H01G4/232 , H01G4/2325
摘要： There is provided a multilayer ceramic capacitor including a ceramic body including a plurality of dielectric layers, a plurality of first and second internal electrodes disposed in the ceramic body to be alternately exposed to first and second end surfaces of the ceramic body, having the dielectric layer therebetween, first and second electrode layers electrically connected to the first and second internal electrodes, respectively, a conductive resin layer formed on the first and second electrode layers and in regions of the ceramic body adjacent to the first and second electrode layers, and a coating layer formed between a portion of an outer surface of the ceramic body on which the conductive resin layer is to be formed and the conductive resin layer.
摘要翻译：提供了一种多层陶瓷电容器，其包括陶瓷体，该陶瓷体包括多个电介质层，多个第一和第二内部电极，设置在陶瓷体中，以交替地暴露于陶瓷体的第一和第二端面，具有电介质层其间分别与第一和第二内部电极电连接的第一和第二电极层，形成在第一和第二电极层上的导电树脂层和与第一和第二电极层相邻的陶瓷体的区域中的导电树脂层，以及涂层在形成有导电性树脂层的陶瓷体的外表面的一部分与导电性树脂层之间形成的层。

7. 发明授权

US09378891B2 Multilayer ceramic device 有权
标题翻译：多层陶瓷器件
公开(公告)号：US09378891B2
公开(公告)日：2016-06-28
申请号：US14104301
申请日：2013-12-12
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Tae Jin Jang , Jin Hyung Lim , Hae Sock Chung , Doo Young Kim , Sang Hyun Park , Won Seh Lee
IPC分类号： H01G4/30 , H01G4/012 , H01G4/232 , H01G4/12
CPC分类号： H01G4/30 , H01G4/012 , H01G4/12 , H01G4/232
摘要： Disclosed herein is a multilayer ceramic device including a device body having lateral surfaces and circumferential surfaces connecting the lateral surfaces, an internal electrode disposed in a length direction of the device body within the device body, an external electrode having a front portion covering the lateral surface and a band portion extending from the front portion to cover a portion of the circumferential surface, and a reinforcement pattern extending from the lateral surface toward the interior of the device body and having a length longer than a width of the band portion.
摘要翻译：本发明公开了一种多层陶瓷器件，其包括具有侧表面和连接侧表面的圆周表面的器件主体，设置在器件本体内的器件本体的长度方向的内部电极，外部电极，其具有覆盖侧面的前部以及从所述前部延伸以覆盖所述周向表面的一部分的带部分，以及从所述侧表面朝向所述装置主体的内部延伸并且具有比所述带部的宽度更长的长度的加强图案。

8. 发明授权

US09336952B2 Multilayer ceramic electronic part and method of manufacturing the same 有权
标题翻译：多层陶瓷电子零件及其制造方法
公开(公告)号：US09336952B2
公开(公告)日：2016-05-10
申请号：US14209416
申请日：2014-03-13
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Hae Sock Chung , Doo Young Kim , Na Rim Ha , Chang Hoon Kim , Kyung Pyo Hong , Sang Hyun Park
IPC分类号： H01G4/30 , H01G4/232 , H01G4/224 , H01G2/10 , H01G4/12
CPC分类号： H01G4/30 , H01G2/10 , H01G4/12 , H01G4/224 , H01G4/232 , H01G4/2325
摘要： There is provided a multilayer ceramic capacitor including a ceramic body including a plurality of dielectric layers, a plurality of first and second internal electrodes disposed in the ceramic body to be alternately exposed to first and second end surfaces of the ceramic body, having the dielectric layer therebetween, first and second electrode layers electrically connected to the first and second internal electrodes, respectively, a conductive resin layer formed on the first and second electrode layers and in regions of the ceramic body adjacent to the first and second electrode layers, and a coating layer formed between a portion of an outer surface of the ceramic body on which the conductive resin layer is to be formed and the conductive resin layer.
摘要翻译：提供了一种多层陶瓷电容器，其包括陶瓷体，该陶瓷体包括多个电介质层，多个第一和第二内部电极，设置在陶瓷体中，以交替地暴露于陶瓷体的第一和第二端面，具有电介质层其间分别与第一和第二内部电极电连接的第一和第二电极层，形成在第一和第二电极层上的导电树脂层和与第一和第二电极层相邻的陶瓷体的区域中的导电树脂层，以及涂层在形成有导电性树脂层的陶瓷体的外表面的一部分与导电性树脂层之间形成的层。

9. 发明授权

US09072178B2 Stacked-type multilayer ceramic electronic component, stacked-type multilayer ceramic electronic component module, and method of manufacturing the same 有权
标题翻译：叠层型多层陶瓷电子部件，层叠型多层陶瓷电子部件模块及其制造方法
公开(公告)号：US09072178B2
公开(公告)日：2015-06-30
申请号：US13842121
申请日：2013-03-15
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Hae Sock Chung , Doo Young Kim , Na Rim Ha , Youn Sik Jin , Tae Ok Kim
IPC分类号： H01G4/228 , H05K1/02 , H01G4/12 , H05K1/18 , H01G4/30 , H01G4/38
CPC分类号： H05K1/0231 , H01G4/12 , H01G4/228 , H01G4/30 , H01G4/38 , H05K1/0271 , H05K1/181 , H05K3/3442 , H05K2201/10015 , H05K2201/1028 , H05K2201/10515 , H05K2201/10636 , H05K2201/10946 , H05K2201/10962 , H05K2201/2045 , Y02P70/611 , Y02P70/613 , Y10T29/43
摘要： There is provided a stacked-type multilayer ceramic electronic component including: a ceramic body, a plurality of first and second internal, and first and second external electrodes formed on both surfaces of the ceramic element opposing one another; and first and second metal frames disposed to face one another and allowing the first and second external electrodes of the ceramic body to be attached thereto, respectively, wherein two or more ceramic bodies are attached between the first and second metal frames in a length direction of the first and second metal frames with an interval therebetween, and the respective ceramic bodies have different levels of capacitance.
摘要翻译：提供了一种层叠型多层陶瓷电子部件，包括：陶瓷体，多个第一和第二内部以及形成在陶瓷元件的彼此相对的两个表面上的第一和第二外部电极; 以及第一和第二金属框架，其被设置为彼此面对并且允许陶瓷体的第一和第二外部电极分别附接到其上，其中两个或更多个陶瓷体在第一和第二金属框架之间沿长度方向第一和第二金属框架之间具有间隔，并且各个陶瓷体具有不同的电容水平。

10. 发明授权

US09368251B2 Multilayer ceramic capacitor with conductive fullerene-filling resin layer, method for same, and mounting board with same 有权
标题翻译：具有导电富勒烯填充树脂层的多层陶瓷电容器，其方法及其安装板
公开(公告)号：US09368251B2
公开(公告)日：2016-06-14
申请号：US14196911
申请日：2014-03-04
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Kyung Pyo Hong , Doo Young Kim , Chang Hoon Kim , Sang Hyun Park , Hae Sock Chung
IPC分类号： H01B1/24 , H01B1/02 , H01G2/06 , H01G4/12 , H01G4/30 , H01G4/232
CPC分类号： H01B1/24 , H01B1/02 , H01G2/065 , H01G4/12 , H01G4/232 , H01G4/2325 , H01G4/30
摘要： A multilayer ceramic capacitor includes a ceramic body including dielectric layers and internal electrodes, electrode layers connected to the internal electrodes, and a conductive resin layer formed on the electrode layer and containing conductive particles, fullerenes, and a base resin.
摘要翻译：多层陶瓷电容器包括：陶瓷体，包括电介质层和内部电极，与内部电极连接的电极层，以及形成在电极层上并含有导电性粒子，富勒烯和基础树脂的导电性树脂层。

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