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1. 发明授权

US09530554B2 Multilayer coil component 有权
标题翻译：多层线圈组件
公开(公告)号：US09530554B2
公开(公告)日：2016-12-27
申请号：US14084264
申请日：2013-11-19
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Soo Hwan Son , Jin Woo Hahn , Byeong Cheol Moon
IPC分类号： H01F5/00 , H01F27/28 , H01B1/02 , H01F17/00 , C04B35/26
CPC分类号： H01F27/2804 , C04B35/26 , C04B2235/3262 , C04B2235/3279 , C04B2235/3281 , C04B2235/3284 , C04B2235/3298 , C04B2235/36 , C04B2235/6025 , H01B1/026 , H01F17/0013 , H01F2027/2809
摘要： Disclosed herein is a multilayer coil component including a copper-nickel mixture for an internal electrode, in which a nickel content in the internal electrode is adjusted to thereby optimize the area ratio of nickel to copper while the copper-nickel mixture is used for a material for the internal electrode of the multilayer coil component, thereby preventing deterioration in characteristics of the multilayer coil component, so that ferrite characteristics of the multilayer coil component, such as, impedance (Z), inductance (L), and the like, can be improved.
摘要翻译：本文公开了一种多层线圈部件，其包括用于内部电极的铜 - 镍混合物，其中调节内部电极中的镍含量，从而优化镍与铜的面积比，而铜 - 镍混合物用于材料对于多层线圈部件的内部电极，能够防止多层线圈部件的特性劣化，能够使阻抗（Z），电感（L）等多层线圈部件的铁氧体特性改进。

2. 发明授权

US08729999B2 Multi-layered chip electronic component 有权
标题翻译：多层芯片电子元器件
公开(公告)号：US08729999B2
公开(公告)日：2014-05-20
申请号：US13660543
申请日：2012-10-25
申请人： Samsung Electro-Mechanics Co., Ltd.
发明人： Jin Woo Hahn , Sung Yong An , Soo Hwan Son , Ic Seob Kim , Byeong Cheol Moon
IPC分类号： H01F5/00 , H01F27/24 , H01F27/30
CPC分类号： H01F17/0033 , H01F17/0013 , H01F27/292
摘要： There is provided a multi-layered chip electronic component, including: a multi-layered body including a plurality of first magnetic layers on which conductive patterns are formed; and second magnetic layers interposed between the first magnetic layers within the multi-layered body, wherein the conductive patterns are electrically connected to form coil patterns in a stacking direction, and when a thickness of the second magnetic layer is defined as Ts and a thickness of the conductive pattern is defined as Te, 0.1≦Ts:Te≦0.3 is satisfied.
摘要翻译：提供了一种多层芯片电子部件，包括：多层体，包括形成有导电图案的多个第一磁性层; 以及介于所述多层体内的所述第一磁性层之间的第二磁性层，其中所述导电图案电连接以在层叠方向上形成线圈图案，并且当所述第二磁性层的厚度被定义为Ts时，导电图形被定义为Te，0.1＆nlE; Ts：Te＆nlE; 0.3。

3. 发明授权

US09183979B2 Chip inductor and method for manufacturing the same 有权
标题翻译：片式电感及其制造方法
公开(公告)号：US09183979B2
公开(公告)日：2015-11-10
申请号：US13725478
申请日：2012-12-21
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Hye Yeon Cha , Kang Heon Hur , Sung Jin Park , Dong Jin Jeong , Jung Min Park , Hyeog Soo Shin , Sung Yong An , Hwan Soo Lee , Young Do Kweon , Jin Woo Hahn
IPC分类号： H01F5/00 , H01F27/29 , H01F41/04 , H01F17/00
CPC分类号： H01F27/29 , H01F5/00 , H01F17/0033 , H01F27/292 , H01F41/041 , H01F41/046 , Y10T29/4902
摘要： The present invention relates to a chip inductor including: a metal-polymer composite in which metal particles and polymer are mixed; a wiring pattern provided inside the metal-polymer composite to form a coil; an external electrode provided in a portion of an outer peripheral surface of the metal-polymer composite; and an insulating portion provided between the metal-polymer composite and the wiring pattern and between the metal-polymer composite and the external electrode, and a method for manufacturing the same.
摘要翻译：芯片电感器技术领域本发明涉及一种芯片电感器，包括：金属 - 聚合物复合体，其中金属颗粒和聚合物混合; 设置在金属 - 聚合物复合材料内部以形成线圈的布线图案; 设置在所述金属 - 聚合物复合材料的外周表面的一部分中的外部电极; 以及设置在金属 - 聚合物复合物和布线图案之间以及金属 - 聚合物复合材料和外部电极之间的绝缘部分及其制造方法。

4. 发明授权

US09349512B2 Multi-layered chip electronic component 有权
标题翻译：多层芯片电子元器件
公开(公告)号：US09349512B2
公开(公告)日：2016-05-24
申请号：US13633544
申请日：2012-10-02
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Jin Woo Hahn , Myeong Gi Kim , Sung Yong An , Ic Seob Kim , Byeong Cheol Moon
IPC分类号： H01F5/00 , H01F27/28 , H01F3/14 , H01F17/00 , H01F27/29
CPC分类号： H01F3/14 , H01F17/0013 , H01F17/0033 , H01F27/292
摘要： There is provided a multi-layered chip electronic component including: a multi-layered body including a 2016-sized or less and a plurality of magnetic layers; conductive patterns electrically connected in a stacking direction to form coil patterns, within the multi-layered body; and non-magnetic gap layers formed over a laminated surface of the multi-layered body between the multi-layered magnetic layers and having a thickness Tg in a range of 1 μm≦Tg≦7 μm, wherein the number of non-magnetic gap layers may have the number of gap layers in a range between at least four layers among the magnetic layers and a turns amount of the coil pattern.
摘要翻译：提供一种多层芯片电子部件，其包括：包括2016尺寸以下的多层磁性层的多层体; 导电图案在堆叠方向上电连接以形成多层体内的线圈图案; 以及形成在多层磁性层之间的层叠多层体的层叠表面上并且具有在1μm和n1E范围内的厚度Tg的非磁隙层; Tg＆lt; 1lE;7μm，其中非磁隙层数可以具有在磁性层中的至少四层之间的范围内的间隙层的数量和线圈图案的匝数。

5. 发明申请

US20150102888A1 MULTILAYER ELECTRONIC COMPONENT 有权
标题翻译：多层电子元件
公开(公告)号：US20150102888A1
公开(公告)日：2015-04-16
申请号：US14281097
申请日：2014-05-19
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Myeong Gi KIM , Il Jin Park , Ho Yoon Kim , Jin Woo Hahn , Min Kyoung Cheon
IPC分类号： H01F27/255 , H01F27/28
CPC分类号： H01F17/0013
摘要： A multilayer electronic component may include: a magnetic body in which a plurality of magnetic layers are stacked; and conductor patterns formed on the magnetic body. The magnetic body may include: metal magnetic particles; an oxide film formed on a surface of the metal magnetic particle as a first oxide obtained by oxidation of at least one component of the metal magnetic particle; and a filling portion formed in a space between the metal magnetic particles as a second oxide obtained by oxidization of at least one component of the metal magnetic particle. At least one of the first oxide and the second oxide is provided between adjacent metal magnetic particles, and an oxide film formed on a surface of a metal magnetic particle forms a neck portion with an oxide film formed on a surface of an adjacent metal magnetic particle.
摘要翻译：多层电子部件可以包括：堆叠多个磁性层的磁性体; 以及形成在磁体上的导体图案。磁体可以包括：金属磁性颗粒; 形成在所述金属磁性体的表面上的氧化膜，作为通过使所述金属磁性体的至少一种成分氧化而得到的第一氧化物; 以及填充部分，其形成在金属磁性颗粒之间的空间中，作为通过氧化金属磁性颗粒的至少一种成分而获得的第二氧化物。第一氧化物和第二氧化物中的至少一个设置在相邻的金属磁性颗粒之间，形成在金属磁性颗粒的表面上的氧化膜形成具有在相邻的金属磁性颗粒的表面上形成的氧化膜的颈部。

6. 发明申请

US20130162382A1 CHIP INDUCTOR AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：芯片电感器及其制造方法
公开(公告)号：US20130162382A1
公开(公告)日：2013-06-27
申请号：US13725478
申请日：2012-12-21
申请人： c/o SAMSUNG ELECTRO-MECHANICS CO., LTD
发明人： Hye Yeon Cha , Kang Heon Hur , Sung Jin Park , Dong Jin Jeong , Jung Min Park , Hyeog Soo Shin , Sung Yong An , Hwan Soo Lee , Young Do KWEON , Jin Woo Hahn
IPC分类号： H01F27/29 , H01F41/04
CPC分类号： H01F27/29 , H01F5/00 , H01F17/0033 , H01F27/292 , H01F41/041 , H01F41/046 , Y10T29/4902
摘要： The present invention relates to a chip inductor including: a metal-polymer composite in which metal particles and polymer are mixed; a wiring pattern provided inside the metal-polymer composite to form a coil; an external electrode provided in a portion of an outer peripheral surface of the metal-polymer composite; and an insulating portion provided between the metal-polymer composite and the wiring pattern and between the metal-polymer composite and the external electrode, and a method for manufacturing the same.
摘要翻译：芯片电感器技术领域本发明涉及一种芯片电感器，包括：金属 - 聚合物复合体，其中金属颗粒和聚合物混合; 设置在金属 - 聚合物复合材料内部以形成线圈的布线图案; 设置在所述金属 - 聚合物复合材料的外周表面的一部分中的外部电极; 以及设置在金属 - 聚合物复合物和布线图案之间以及金属 - 聚合物复合材料和外部电极之间的绝缘部分及其制造方法。

7. 发明授权

US09654079B2 Composite electronic component and a board for mounting the same 有权
公开(公告)号：US09654079B2
公开(公告)日：2017-05-16
申请号：US14315110
申请日：2014-06-25
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Soo Hwan Son , Jin Woo Hahn , Joon Hwan Kwag , Kyoung No Lee , Myeong Gi Kim , Hwan Soo Lee
IPC分类号： H03H7/01 , H03H1/00
CPC分类号： H03H7/0115 , H03H2001/0085
摘要： A composite electronic component may include: a composite body including a capacitor formed of a ceramic body in which a plurality of dielectric layers and first and second internal electrodes are laminated, and an inductor formed of a magnetic body including a coil; an input terminal disposed on a first end surface of the composite body; output terminals including a first output terminal disposed on a second end surface of the composite body and a second output terminal disposed on the second end surface of the composite body; and a ground terminal disposed on one or more of upper and lower surfaces and the first end surface of the capacitor of the composite body. The capacitor is adjacent to the inductor.

8. 发明授权

US09390862B2 Composite electronic component and board with the same mounted thereon 有权
标题翻译：复合电子部件和安装在其上的板
公开(公告)号：US09390862B2
公开(公告)日：2016-07-12
申请号：US14275469
申请日：2014-05-12
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Byeong Cheol Moon , Jae Hoon Lee , Myeong Gi Kim , Jin Woo Hahn , Soo Hwan Son
IPC分类号： H01G4/40 , H01G4/30 , H01G4/12 , H01G4/012 , H05K1/18 , H01F27/28 , H01F27/29 , H01F27/24 , H05K1/11 , H01G2/06 , H01G4/248 , H01F27/40
CPC分类号： H01G4/40 , H01F27/292 , H01F27/40 , H01G2/065 , H01G4/012 , H01G4/12 , H01G4/232 , H01G4/248 , H01G4/30 , H05K1/111 , H05K1/181 , H05K2201/10015 , H05K2201/1003 , Y02P70/611
摘要： A composite electronic component may include: a composite body having a capacitor and an inductor coupled to each other therein; an input terminal disposed on a first end surface of the composite body; output terminals including a first output terminal disposed on a second end surface of the composite body and a second output terminal disposed on a lower surface of the capacitor of the composite body; and a ground terminal disposed on the lower surface of the capacitor of the composite body. The capacitor may be coupled to a side surface of the inductor.
摘要翻译：复合电子部件可以包括：具有彼此耦合的电容器和电感器的复合体; 输入端子，设置在复合体的第一端面上; 输出端子，包括设置在复合体的第二端面上的第一输出端子和设置在复合体的电容器的下表面上的第二输出端子; 以及设置在复合体的电容器的下表面上的接地端子。电容器可以耦合到电感器的侧表面。

9. 发明申请

US20150213960A1 COMPOSITE ELECTRONIC COMPONENT AND BOARD WITH THE SAME MOUNTED THEREON 有权
标题翻译：复合电子元件与其安装在一起的板
公开(公告)号：US20150213960A1
公开(公告)日：2015-07-30
申请号：US14275469
申请日：2014-05-12
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Byeong Cheol Moon , Jae Hoon Lee , Myeong Gi Kim , Jin Woo Hahn , Soo Hwan Son
IPC分类号： H01G4/40 , H01G4/30 , H01G4/12 , H01G4/012 , H05K1/18 , H01F27/28 , H01F27/29 , H01F27/24 , H05K1/11 , H01G2/06 , H01G4/248
CPC分类号： H01G4/40 , H01F27/292 , H01F27/40 , H01G2/065 , H01G4/012 , H01G4/12 , H01G4/232 , H01G4/248 , H01G4/30 , H05K1/111 , H05K1/181 , H05K2201/10015 , H05K2201/1003 , Y02P70/611
摘要： A composite electronic component may include: a composite body having a capacitor and an inductor coupled to each other therein; an input terminal disposed on a first end surface of the composite body; output terminals including a first output terminal disposed on a second end surface of the composite body and a second output terminal disposed on a lower surface of the capacitor of the composite body; and a ground terminal disposed on the lower surface of the capacitor of the composite body. The capacitor may be coupled to a side surface of the inductor.
摘要翻译：复合电子部件可以包括：具有彼此耦合的电容器和电感器的复合体; 输入端子，设置在复合体的第一端面上; 输出端子，包括设置在复合体的第二端面上的第一输出端子和设置在复合体的电容器的下表面上的第二输出端子; 以及设置在复合体的电容器的下表面上的接地端子。电容器可以耦合到电感器的侧表面。

10. 发明授权

US09767950B2 Multilayer electronic component 有权
公开(公告)号：US09767950B2
公开(公告)日：2017-09-19
申请号：US14281097
申请日：2014-05-19
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Myeong Gi Kim , Il Jin Park , Ho Yoon Kim , Jin Woo Hahn , Min Kyoung Cheon
IPC分类号： H01F5/00 , H01F27/28 , H01F17/00
CPC分类号： H01F17/0013
摘要： A multilayer electronic component may include: a magnetic body in which a plurality of magnetic layers are stacked; and conductor patterns formed on the magnetic body. The magnetic body may include: metal magnetic particles; an oxide film formed on a surface of the metal magnetic particle as a first oxide obtained by oxidation of at least one component of the metal magnetic particle; and a filling portion formed in a space between the metal magnetic particles as a second oxide obtained by oxidization of at least one component of the metal magnetic particle. At least one of the first oxide and the second oxide is provided between adjacent metal magnetic particles, and an oxide film formed on a surface of a metal magnetic particle forms a neck portion with an oxide film formed on a surface of an adjacent metal magnetic particle.

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