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1. 发明申请

US20160086727A1 ELECTRONIC COMPONENT AND BOARD HAVING THE SAME 审中-公开
标题翻译：具有相同功能的电子元件和板
公开(公告)号：US20160086727A1
公开(公告)日：2016-03-24
申请号：US14858776
申请日：2015-09-18
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Min Sung CHOI , Jae Yeol CHOI
IPC分类号： H01F27/29 , H01F27/28
CPC分类号： H01F27/292 , H01F17/0013
摘要： An electronic component and a board having the same are provided. The electronic component includes a multilayer body including a plurality of insulating layers with a bottom surface provided as a mounting surface and a top surface opposing the bottom surface; and external electrodes disposed on opposite end surfaces of the multilayer body in a length direction of the multilayer body. The multilayer body further includes a first protrusion portion disposed on the top surface, and second and third protrusion portions disposed on opposite side surfaces of the multilayer body in a width direction of the multilayer body, and a length of the first protrusion portion in the length direction is shorter than a length of the second and third protrusion portions in the length direction.
摘要翻译：提供电子部件和具有该电子部件的电路板。电子部件包括多层体，该多层体具有设置为安装面的底面和与底面相对的顶面的多个绝缘层，以及设置在多层体的长度方向的相反端面的外部电极。所述多层体还包括设置在所述顶面上的第一突出部，以及在所述多层体的宽度方向上配置在所述多层体的相对侧面上的第二突出部和第三突出部，所述第一突出部的长度方向短于第二和第三突出部分在长度方向上的长度。

2. 发明申请

US20230128594A1 ELECTRONIC COMPONENT, AND METHOD OF MANUFACTURING THEREOF 有权
公开(公告)号：US20230128594A1
公开(公告)日：2023-04-27
申请号：US18088009
申请日：2022-12-23
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Min Sung CHOI
IPC分类号： H01F27/29 , H01F41/10 , H01F17/04 , H01F17/00 , H01F41/04
摘要： An electronic component includes a magnetic body containing magnetic metal powder; and external electrodes disposed on an outer portion of the magnetic body. The external electrodes include first plating layers in direct contact with the magnetic body.

3. 发明申请

US20150380151A1 CHIP COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：芯线组件及其制造方法
公开(公告)号：US20150380151A1
公开(公告)日：2015-12-31
申请号：US14485444
申请日：2014-09-12
申请人： Samsung Electro-Mechanics Co., Ltd.
发明人： Min Sung CHOI
IPC分类号： H01F27/28 , H01F41/04
CPC分类号： H01F41/041 , H01F17/0013 , H01F17/0033 , H01F27/292
摘要： A chip coil component may include: a ceramic body including a plurality of insulating layers and having a bottom surface provided as a mounting surface and a top surface opposing the bottom surface, an internal coil part disposed in the ceramic body and having first and second lead-out portions exposed to both end surfaces of the ceramic body in a length direction thereof, an external electrode disposed on the bottom surface of the ceramic body, and plating spreading parts formed on both end surfaces of the ceramic body in the length direction and connecting the first and second lead-out portions and the external electrode to each other.
摘要翻译：芯片线圈部件可以包括：陶瓷体，其包括多个绝缘层，并且具有设置为安装表面的底面和与底面相对的顶表面;内部线圈部，其设置在陶瓷体中并具有第一和第二引线暴露于陶瓷体的长度方向的两端面的外部电极，设置在陶瓷体的底面的外部电极以及在长度方向上形成在陶瓷体的两端面的电镀扩散部，第一和第二引出部分和外部电极彼此。

4. 发明申请

US20160234979A1 ELECTRONIC COMPONENT AND BOARD HAVING THE SAME 审中-公开
标题翻译：具有相同功能的电子元件和板
公开(公告)号：US20160234979A1
公开(公告)日：2016-08-11
申请号：US14995084
申请日：2016-01-13
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Jae Wook LEE , Jae Yeol CHOI , Sung Kwon OH , Min Sung CHOI , Ji Hea KIM
IPC分类号： H05K9/00 , H01G4/012 , H01G4/236 , H01F27/29 , H05K1/11 , H05K1/18 , H01F27/28 , H01G4/12 , H01G4/30
CPC分类号： H01F27/292 , H01F17/0013 , H01F17/0033 , H01F2017/0066 , H01G2/06 , H01G4/012 , H01G4/1227 , H01G4/232 , H01G4/30 , H01G4/40 , H05K1/111 , H05K1/181 , H05K9/0026 , H05K2201/10015 , H05K2201/1003
摘要： An electronic component includes a body having a bottom surface provided as amounting surface, a top surface opposing the bottom surface, first and second side surfaces opposing each other in a width direction, and third and fourth end surfaces opposing each other in a length direction, a conductor part disposed therein, first and second external electrodes spaced apart from each other on the bottom surface of the body and connected to the conductor part, and a first insulating coating layer on the top surface of the body and a second insulating coating layer on the bottom surface of the body.
摘要翻译：电子部件包括具有设置为表面的底面的主体，与底面相对的顶面，在宽度方向上彼此相对的第一和第二侧表面以及沿长度方向彼此相对的第三和第四端面，布置在其中的导体部分，在主体的底表面上彼此间隔开并连接到导体部分的第一和第二外部电极，以及在主体的顶表面上的第一绝缘涂层和第二绝缘涂层身体的底面。

5. 发明申请

US20160217909A1 COIL COMPONENT 有权
标题翻译：线圈组件
公开(公告)号：US20160217909A1
公开(公告)日：2016-07-28
申请号：US14940128
申请日：2015-11-12
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Jong Ik PARK , Min Sung CHOI , Jae Yeol CHOI , Jin Mo AHN
IPC分类号： H01F27/28 , H01F27/255 , H01F27/29
CPC分类号： H01F17/0013 , H01F17/04 , H01F27/292 , H01F2017/048
摘要： A coil component includes a magnetic body including first and second coil patterns respectively disposed on first surfaces of two substrates spaced apart from each other and having cores and third and fourth coil patterns respectively disposed on second surfaces of the two substrates; and first to fourth external electrodes disposed on outer peripheral surfaces of the magnetic body and connected to the first to fourth coil patterns, respectively. A gap member is disposed between the two substrates while being located in at least one of upper and lower regions of the magnetic body in a thickness direction.
摘要翻译：线圈部件包括：磁体，其包括分别设置在彼此间隔开的两个基板的第一表面上的第一和第二线圈图案，并且具有分别设置在两个基板的第二表面上的芯和第三和第四线圈图案; 以及第一至第四外部电极，分别设置在所述磁性体的外周面上并与所述第一至第四线圈图案相连接。间隙构件设置在两个基板之间，同时沿厚度方向位于磁体的上部和下部区域中的至少一个中。

6. 发明申请

US20210043375A1 COIL ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME 有权
公开(公告)号：US20210043375A1
公开(公告)日：2021-02-11
申请号：US17083935
申请日：2020-10-29
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Min Sung CHOI
IPC分类号： H01F41/04 , H01F17/00 , H01F27/29 , H01F27/255
摘要： A coil electrode component includes a body including magnetic metal material, a coil disposed in the body and having first and second lead parts respectively outwardly exposed through first and second surfaces of the body. A first plating electrode is formed on the first surface of the body and a further surface of the body connected to and extended from the first surface of the body, and connected to the first lead part. A second plating electrode is formed on the second surface of the body and a further surface of the body connected to and extended from the second surface of the body, and connected to the second lead part.

7. 发明申请

US20160268038A1 COIL ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：线圈电子元件及其制造方法
公开(公告)号：US20160268038A1
公开(公告)日：2016-09-15
申请号：US14929169
申请日：2015-10-30
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Min Sung CHOI
IPC分类号： H01F27/28 , H01F41/04
CPC分类号： H01F41/041 , H01F17/0013 , H01F27/255 , H01F27/292
摘要： A coil electrode component includes a body including magnetic metal material, a coil disposed in the body and having first and second lead parts respectively outwardly exposed through first and second surfaces of the body. A first plating electrode is formed on the first surface of the body and a further surface of the body connected to and extended from the first surface of the body, and connected to the first lead part. A second plating electrode is formed on the second surface of the body and a further surface of the body connected to and extended from the second surface of the body, and connected to the second lead part.
摘要翻译：线圈电极部件包括：主体，其包括磁性金属材料;线圈，其设置在本体中，并具有分别通过主体的第一和第二表面向外暴露的第一和第二引线部分。第一电镀电极形成在主体的第一表面上，并且主体的另一表面连接到主体的第一表面并从主体的第一表面延伸并连接到第一引线部分。第二电镀电极形成在主体的第二表面上，并且主体的另一表面连接到主体的第二表面并从主体的第二表面延伸并且连接到第二引线部分。

8. 发明申请

US20160233029A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：多层陶瓷电子元件及其制造方法
公开(公告)号：US20160233029A1
公开(公告)日：2016-08-11
申请号：US14942692
申请日：2015-11-16
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Sung Kwon OH , Jae Wook LEE , Min Sung CHOI , Jae Yeol CHOI
IPC分类号： H01G4/30 , H01G4/012 , H01G4/12
CPC分类号： H01G4/30 , H01G4/012 , H01G4/12 , H01G4/232
摘要： A multilayer ceramic electronic component includes a ceramic body having a stacked plurality of dielectric layers and first and second end portions and a plurality of lateral surfaces. A plurality of internal electrodes stacked in the ceramic body face each other with respective dielectric layers interposed therebetween and exposed to first and second lateral surfaces of the ceramic body opposing each other through respective lead portions thereof. At least two first external electrodes and at least two second external electrodes are provided on the first and second lateral surfaces to be connected to the respective lead portions, respectively. An insulation layer is provided on the first and second lateral surfaces of the ceramic body except for the first and second external electrodes.
摘要翻译：多层陶瓷电子部件包括陶瓷体，该陶瓷体具有堆叠的多个电介质层以及第一和第二端部以及多个侧面。堆叠在陶瓷体中的多个内部电极彼此相对地分别插入各自的电介质层，并且暴露于陶瓷体的通过其引线部相互相对的第一和第二侧面。至少两个第一外部电极和至少两个第二外部电极分别设置在第一和第二侧表面上以分别连接到相应的引线部分。绝缘层设置在除了第一和第二外部电极之外的陶瓷体的第一和第二侧表面上。

9. 发明申请

US20160225517A1 ELECTRONIC COMPONENT, AND METHOD OF MANUFACTURING THEREOF 审中-公开
标题翻译：电子元件及其制造方法
公开(公告)号：US20160225517A1
公开(公告)日：2016-08-04
申请号：US15011150
申请日：2016-01-29
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Min Sung CHOI
IPC分类号： H01F27/29 , H01F41/04 , H01F27/245 , H01F41/02 , H01F27/255 , H01F27/28
CPC分类号： H01F27/292 , H01F17/0013 , H01F17/04 , H01F41/046 , H01F41/10 , H01F2017/048
摘要： An electronic component includes a magnetic body containing magnetic metal powder; and external electrodes disposed on an outer portion of the magnetic body. The external electrodes include first plating layers in direct contact with the magnetic body.
摘要翻译：电子部件包括含有磁性金属粉末的磁性体; 以及设置在磁体外部的外部电极。外部电极包括与磁体直接接触的第一镀层。

10. 发明申请

US20150123757A1 CHIP ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：芯片电子元件及其制造方法
公开(公告)号：US20150123757A1
公开(公告)日：2015-05-07
申请号：US14259053
申请日：2014-04-22
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Min Sung CHOI
IPC分类号： H01F27/28 , H01F41/04
CPC分类号： H01F41/046 , H01F17/0013 , H01F17/04 , H01F27/292 , Y10T29/49078
摘要： A chip electronic component may include an insulating layer formed on a lower portion of a side surface of an internal coil pattern to avoid a direct contact between the internal coil pattern and a magnetic material, thereby preventing a waveform distortion indicating a reduction in inductance at high frequency.
摘要翻译：芯片电子部件可以包括形成在内部线圈图案的侧面的下部的绝缘层，以避免内部线圈图案和磁性材料之间的直接接触，从而防止表示电感下降的波形失真高频率。

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