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1. 发明申请

US20220189698A1 MULTILAYER CAPACITOR AND BOARD FOR MOUNTING THE SAME 有权
公开(公告)号：US20220189698A1
公开(公告)日：2022-06-16
申请号：US17371789
申请日：2021-07-09
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Dong Hoon KEUM , Dong Seuk KIM , Geon Yong LEE , Seong Gu KANG , Young Hoon SONG
IPC分类号： H01G4/30 , H01G4/012 , H01G4/12 , H01G2/06
摘要： A multilayer capacitor includes a capacitor body including first to sixth surfaces and including a plurality of dielectric layers and first and second internal electrodes alternately disposed with the dielectric layers interposed therebetween, and first and second external electrodes disposed on the third and fourth surfaces of the capacitor body and connected to the first and second internal electrodes, respectively, wherein the capacitor body includes an active region in which the first and second internal electrodes overlap in a first direction, and at least a portion of a margin portion excluding the active region in the capacitor body has a ratio of Ba to Ti less than 1 (Ba/Ti

2. 发明申请

US20230084504A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF 有权
公开(公告)号：US20230084504A1
公开(公告)日：2023-03-16
申请号：US17984667
申请日：2022-11-10
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Hyung Duk YUN , Young Hoon SONG , Dong Hwi SHIN , Seon Young YOO , Yu Seop LEE
IPC分类号： H01G4/012 , H01G4/30 , H01G4/232 , H01G4/008
摘要： A multilayer ceramic electronic component includes a ceramic body having a capacitance forming portion in which first and second internal electrodes are alternately laminated with respective dielectric layers interposed therebetween, and first and second external electrodes respectively disposed on surfaces of the ceramic body. The first and second internal electrodes are respectively exposed to surfaces of the ceramic body, and first and second protrusions, each including a carbon compound, are respectively disposed on end portions of the first and second internal electrodes exposed to the surfaces of the ceramic body.

3. 发明申请

US20210217561A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT 有权
公开(公告)号：US20210217561A1
公开(公告)日：2021-07-15
申请号：US17060374
申请日：2020-10-01
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Hyung Duk YUN , Seonyoung YOO , Hong Gi KIM , Byeongguk CHOI , Young Hoon SONG , Yuseop LEE , A Ra CHO , Donghwi SHIN
IPC分类号： H01G4/30 , H01G4/012 , H01G4/008 , H01G4/232 , H01G4/12
摘要： A multilayer ceramic electronic component includes a ceramic body having a dielectric layer, and a capacitance forming portion disposed in such a manner that first and second internal electrodes are stacked with the dielectric layer interposed therebetween, and first and second external electrodes disposed on the ceramic body, respectively, the first and second external electrodes including first and second base electrodes connected to the first and second internal electrodes, respectively, and first and second conductive layers disposed to cover the first and second base electrodes, respectively. The first and second conductive layers have a thickness in a range of 0.1 μm to 10 μm.

4. 发明申请

US20230093953A1 METHOD OF PRODUCING CORE-SHELL PARTICLES AND MULTILAYER CERAMIC ELECTRONIC COMPONENT INCLUDING CORE-SHELL PARTICLES 有权
公开(公告)号：US20230093953A1
公开(公告)日：2023-03-30
申请号：US17992463
申请日：2022-11-22
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Jin Sung CHUN , Hae Suk CHUNG , Byung Sung KANG , Yun Jung PARK , Young Hoon SONG
IPC分类号： H01G4/12 , H01G4/30 , C04B35/626 , H01G4/012
摘要： A method of producing a core-shell particle includes introducing a barium titanate-based base powder and an additive to a reactor, and exposing the barium titanate-based base powder and the additive to a thermal plasma torch to obtain core-shell particles including a core portion having barium titanate (BaTiO3) and a shell portion including the additive and formed on a surface of the core portion.

5. 发明申请

US20210175016A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT 有权
公开(公告)号：US20210175016A1
公开(公告)日：2021-06-10
申请号：US16867706
申请日：2020-05-06
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Hyung Duk YUN , Seonyoung YOO , Byeongguk CHOI , Young Hoon SONG , Yuseop LEE , A Ra CHO , Dong Hwi SHIN
IPC分类号： H01G4/232
摘要： A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and first and second internal electrodes stacked with the dielectric layer interposed therebetween, and including first and second external electrodes disposed on the fifth surface and the sixth surface of the ceramic body, respectively, the first and second external electrodes include first and second base electrodes including a first conductive metal and reactive glass, in contact with the ceramic body, and first and second conductive layers including and a second conductive metal, disposed on the first and second base electrodes, and a nanostructure may be disposed on surfaces of the first and second conductive layers.

6. 发明申请

US20210159013A1 METHOD OF PRODUCING CORE-SHELL PARTICLES AND MULTILAYER CERAMIC ELECTRONIC COMPONENT INCLUDING CORE-SHELL PARTICLES 有权
公开(公告)号：US20210159013A1
公开(公告)日：2021-05-27
申请号：US16864728
申请日：2020-05-01
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Jin Sung CHUN , Hae Suk CHUNG , Byung Sung KANG , Yun Jung PARK , Young Hoon SONG
IPC分类号： H01G4/12 , H01G4/30 , H01G4/012 , C04B35/626
摘要： A method of producing a core-shell particle includes introducing a barium titanate-based base powder and an additive to a reactor, and exposing the barium titanate-based base powder and the additive to a thermal plasma torch to obtain core-shell particles including a core portion having barium titanate (BaTiO3) and a shell portion including the additive and formed on a surface of the core portion.

7. 发明申请

US20210193387A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF 有权
公开(公告)号：US20210193387A1
公开(公告)日：2021-06-24
申请号：US16940777
申请日：2020-07-28
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Hyung Duk YUN , Young Hoon SONG , Dong Hwi SHIN , Seon Young YOO , Yu Seop LEE
IPC分类号： H01G4/012 , H01G4/008 , H01G4/232 , H01G4/30
摘要： A multilayer ceramic electronic component includes a ceramic body having a capacitance forming portion in which first and second internal electrodes are alternately laminated with respective dielectric layers interposed therebetween, and first and second external electrodes respectively disposed on surfaces of the ceramic body. The first and second internal electrodes are respectively exposed to surfaces of the ceramic body, and first and second protrusions, each including a carbon compound, are respectively disposed on end portions of the first and second internal electrodes exposed to the surfaces of the ceramic body.

8. 发明申请

US20130094123A1 CHIP TYPE LAMINATED CAPACITOR 有权
标题翻译：芯片型层压电容器
公开(公告)号：US20130094123A1
公开(公告)日：2013-04-18
申请号：US13693947
申请日：2012-12-04
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Young Ghyu AHN , Byoung Hwa LEE , Min Cheol PARK , Young Hoon SONG , Mi Hee LEE
IPC分类号： H01G4/12
CPC分类号： H01G4/1272 , H01G2/065 , H01G4/005 , H01G4/12 , H01G4/228 , H01G4/232 , H01G4/30
摘要： There is provided a chip type laminated capacitor including: a ceramic body formed by laminating a dielectric layer having a thickness equal to 10 or more times an average particle diameter of a grain included therein and being 3 μm or less; first and second outer electrodes; a first inner electrode having one end forming a first margin together with one end surface of the ceramic body at which the second outer electrode is formed and the other end leading to the first outer electrode; and a second inner electrode having one end forming a second margin together with the other end surface of the ceramic body at which the first outer electrode is formed and the other end leading to the second outer electrode, wherein the first and second margins have different widths under a condition that they are 200 μm or less.
摘要翻译：提供一种片式叠层电容器，其包括：陶瓷体，其通过层叠厚度等于其中包含的颗粒的平均粒径的10倍或更多倍的3μm或更小的电介质层而形成; 第一和第二外部电极; 第一内部电极，其一端与形成有第二外部电极的陶瓷体的一个端面一起形成第一边缘，而另一端通向第一外部电极; 以及第二内部电极，其一端与形成有第一外部电极的陶瓷体的另一个端面一起形成第二边缘，另一端通向第二外部电极，其中第一和第二边缘具有不同的宽度条件是他们是200毫米或更少。

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