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1. 发明申请

US20220278011A1 SEMICONDUCTOR PACKAGE 有权
公开(公告)号：US20220278011A1
公开(公告)日：2022-09-01
申请号：US17749825
申请日：2022-05-20
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Sunghawn BAE , Doohwan LEE , Jooyoung CHOI
IPC分类号： H01L23/31 , H01L21/48 , H01L23/498 , H01L23/00 , H01L23/373 , H01L23/367
摘要： Provided is method of manufacturing a semiconductor device. The method includes: forming a metal layer on a carrier; forming a conductor pattern layer on the metal layer; mounting a semiconductor chip on a tape; forming an encapsulant covering the semiconductor chip; attaching the conductor pattern layer to the encapsulant; removing the tape; and forming a connection structure electrically connected to the semiconductor chip in an area from which the tape is removed.

2. 发明申请

US20210407962A1 SEMICONDUCTOR PACKAGE 有权
公开(公告)号：US20210407962A1
公开(公告)日：2021-12-30
申请号：US17154789
申请日：2021-01-21
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Hongwon KIM , Junmo KOO , Yeonjoo KIM , Yunhee KIM , Jongkook KIM , Doohwan LEE , Jeongho LEE
IPC分类号： H01L25/065 , H01L23/538 , H01L23/31 , H01L23/498 , H01L23/00
摘要： A semiconductor package includes a base substrate, an interposer package disposed on the base substrate, and first and second semiconductor chips disposed on the interposer package, the interposer package includes a first redistribution layer, a bridge chip including a bridge circuit, and a vertical connection structure including a plurality of wiring layers, and wherein each of the first semiconductor chip and the second semiconductor chip is electrically connected to the bridge circuit and the plurality of wiring layers through the first redistribution layer.

3. 发明申请

US20210407924A1 SEMICONDUCTOR PACKAGE 有权
公开(公告)号：US20210407924A1
公开(公告)日：2021-12-30
申请号：US17306555
申请日：2021-05-03
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Jeongho LEE , Doohwan LEE
IPC分类号： H01L23/538 , H01L25/10 , H01L25/18 , H01L23/00 , H01L23/31 , H01L21/683 , H01L21/48 , H01L21/56
摘要： A semiconductor package includes a frame structure having a core portion and a lower pad under the core portion. A cavity penetrates the core portion, and a semiconductor chip is arranged in the cavity and has an active surface on which a bump pad is arranged and a non-active surface facing the active surface. A redistribution structure is positioned under the frame structure and the semiconductor chip, and is connected to the lower pad and the bump pad. A molding member covers the frame structure and the semiconductor chip and fills the cavity. The molding member surrounds a lower surface of the frame structure, the active surface of the semiconductor chip, the lower pad, and the bump pad.

4. 发明公开

US20240145397A1 SEMICONDUCTOR PACKAGE 审中-公开
公开(公告)号：US20240145397A1
公开(公告)日：2024-05-02
申请号：US18403583
申请日：2024-01-03
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Jeongho LEE , Doohwan LEE
IPC分类号： H01L23/538 , H01L21/48 , H01L21/56 , H01L21/683 , H01L23/00 , H01L23/31 , H01L25/10 , H01L25/18
CPC分类号： H01L23/5389 , H01L21/4853 , H01L21/4857 , H01L21/565 , H01L21/568 , H01L21/6835 , H01L23/3128 , H01L23/3135 , H01L23/5383 , H01L23/5386 , H01L24/16 , H01L24/19 , H01L24/20 , H01L25/105 , H01L25/18 , H01L2221/68372 , H01L2224/16227 , H01L2224/214 , H01L2225/1035 , H01L2225/1058 , H01L2924/1431 , H01L2924/1434 , H01L2924/18161
摘要： A semiconductor package includes a frame structure having a core portion and a lower pad under the core portion. A cavity penetrates the core portion, and a semiconductor chip is arranged in the cavity and has an active surface on which a bump pad is arranged and a non-active surface facing the active surface. A redistribution structure is positioned under the frame structure and the semiconductor chip, and is connected to the lower pad and the bump pad. A molding member covers the frame structure and the semiconductor chip and fills the cavity. The molding member surrounds a lower surface of the frame structure, the active surface of the semiconductor chip, the lower pad, and the bump pad.

5. 发明申请

US20210384991A1 ANTENNA MODULE INCLUDING COMMUNICATION MODULE CAPABLE OF DETERMINING ABNORMALITY OF TRANSMISSION OR RECEPTION PATH 有权
公开(公告)号：US20210384991A1
公开(公告)日：2021-12-09
申请号：US17285943
申请日：2019-10-22
申请人： Samsung Electronics Co., Ltd.
发明人： Dongil YANG , Seonjun KIM , Jonghyun PARK , Doohwan LEE , Jongin LEE
IPC分类号： H04B17/17 , H04B17/318
摘要： Disclosed is an antenna module, which include a first antenna element, a second antenna element, and a communication module that includes a first transmit path and a first receive path connected with the first antenna element, a second transmit path and a second receive path connected with the second antenna element, and a detection circuit connected with at least a part of the second receive path. The communication module may output a specified signal by using the first transmit path and the first antenna element based at least on obtaining a request for identifying a state of the antenna module from an external device, may obtain the output specified signal by using the second receive path and the second antenna element, may identify an intensity of the obtained specified signal by using the detection circuit, and may determine whether the antenna module is abnormal, based at least on the intensity of the obtained specified signal. Moreover, various embodiment found through the present disclosure are possible.

6. 发明申请

US20230136122A1 SWITCH AND ELECTRONIC DEVICE INCLUDING THE SAME 有权
公开(公告)号：US20230136122A1
公开(公告)日：2023-05-04
申请号：US18077882
申请日：2022-12-08
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Dongil YANG , Taeyoung KIM , Hyoseok NA , Jonghyun PARK , Doohwan LEE
IPC分类号： H01H9/54 , H01H9/02
摘要： A switch in an electronic device includes a substrate, a first signal line, a second signal line, and a ground bridge. The first signal line is on the substrate and extends in a first direction. The second signal line is on the substrate and is spaced apart from the first signal line in a first direction parallel with the first signal line to branch the wireless communication signal at a first point and a second point of the first signal line. The ground bridge is at least partially movable in a space between the first signal line and the second signal line. A first capacitor is between a first point of the first signal line and one end of the second signal line, and a second capacitor is between a second point of the first signal line and the other end of the second signal line.

7. 发明申请

US20230060618A1 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME 有权
公开(公告)号：US20230060618A1
公开(公告)日：2023-03-02
申请号：US17752083
申请日：2022-05-24
申请人： Samsung Electronics Co., Ltd.
发明人： Jeongho LEE , Doohwan LEE
IPC分类号： H01L23/498 , H01L25/10 , H01L21/48
摘要： A semiconductor package includes a redistribution portion including an insulating layer, a redistribution layer, and a redistribution via, an under-bump metallurgy (UBM) layer below the redistribution portion and including a UBM pad on a lower surface of the redistribution portion and a UBM via on the UBM pad to penetrate through the insulating layer, a semiconductor chip on an upper surface of the redistribution portion and electrically connected to the redistribution layer, an adhesive layer between the UBM layer and the insulating layer and including a conductive material, and a connection bump below the UBM pad and connected to the UBM layer. The UBM pad has a first diameter, and the UBM via has a second diameter, less than the first diameter, and an upper surface of the UBM pad is located on the same level as, or a level lower than, a lower surface of the insulating layer.

8. 发明申请

US20210202303A1 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME 有权
公开(公告)号：US20210202303A1
公开(公告)日：2021-07-01
申请号：US16983298
申请日：2020-08-03
申请人： Samsung Electronics Co., Ltd.
发明人： Dowan KIM , Doohwan LEE , Seunghwan BAEK
IPC分类号： H01L21/768 , H01L23/538 , H01L23/31 , H01L23/00
摘要： A method of manufacturing a semiconductor package may include forming a first substrate including a redistribution layer, providing a second substrate including a semiconductor chip and an interconnection layer on the first substrate to connect the semiconductor chip to the redistribution layer, forming a first encapsulation layer covering the second substrate, and forming a via structure penetrating the first encapsulation layer. The forming the via structure may include forming a first via hole in the first encapsulation layer, forming a photosensitive material layer in the first via hole, exposing and developing the photosensitive material layer in the first via hole to form a second encapsulation layer having a second via hole, and filling the second via hole with a conductive material. A surface roughness of a sidewall of the first encapsulation layer may be greater than a surface roughness of a sidewall of the second encapsulation layer.

9. 发明申请

US20220230912A1 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME 有权
公开(公告)号：US20220230912A1
公开(公告)日：2022-07-21
申请号：US17714546
申请日：2022-04-06
申请人： Samsung Electronics Co., Ltd.
发明人： Dowan KIM , Doohwan LEE , Seunghwan BAEK
IPC分类号： H01L21/768 , H01L23/538 , H01L23/00 , H01L23/31
摘要： A method of manufacturing a semiconductor package may include forming a first substrate including a redistribution layer, providing a second substrate including a semiconductor chip and an interconnection layer on the first substrate to connect the semiconductor chip to the redistribution layer, forming a first encapsulation layer covering the second substrate, and forming a via structure penetrating the first encapsulation layer. The forming the via structure may include forming a first via hole in the first encapsulation layer, forming a photosensitive material layer in the first via hole, exposing and developing the photosensitive material layer in the first via hole to form a second encapsulation layer having a second via hole, and filling the second via hole with a conductive material. A surface roughness of a sidewall of the first encapsulation layer may be greater than a surface roughness of a sidewall of the second encapsulation layer.

10. 发明申请

US20220209810A1 ELECTRONIC DEVICE AND METHOD FOR WIRELESS COMMUNICATION 有权
公开(公告)号：US20220209810A1
公开(公告)日：2022-06-30
申请号：US17562333
申请日：2021-12-27
申请人： Samsung Electronics Co., Ltd.
发明人： Yousung LEE , Dongil YANG , Hyoseok NA , Doohwan LEE
IPC分类号： H04B1/44 , H03F3/24
摘要： The disclosure relates to an electronic device and a method for wireless communication including a power amplification circuit. According to an embodiment, an electronic device may include: a radio frequency processing module comprising radio frequency circuitry, a first power amplification circuit connected to the radio frequency processing module, a second power amplification circuit connected to the radio frequency processing module and the first power amplification circuit, and a front-end module comprising circuitry connected to the second power amplification circuit and an antenna and configured to transmit a signal, wherein the second power amplification circuit is configured to acquire, from the first power amplification circuit, a first signal obtained by amplifying a signal output from the radio frequency processing module and a second signal by amplifying a signal output from the radio frequency processing module, based on a combination of frequency bands for a first communication scheme and a second communication scheme, and switch at least one of the first signal or the second signal to at least one output port connected to the front-end module, based on a first frequency band of the first signal and a second frequency band of the second signal. Other embodiments are also possible.

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