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1. 发明授权

US09123623B2 Semiconductor light emitting device having multi-cell array and method of manufacturing the same 有权
标题翻译：具有多单元阵列的半导体发光器件及其制造方法
公开(公告)号：US09123623B2
公开(公告)日：2015-09-01
申请号：US13933887
申请日：2013-07-02
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Su Hyun Jo , Jong Ho Lee , Jin Hyun Lee , Chan Mook Lim , Jin Hwan Kim
IPC分类号： H01L29/15 , H01L27/15 , H01L33/00 , H01L33/20
CPC分类号： H01L27/15 , H01L27/156 , H01L33/005 , H01L33/20 , H01L2933/0016
摘要： A method of manufacturing a semiconductor light emitting device having a multi-cell array, including: sequentially forming a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer on a substrate; etching and removing portions of the second conductive semiconductor layer and the active layer so as to expose portions of an upper surface of the first conductive semiconductor layer corresponding to respective regions of the second conductive semiconductor layer spaced apart from one another; and separating light emitting cells by partially etching the exposed portions of the first conductive semiconductor layer, wherein the separating of the light emitting cells is not performed at an edge portion of the substrate.
摘要翻译：一种制造具有多单元阵列的半导体发光器件的方法，包括：在衬底上依次形成第一导电半导体层，有源层和第二导电半导体层; 蚀刻和去除所述第二导电半导体层和所述有源层的部分，以便暴露所述第一导电半导体层的与所述第二导电半导体层彼此间隔开的相应区域的上表面的部分; 以及通过部分蚀刻所述第一导电半导体层的暴露部分来分离发光单元，其中在所述基板的边缘部分处不发生所述发光单元的分离。

2. 发明授权

US08957431B2 Semiconductor light emitting device having multi-cell array 有权
标题翻译：具有多单元阵列的半导体发光器件
公开(公告)号：US08957431B2
公开(公告)日：2015-02-17
申请号：US13786542
申请日：2013-03-06
申请人： Samsung Electronics Co., Ltd.
发明人： Chan Mook Lim , Jong Ho Lee , Jin Hwan Kim , Young Chul Shin , Su Hyun Jo , Jin Hyun Lee
IPC分类号： H01L33/00 , H01L27/15 , H01L33/38
CPC分类号： H01L27/153 , H01L33/38
摘要： A semiconductor light emitting device (LED) includes a first light emitting cell having a first plurality of electrodes. A second light emitting cell includes a second plurality of electrodes. The first and second light emitting cells are disposed on the substrate and are physically separated from each other. A first interconnection unit electrically connects the first plurality of electrodes to the second plurality of the electrodes.
摘要翻译：半导体发光器件（LED）包括具有第一多个电极的第一发光元件。第二发光单元包括第二多个电极。第一和第二发光单元被布置在基板上并且在物理上彼此分离。第一互连单元将第一多个电极电连接到第二多个电极。

3. 发明申请

US20160163925A1 SEMICONDUCTOR LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：半导体发光器件及其制造方法
公开(公告)号：US20160163925A1
公开(公告)日：2016-06-09
申请号：US14958002
申请日：2015-12-03
申请人： Samsung Electronics Co., Ltd.
发明人： Su Hyun Jo , Ki Seok Kim , Seong Seok Yang , Yong Il Kim , Seung Hwan Lee
IPC分类号： H01L33/22 , H01L33/32 , H01L33/58
CPC分类号： H01L33/44 , H01L33/20 , H01L2224/48091 , H01L2224/48227 , H01L2224/48237 , H01L2224/48247 , H01L2224/48257 , H01L2224/49107 , H01L2224/73265 , H01L2224/8592 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： A semiconductor light-emitting device includes a light-emitting structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer, microstructures regularly arranged on the first conductivity-type semiconductor layer around the light-emitting structure, and a gradient refractive layer on at least a portion of the microstructures, the gradient refractive layer having a lower refractive index than the first conductivity-type semiconductor layer.
摘要翻译：一种半导体发光器件包括包括第一导电型半导体层，有源层和第二导电型半导体层的发光结构，在发光二极管周围的第一导电型半导体层上规则排列的微结构结构，以及至少部分微结构的梯度折射层，所述梯度折射层具有比所述第一导电类型半导体层低的折射率。

4. 发明申请

US20130234170A1 SEMICONDUCTOR LIGHT EMITTING DEVICE HAVING MULTI-CELL ARRAY 有权
标题翻译：具有多个细胞阵列的半导体发光器件
公开(公告)号：US20130234170A1
公开(公告)日：2013-09-12
申请号：US13786542
申请日：2013-03-06
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Chan Mook Lim , Jong Ho Lee , Jin Hwan Kim , Young Chul Shin , Su Hyun Jo , Jin Hyun Lee
IPC分类号： H01L27/15
CPC分类号： H01L27/153 , H01L33/38
摘要： A semiconductor light emitting device (LED) includes a first light emitting cell having a first plurality of electrodes. A second light emitting cell includes a second plurality of electrodes. The first and second light emitting cells are disposed on the substrate and are physically separated from each other. A first interconnection unit electrically connects the first plurality of electrodes to the second plurality of the electrodes.
摘要翻译：半导体发光器件（LED）包括具有第一多个电极的第一发光单元。第二发光单元包括第二多个电极。第一和第二发光单元被布置在基板上并且在物理上彼此分离。第一互连单元将第一多个电极电连接到第二多个电极。

5. 发明授权

US10700246B2 Semiconductor light emitting device 有权
公开(公告)号：US10700246B2
公开(公告)日：2020-06-30
申请号：US16299422
申请日：2019-03-12
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Sung Hyun Sim , Yong Il Kim , Ha Nul Yoo , Ji Hye Yeon , Jun Bu Youn , Ji Hoon Yun , Su Hyun Jo
IPC分类号： H01L33/54 , H01L33/50 , H01L33/60 , H01L33/62
摘要： A semiconductor light emitting device includes a plurality of light emitting structures, an isolation layer covering side surfaces of the plurality of light emitting structures and insulating the plurality of light emitting structures from one another, a partition layer formed on the isolation layer, a first protective layer covering top surfaces of the plurality of light emitting structures and side walls of the partition layer, a reflective layer covering the first protective layer and disposed on the side walls of the partition layer, and a second protective layer covering the reflective layer.

6. 发明授权

US10573632B2 Method of manufacturing display module using LED 有权
公开(公告)号：US10573632B2
公开(公告)日：2020-02-25
申请号：US16185602
申请日：2018-11-09
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Ji Hye Yeon , Su Hyun Jo , Sung Hyun Sim , Ha Nul Yoo , Yong Il Kim , Han Kyu Seong
IPC分类号： H01L25/18 , H01L27/12 , H01L33/50 , H01L25/00 , H01L23/00 , H01L27/15
摘要： A method of manufacturing a display module includes preparing a first substrate structure including an light-emitting diode (LED) array containing a plurality of LED cells, electrode pads connected to the first and second conductivity-type semiconductor layers, and a first bonding layer covering the LED array; preparing a second substrate structure including a plurality of thin-film transistor (TFT) cells disposed on a second substrate, and each having a source region, a drain region and a gate electrode disposed therebetween, the second substrate structure being provided by forming a circuit region, in which connection portions disposed to correspond to the electrode pads are exposed to one surface thereof, and by forming a second bonding layer covering the circuit region, respectively planarizing the first and second bonding layers, and bonding the first and second substrate structures to each other.

7. 发明授权

US09300111B2 Semiconductor light emitting device 有权
标题翻译：半导体发光器件
公开(公告)号：US09300111B2
公开(公告)日：2016-03-29
申请号：US14154556
申请日：2014-01-14
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Jong Ho Lee , Chan Mook Lim , Young Chul Shin , Su Hyun Jo
IPC分类号： H01L33/00 , H01S5/02 , H01L33/38 , H01L33/44
CPC分类号： H01S5/02 , H01L33/0079 , H01L33/382 , H01L33/44
摘要： A semiconductor light emitting device includes a conductive substrate, a light emitting laminate including a second conductivity type semiconductor layer, an active layer, and a first conductivity type semiconductor layer stacked on the conductive substrate, a first electrode layer electrically connected to the first conductivity type semiconductor layer, a second electrode layer between the conductive substrate and the second conductivity type semiconductor layer, the second electrode layer being electrically connected to the second conductivity type semiconductor layer, and a passivation layer between the active layer and the second electrode layer, the passivation layer covering at least a lateral surface of the active layer of the light emitting laminate.
摘要翻译：半导体发光器件包括导电衬底，层叠在导电衬底上的第二导电型半导体层，有源层和第一导电型半导体层的发光层叠体，与第一导电型电连接的第一电极层半导体层，在导电基板和第二导电类型半导体层之间的第二电极层，第二电极层电连接到第二导电类型半导体层，以及在有源层和第二电极层之间的钝化层，钝化层层覆盖发光层压板的有源层的至少一个侧表面。

8. 发明授权

US11075326B2 Semiconductor light emitting device 有权
公开(公告)号：US11075326B2
公开(公告)日：2021-07-27
申请号：US16913201
申请日：2020-06-26
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Sung Hyun Sim , Yong Il Kim , Ha Nul Yoo , Ji Hye Yeon , Jun Bu Youn , Ji Hoon Yun , Su Hyun Jo
IPC分类号： H01L33/50 , H01L33/54 , H01L33/60 , H01L33/62
摘要： A semiconductor light emitting device includes a plurality of light emitting structures, an isolation layer covering side surfaces of the plurality of light emitting structures and insulating the plurality of light emitting structures from one another, a partition layer formed on the isolation layer, a first protective layer covering top surfaces of the plurality of light emitting structures and side walls of the partition layer, a reflective layer covering the first protective layer and disposed on the side walls of the partition layer, and a second protective layer covering the reflective layer.

9. 发明授权

US10797040B2 Method of manufacturing display module using LED 有权
公开(公告)号：US10797040B2
公开(公告)日：2020-10-06
申请号：US16798027
申请日：2020-02-21
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Ji Hye Yeon , Su Hyun Jo , Sung Hyun Sim , Ha Nul Yoo , Yong Il Kim , Han Kyu Seong
IPC分类号： H01L29/00 , H01L27/12 , H01L33/50 , H01L25/00 , H01L23/00 , H01L25/18 , H01L27/15
摘要： A method of manufacturing a display module includes preparing a first substrate structure including an light-emitting diode (LED) array containing a plurality of LED cells, electrode pads connected to the first and second conductivity-type semiconductor layers, and a first bonding layer covering the LED array; preparing a second substrate structure including a plurality of thin-film transistor (TFT) cells disposed on a second substrate, and each having a source region, a drain region and a gate electrode disposed therebetween, the second substrate structure being provided by forming a circuit region, in which connection portions disposed to correspond to the electrode pads are exposed to one surface thereof, and by forming a second bonding layer covering the circuit region, respectively planarizing the first and second bonding layers, and bonding the first and second substrate structures to each other.

10. 发明授权

US08981396B2 Semiconductor light emitting device, light emitting module, and illumination apparatus 有权
标题翻译：半导体发光器件，发光模块和照明设备
公开(公告)号：US08981396B2
公开(公告)日：2015-03-17
申请号：US13770710
申请日：2013-02-19
申请人： Samsung Electronics Co., Ltd.
发明人： Jin Hyun Lee , Bum Joon Kim , Seung Wan Chae , Chan Mook Lim , Jong Ho Lee , Jin Hwan Kim , Su Hyun Jo
IPC分类号： H01L29/207 , H01L33/08 , H01L27/15 , H01L33/38 , H01L33/62 , F21V29/00 , F21V3/00 , F21K99/00 , F21V15/01 , F21Y101/02
CPC分类号： H01L33/08 , F21K9/23 , F21V3/00 , F21V29/507 , F21V29/74 , F21Y2115/10 , H01L27/156 , H01L33/38 , H01L33/62 , H01L2224/48091 , H01L2924/00014
摘要： A semiconductor light emitting device includes a substrate, a semiconductor laminate having a base semiconductor layer, a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer sequentially formed on the substrate and divided by an isolation region to provide a plurality of light emitting cells, an intermediate separation layer interposed between the base semiconductor layer and the first conductivity-type semiconductor layer, a plurality of first and second electrodes connected to the first and second conductivity-type semiconductor layers, respectively, of the plurality of light emitting cells, and a wiring unit connecting the first and second electrodes of different light emitting cells.
摘要翻译：半导体发光器件包括基板，具有基底半导体层，第一导电型半导体层，有源层和第二导电型半导体层的半导体层叠体，其顺序地形成在基板上并被隔离区域划分为提供多个发光单元，插入在所述基底半导体层和所述第一导电型半导体层之间的中间分离层，分别连接到所述第一和第二导电类型半导体层的多个第一和第二电极多个发光单元，以及连接不同发光单元的第一和第二电极的布线单元。

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