会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 7. 发明授权
    • Electronic components and glasses
    • US11627399B2
    • 2023-04-11
    • US17646865
    • 2022-01-03
    • SHENZHEN SHOKZ CO., LTD.
    • Yueqiang WangYongjian LiYunbin ChenHaofeng Zhang
    • H04R1/08G02C11/00H04R1/04H04R1/40H04R1/46H04R3/00
    • The present disclosure relates to electronic components and glasses comprising an electronic component. The electronic component may include a component body, a first circuit board, a second circuit board, a first microphone element, and a second microphone element. The component body may include a cavity. The first circuit board and the second circuit board may be inclined to each arranged in the cavity. The first microphone element may be arranged on a sidewall, facing the component body, of the first circuit board. The second microphone element may be arranged on a sidewall, facing the component body, of the second circuit board. A first sound conducting hole may be arranged on a sidewall, opposite to the first microphone element, of the component body. The first sound conducting hole may be configured to conduct a sound to the first microphone element. A second sound conducting hole may be arranged on the sidewall, opposite to the first microphone element, of the component body. The second sound conducting hole may be configured to conduct a sound to the second microphone element. The present disclosure may make full use of a space of the electronic component. When the electronic component is applied to an electronic device, it is beneficial to the thinness and lightness of the electronic device.
    • 9. 发明授权
    • Electronic components and glasses
    • US11272278B2
    • 2022-03-08
    • US17172068
    • 2021-02-09
    • SHENZHEN SHOKZ CO., LTD.
    • Yueqiang WangYongjian LiYunbin ChenHaofeng Zhang
    • H04R1/08G02C11/00H04R1/04H04R1/40H04R1/46H04R3/00
    • The present disclosure relates to electronic components and glasses comprising an electronic component. The electronic component may include a component body, a first circuit board, a second circuit board, a first microphone element, and a second microphone element. The component body may include a cavity. The first circuit board and the second circuit board may be inclined to each arranged in the cavity. The first microphone element may be arranged on a sidewall, facing the component body, of the first circuit board. The second microphone element may be arranged on a sidewall, facing the component body, of the second circuit board. A first sound conducting hole may be arranged on a sidewall, opposite to the first microphone element, of the component body. The first sound conducting hole may be configured to conduct a sound to the first microphone element. A second sound conducting hole may be arranged on the sidewall, opposite to the first microphone element, of the component body. The second sound conducting hole may be configured to conduct a sound to the second microphone element. The present disclosure may make full use of a space of the electronic component. When the electronic component is applied to an electronic device, it is beneficial to the thinness and lightness of the electronic device.