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1. 发明申请

US20130220687A1 WAFER PROCESS BODY, WAFER PROCESSING MEMBER, WAFER PROCESSING TEMPORARY ADHESIVE MATERIAL, AND METHOD FOR MANUFACTURING THIN WAFER 有权
标题翻译：加工过程体系，波浪加工部件，加工时间短的胶粘材料，以及制造薄膜的方法
公开(公告)号：US20130220687A1
公开(公告)日：2013-08-29
申请号：US13770513
申请日：2013-02-19
申请人： SHIN-ETSU CHEMICAL CO., LTD.
发明人： Shohei TAGAMI , Michihiro SUGO , Hiroyuki YASUDA , Masahiro FURUYA , Hideto KATO
IPC分类号： C09J7/00 , H01L21/304
CPC分类号： C09J7/00 , C09J7/22 , C09J7/30 , C09J2201/122 , C09J2201/36 , C09J2203/326 , C09J2483/00 , H01L21/304 , H01L21/6835 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , Y10T428/2852
摘要： Disclosed is a wafer process body, a temporary adhesive layer is formed on a supporting body, and a wafer having a circuit-formed front surface and a to-be-processed back surface is stacked on the temporary adhesive layer, wherein the temporary adhesive layer is provided with a first temporary adhesive layer including a non-aromatic saturated hydrocarbon group-containing organopolysiloxane layer (A) which is adhered to the front surface of the wafer so as to be detachable and a second temporary adhesive layer comprised of a thermosetting-modified siloxane polymer layer (B) which is stacked on the first temporary adhesive layer and adhered to the supporting body so as to be detachable. Thus, temporary adhesion of a wafer with a supporting body may become easy, process conformity with the TSV formation process and with the wafer-back surface-wiring process may become high, and removal may be done easily, with high productivity.
摘要翻译：公开了一种晶片加工体，在支撑体上形成临时粘合层，并且在临时粘合剂层上堆叠具有电路形成的前表面和被处理后表面的晶片，其中临时粘合剂层设置有第一临时粘合剂层，其包括粘附到晶片的前表面以便可拆卸的非芳族饱和烃基的有机聚硅氧烷层（A）和由热固性改性的第二临时粘合剂层硅氧烷聚合物层（B），其被堆叠在第一临时粘合剂层上并粘附到支撑体以便可拆卸。因此，具有支撑体的晶片的临时粘合可能变得容易，与TSV形成工艺一致，并且晶片背面布线工艺可能变高，并且可以以高生产率容易地进行去除。

2. 发明申请

US20180350650A1 TEMPORARY ADHESIVE FILM ROLL FOR SUBSTRATE PROCESSING, METHOD FOR MANUFACTURING THIN WAFER 审中-公开
公开(公告)号：US20180350650A1
公开(公告)日：2018-12-06
申请号：US15991533
申请日：2018-05-29
申请人： SHIN-ETSU CHEMICAL CO., LTD.
发明人： Masahito TANABE , Michihiro SUGO , Kazunori KONDO , Hiroyuki YASUDA
IPC分类号： H01L21/683 , C09J183/04 , C09J5/06 , C09J7/10
CPC分类号： H01L21/6836 , C08G77/12 , C08G77/20 , C09J5/06 , C09J7/10 , C09J183/04 , C09J2201/36 , C09J2201/61 , C09J2203/326 , C09J2483/00 , H01L2221/68381 , C08K5/56 , C08L83/00
摘要： A temporary adhesive film roll for substrate processing, includes: a roll axis and a composite film-shaped temporary-adhesive material for temporarily bonding a substrate to a support, the composite film-shaped temporary-adhesive material being rolled up around the roll axis; wherein the composite film-shaped temporary-adhesive material includes a first temporary adhesive layer composed of a thermoplastic resin, a second temporary adhesive layer composed of a thermosetting resin, and a third temporary adhesive layer composed of a thermosetting resin which is different from that of the second temporary adhesive layer. The temporary adhesive film roll for substrate processing is capable of giving a temporary adhesive material which facilitates temporary adhesion between a substrate and a support, rapidly forms a temporary adhesive material layer on a substrate or a support, has excellent resistance to a thermal process such as chemical vapor deposition, and is easily separated to improve the productivity of thin wafers.

3. 发明申请

US20170069521A1 WAFER PROCESSING LAMINATE, TEMPORARY ADHESIVE MATERIAL FOR WAFER PROCESSING, AND METHOD FOR MANUFACTURING THIN WAFER 审中-公开
标题翻译： WAFER加工层压板，用于加工的临时粘合材料以及制造薄膜的方法
公开(公告)号：US20170069521A1
公开(公告)日：2017-03-09
申请号：US15122493
申请日：2015-03-03
申请人： SHIN-ETSU CHEMICAL CO., LTD.
发明人： Michihiro SUGO , Hiroyuki YASUDA , Shohei TAGAMI , Masahito TANABE
IPC分类号： H01L21/683 , C09J183/04 , B32B37/12 , B32B27/08 , B32B27/28 , C08G77/20 , H01L23/00
CPC分类号： H01L21/6836 , B32B7/04 , B32B7/06 , B32B7/12 , B32B27/08 , B32B27/18 , B32B27/26 , B32B27/283 , B32B37/12 , B32B2037/1269 , B32B2250/03 , B32B2264/00 , B32B2264/02 , B32B2307/732 , B32B2307/748 , B32B2405/00 , B32B2457/08 , B32B2457/14 , C08G77/12 , C08G77/20 , C08K5/56 , C08L83/00 , C09J7/201 , C09J7/203 , C09J7/30 , C09J7/401 , C09J7/403 , C09J7/50 , C09J183/04 , H01L21/6835 , H01L2221/68327 , H01L2221/6834 , H01L2221/68386 , H01L2224/13147 , H01L2924/0715 , H01L2924/10253
摘要： A temporary adhesive material for a wafer processing, used for temporarily bonding a support and a wafer having a circuit-forming front surface and a back surface to be processed, contains a complex temporary adhesive material layer having a three-layered structure that includes a first temporary adhesive layer composed of a non-silicone thermoplastic resin layer capable of releasably adhering to the front surface of the wafer, a second temporary adhesive layer composed of a thermosetting siloxane polymer layer laminated on the first temporary adhesive layer, and a third temporary adhesive layer composed of a thermosetting siloxane-modified polymer layer laminated on the second temporary adhesive layer and capable of releasably adhering to the support. A wafer processing laminate and temporary adhesive material for a wafer processing facilitate temporary adhesion and separation, have excellent CVD resistance, and can increase productivity of thin wafers, and a method manufactures a thin wafer using the same.
摘要翻译：用于临时粘合支撑体的临时粘合材料和具有电路形成前表面和待加工后表面的晶片包含具有三层结构的复合临时粘合材料层，其包括第一由能够可剥离地粘附在晶片前表面的非硅氧烷热塑性树脂层构成的临时胶粘剂层，层叠在第一临时粘合剂层上的由热固性硅氧烷聚合物层组成的第二临时粘合剂层和第三临时粘合剂层由层压在第二临时粘合剂层上并能够可释放地粘附到载体上的热固性硅氧烷改性聚合物层组成。用于晶片处理的晶片加工层压板和临时粘合材料便于临时粘合和分离，具有优异的耐CVD性，并且可以提高薄晶片的生产率，并且制造使用其的薄晶片的方法。

4. 发明申请

US20140154868A1 WAFER PROCESSING LAMINATE, WAFER PROCESSING MEMBER, TEMPORARY ADHERING MATERIAL FOR PROCESSING WAFER, AND MANUFACTURING METHOD OF THIN WAFER 有权
标题翻译：加工加工层，薄膜加工构件，加工辊的临时加工材料及薄膜的制造方法
公开(公告)号：US20140154868A1
公开(公告)日：2014-06-05
申请号：US14060234
申请日：2013-10-22
申请人： SHIN-ETSU CHEMICAL CO., LTD.
发明人： Michihiro SUGO , Hideto KATO , Shohei TAGAMI , Hiroyuki YASUDA , Masahito TANABE
IPC分类号： H01L21/683 , H01L21/78
CPC分类号： H01L21/78 , C08G77/16 , C09J7/10 , C09J183/04 , C09J2201/36 , C09J2201/622 , C09J2203/326 , C09J2483/00 , H01L21/187 , H01L21/6835 , H01L21/6836 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , H01L2221/68386 , Y10T428/1457
摘要： A wafer processing laminate, a wafer processing member, a temporary adhering material for processing a wafer, and a method for manufacturing a thin wafer, which facilitates to establish a temporary adhering the wafer and the support, enables to form a layer of uniform thickness on a heavily stepped substrate, and is compatible with the TSV formation and wafer back surface interconnect forming steps, and the wafer processing laminate includes a support, a temporary adhesive material layer formed thereon and a wafer laminated on the temporary adhesive material layer, where the wafer has a circuit-forming front surface and a back surface to be processed, wherein the temporary adhesive material layer includes a three-layered structure composite temporary adhesive material layer.
摘要翻译：晶片处理层压体，晶片处理部件，晶片处理用临时粘接材料以及薄晶片的制造方法，有利于临时粘接晶片和支持体，能够形成均匀厚度的层并且与TSV形成和晶片背面互连形成步骤兼容，并且晶片处理层叠体包括支撑体，在其上形成的临时粘合材料层和层叠在临时粘合材料层上的晶片，其中晶片具有电路形成前表面和待加工的后表面，其中临时粘合材料层包括三层结构复合临时粘合材料层。

5. 发明申请

US20230045921A1 CURABLE PERFLUOROPOLYETHER ADHESIVE COMPOSITION, AND ADHESIVE AND ADHESIVE TAPE INCLUDING CURED PRODUCT THEREOF 有权
公开(公告)号：US20230045921A1
公开(公告)日：2023-02-16
申请号：US17783123
申请日：2020-11-26
申请人： SHIN-ETSU CHEMICAL CO., LTD.
发明人： Hiroyuki YASUDA , Koichi YAMAGUCHI
IPC分类号： C09J129/10 , C09J11/06 , C09J183/04
摘要： A curable perfluoropolyether adhesive composition containing the following components (A) to (C): (A) 100 parts by mass of a linear perfluoropolyether compound having at least two alkenyl groups per molecule and having a perfluoropolyether structure containing a repeating unit represented by —CaF2aO— in a main chain, “a” being an integer of 1 to 6; (B) an effective curing amount of an organosilicon compound having at least two silicon-bonded hydrogen atoms per molecule; and (C) a catalytic amount of a hydrosilylation-reaction catalyst, where a cured product of the curable perfluoropolyether adhesive composition is an adhesive having adhesion of less than 0.5 N/25 mm.

6. 发明申请

US20230015835A1 CURABLE PERFLUOROPOLYETHER ADHESIVE COMPOSITION AND ADHESIVE CONTAINING CURED PRODUCT THEREOF 有权
公开(公告)号：US20230015835A1
公开(公告)日：2023-01-19
申请号：US17783113
申请日：2020-11-25
申请人： SHIN-ETSU CHEMICAL CO., LTD.
发明人： Hiroyuki YASUDA , Koichi YAMAGUCHI
IPC分类号： C09J171/00 , C09J11/06
摘要： A curable perfluoropolyether adhesive composition containing: (A) 100 parts by mass of a linear perfluoropolyether compound having at least two alkenyl groups per molecule and having a perfluoropolyether structure containing a repeating unit represented by -CaF2aO- in a main chain; (B) an organosilicon compound having at least two silicon-bonded hydrogen atoms per molecule; (C) a hydrosilylation-reaction catalyst; (D) 0.05 to 5 parts by mass of an organosilicon compound, other than the component (B), having per molecule any two or more selected from a silicon-bonded hydrogen atom, an epoxy group bonded to a silicon atom via a carbon atom or via a carbon atom and an oxygen atom, and a trialkoxysilyl group bonded to a silicon atom via a carbon atom or via a carbon atom and an oxygen atom.

7. 发明申请

US20220396662A1 PHOTOCURABLE FLUOROPOLYETHER-BASED ELASTOMER COMPOSITION AND BONDING METHOD THEREOF 有权
公开(公告)号：US20220396662A1
公开(公告)日：2022-12-15
申请号：US17770756
申请日：2020-11-05
申请人： SHIN-ETSU CHEMICAL CO., LTD.
发明人： Hiroyuki YASUDA , Mitsuo MUTO , Kenichi FUKUDA
IPC分类号： C08G65/22 , C08G77/12 , C08G77/24 , C08G77/08 , C08G77/14 , C08K3/36 , C08J7/04 , C08G65/336
摘要： Provided are a photocurable fluoropolyether-based elastomer composition having both a favorable preservation stability and fast curability, being bondable at a low temperature in a short period of time, and generating no air bubbles in the resin at the time of curing; and a bonding method thereof. The photocurable fluoropolyether-based elastomer composition contains: (A) a linear polyfluoro compound; (B) a fluorine-containing organohydrogenpolysiloxane; (C) a photoactive hydrosilylation reaction catalyst; and (D) a zeolite having an average primary particle size of not larger than 30 μm.

8. 发明申请

US20160289519A1 SILICONE ADHESIVE COMPOSITION AND SOLID-STATE IMAGING DEVICE 有权
标题翻译：硅胶粘合组合物和固态成像装置
公开(公告)号：US20160289519A1
公开(公告)日：2016-10-06
申请号：US15035845
申请日：2014-11-10
申请人： Shin-Etsu Chemical Co., Ltd.
发明人： Hiroyuki YASUDA , Kyoko SOGA , Michihiro SUGO
IPC分类号： C09J183/04 , C08G77/08 , H01L27/146 , C08G77/04
CPC分类号： C09J183/04 , C08G77/04 , C08G77/08 , C08G77/12 , C08G77/20 , C08K5/56 , C08L83/00 , H01L23/14 , H01L27/14618 , H01L27/1462 , H01L2224/0519 , H01L2224/05599 , H01L2224/2919
摘要： The purpose of the present invention is to provide an adhesive composition using a silicone polymer compound, which does not require exposure, baking and development processes for the production, thereby making the production cost low and making the productivity high, which has good characteristics such as good adhesiveness, good hermetic sealing properties after thermal curing and low moisture absorption that are required for adhesives, which provides a cured film having high reliabilities such as high heat resistance and high light resistance, and which is capable of suppressing warping of a bonded substrate after back grinding that is necessary in the three-dimensional mounting production. A silicone adhesive composition which contains: (A) an organopolysiloxane containing a non-aromatic saturated monovalent hydrocarbon group and an alkenyl group; (B) an organohydrogenpolysiloxane containing two or more SiH groups in each molecule in such an amount that the molar ratio of the SiH groups in the component (B) is 0.5-10 relative to the alkenyl groups in the component (A); and (C) an effective amount of a platinum-based catalyst.
摘要翻译：本发明的目的是提供一种使用不需要曝光的硅氧烷聚合物化合物的粘合剂组合物，用于生产的烘烤和显影方法，从而使生产成本低并且使生产率高，具有良好的特性如良好的粘合性，热固化后的良好的密封性和粘合剂所需的低吸湿性，其提供了具有高可靠性，例如高耐热性和高耐光性的可靠性的固化膜，并且能够抑制键合衬底的翘曲在三维安装生产中必要的后磨。一种硅氧烷粘合剂组合物，其包含：（A）含有非芳族饱和一价烃基和烯基的有机聚硅氧烷; （B）每个分子中含有两个或更多个SiH基团的有机氢聚硅氧烷，其量使组分（B）中的SiH基团的摩尔比相对于组分（A）中的链烯基为0.5-10; 和（C）有效量的铂类催化剂。

9. 发明申请

US20140342530A1 TEMPORARY ADHESIVE MATERIAL FOR WAFER, FILM FOR TEMPORARY ADHESION USING SAME, WAFER PROCESSING LAMINATE, AND METHOD FOR PRODUCING THIN WAFER USING SAME 有权
标题翻译：用于波形的临时粘合材料，使用其的临时粘合膜，WAFER加工层压板以及使用其制造薄膜的方法
公开(公告)号：US20140342530A1
公开(公告)日：2014-11-20
申请号：US14270843
申请日：2014-05-06
申请人： SHIN-ETSU CHEMICAL CO., LTD.
发明人： Hiroyuki YASUDA , Michihiro SUGO
IPC分类号： H01L21/683 , C09J183/14 , H01L21/304
CPC分类号： C09J183/14 , C08G77/14 , C08G77/52 , C08K5/0025 , C08K5/205 , C09J2201/134 , C09J2201/36 , C09J2203/326 , C09J2205/102 , C09J2205/31 , C09J2483/00 , H01L21/6835 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , Y10T428/2852 , Y10T428/287
摘要： A temporary adhesive material for a wafer includes a first temporary adhesive layer of a silicone-containing polymer layer containing a photo base generator and a second temporary adhesive layer of a silicone-containing polymer layer which is laminated on the first temporary adhesive layer, does not contain the photo base generator, and is different from the polymer layer. Thereby, there can be formed a temporary adhesive layer having high thickness uniformity, even on a wafer having a step. Because of the thickness uniformity, a thin wafer having a uniform thickness of 50 μm or less can be easily obtained. When a thin wafer is produced and then delaminated from a support, the wafer can be delaminated from the support by exposure at a low exposure dose without stress. Therefore, a brittle thin wafer can be easily handled without causing damage, and a thin wafer can be easily produced.
摘要翻译：用于晶片的暂时粘合剂材料包括层叠在第一临时粘合剂层上的含有光聚合物层的含硅氧烷聚合物层的第一临时粘合剂层和层叠在第一临时粘合剂层上的含硅酮聚合物层的第二临时粘合剂层，含有光源产生器，不同于聚合物层。因此，即使在具有台阶的晶片上也可以形成厚度均匀性高的临时粘合剂层。由于厚度均匀性，可以容易地获得具有50μm或更小的均匀厚度的薄晶片。当制造薄晶片然后从载体分层时，通过以低曝光剂量暴露而不受压力，晶片可以从载体分层。因此，可以容易地处理脆性薄晶片而不会造成损坏，并且可以容易地制造薄晶片。

10. 发明申请

US20140255833A1 CHEMICALLY AMPLIFIED POSITIVE RESIST COMPOSITION AND PATTERN FORMING PROCESS 有权
标题翻译：化学放大正电阻组合物和图案形成过程
公开(公告)号：US20140255833A1
公开(公告)日：2014-09-11
申请号：US14283967
申请日：2014-05-21
申请人： Shin-Etsu Chemical Co., Ltd.
发明人： Hiroyuki YASUDA , Katsuya TAKEMURA , Shohei TAGAMI
IPC分类号： G03F7/039
CPC分类号： G03F7/0392 , G03F7/40 , H01L21/0274 , H05K1/095
摘要： A chemically amplified positive resist composition comprising (A) 100 pbw of a base resin which is normally alkali insoluble or substantially insoluble, (B) 0.05-20 pbw of a photoacid generator, (C) 0.1-50 pbw of a thermal crosslinker, and (D) 50-5,000 pbw of an organic solvent is coated to form a thick film having a high sensitivity and resolution.
摘要翻译：一种化学放大正性抗蚀剂组合物，其包含（A）100pbw的通常不溶于碱或基本不溶的基础树脂，（B）0.05-20pbw的光致酸发生剂，（C）0.1-50pbw的热交联剂，和（D）涂覆50-5,000pbw的有机溶剂以形成具有高灵敏度和分辨率的厚膜。

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