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    • 4. 发明授权
    • Semiconductor memory device including stacked memory chips
    • 半导体存储器件包括堆叠的存储器芯片
    • US09336857B2
    • 2016-05-10
    • US14535075
    • 2014-11-06
    • SK hynix Inc.
    • Min-Su ParkYoung-Jun Ku
    • G11C11/4093G11C7/10
    • G11C11/4093G11C7/10G11C7/1066
    • A semiconductor memory device includes: a master chip suitable for generating a plurality of first control signals and a second control signal based on a read command; and a plurality of slave chips each suitable for latching data read from a plurality of memory cells included in a corresponding slave chip and transmitting the latched data to the master chip based on a correspond control signal of the first control signals, wherein the master chip latches the data transmitted from the slave chips based on the first control signals and outputs the data latched in the master chip based on the second control signal.
    • 半导体存储器件包括:适于产生多个第一控制信号的主芯片和基于读命令的第二控制信号; 以及多个从属芯片,每个从属芯片适合于锁存从包括在相应的从芯片中的多个存储器单元读取的数据,并且基于第一控制信号的对应控制信号将锁存的数据发送到主芯片,其中主芯片锁存 基于第一控制信号从副芯片发送的数据,并且基于第二控制信号输出锁存在主芯片中的数据。