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    • 1. 发明申请
    • INVERTER
    • US20200313607A1
    • 2020-10-01
    • US16901179
    • 2020-06-15
    • SMA Solar Technology AG
    • Stefan BuchholdJens FriebeMichael KotthausEphraim MoeserTorsten SoederbergThomas Wappler
    • H02S40/32H02M3/158H02M7/00H02M7/44H05K7/20
    • An inverter for a photovoltaic system includes a substantially planar baseplate having a front and a rear, wherein the rear forms an outer rear wall of the inverter, and having at least one platform-like elevation that rises in the direction of the front of the baseplate. The inverter also includes a printed circuit board having one or more heat-generating components mounted thereon, wherein the printed circuit board is installed on the baseplate such that the one or more heat-generating components are arranged on the printed circuit board in the region of the platform-like elevation and are in thermal contact with the platform-like elevation. The inverter further includes a potting compound that fills a space on the front of the baseplate and surrounds at least partially the printed circuit board, and a cover arranged on or in the potting compound that adjoins the baseplate, so that the baseplate and the cover surrounding at least part of the potting compound form a housing, The inverter also includes at least four DC connectors that are arranged in pairs on at least one of the lateral end faces of the housing and at least part of which is cast in the potting compound, and an AC connector that is arranged on one of the lateral end faces of the housing, wherein electrical contacts of the AC connector are connected to the printed circuit board.
    • 2. 发明授权
    • Inverter
    • US11522494B2
    • 2022-12-06
    • US16901179
    • 2020-06-15
    • SMA Solar Technology AG
    • Stefan BuchholdJens FriebeMichael KotthausEphraim MoeserTorsten SoederbergThomas Wappler
    • H02S40/32H05K7/20H02M7/00
    • An inverter for a photovoltaic system includes a substantially planar baseplate having a front and a rear, wherein the rear forms an outer rear wall of the inverter, and having at least one platform-like elevation that rises in the direction of the front of the baseplate. The inverter also includes a printed circuit board having one or more heat-generating components mounted thereon, wherein the printed circuit board is installed on the baseplate such that the one or more heat-generating components are arranged on the printed circuit board in the region of the platform-like elevation and are in thermal contact with the platform-like elevation. The inverter further includes a potting compound that fills a space on the front of the baseplate and surrounds at least partially the printed circuit board, and a cover arranged on or in the potting compound that adjoins the baseplate, so that the baseplate and the cover surrounding at least part of the potting compound form a housing. The inverter also includes at least four DC connectors that are arranged in pairs on at least one of the lateral end faces of the housing and at least part of which is cast in the potting compound, and an AC connector that is arranged on one of the lateral end faces of the housing, wherein electrical contacts of the AC connector are connected to the printed circuit board.