专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US09159652B2 Electronic device comprising at least a chip enclosed in a package and a corresponding assembly process 有权
标题翻译：电子设备至少包括封装在封装中的芯片和相应的组装过程
公开(公告)号：US09159652B2
公开(公告)日：2015-10-13
申请号：US14183156
申请日：2014-02-18
申请人： STMicroelectronics S.r.l.
发明人： Concetto Privitera
IPC分类号： H01L29/267 , H01L33/00 , H01L29/40 , H01L23/48 , H01L21/56 , H01L21/768 , H01L23/28 , H01L23/495 , H01L23/00 , H01L23/31
CPC分类号： H01L23/481 , H01L21/56 , H01L21/76877 , H01L23/28 , H01L23/3107 , H01L23/49562 , H01L24/02 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/02372 , H01L2224/0401 , H01L2224/04026 , H01L2224/05009 , H01L2224/05572 , H01L2224/0603 , H01L2224/06051 , H01L2224/13009 , H01L2224/13025 , H01L2224/13111 , H01L2224/1329 , H01L2224/133 , H01L2224/16058 , H01L2224/16145 , H01L2224/29009 , H01L2224/29025 , H01L2224/29034 , H01L2224/29111 , H01L2224/2929 , H01L2224/293 , H01L2224/3003 , H01L2224/30051 , H01L2224/32058 , H01L2224/32245 , H01L2224/73203 , H01L2224/81121 , H01L2224/81192 , H01L2224/81447 , H01L2224/81815 , H01L2224/8185 , H01L2224/81855 , H01L2224/83121 , H01L2224/83192 , H01L2224/83447 , H01L2224/83815 , H01L2224/83851 , H01L2224/83855 , H01L2224/9201 , H01L2224/9211 , H01L2924/00014 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/00012 , H01L2924/01047 , H01L2224/81 , H01L2224/83 , H01L2924/00 , H01L2224/05552
摘要： An electronic device is described comprising at least one chip enclosed in a package, in turn provided with a metallic structure or leadframe having a plurality of connection pins, this chip having at least one first contact realized on a first face and at least one second contact realized on a second and opposite face of this chip. The chip comprises at least one through via crossing the whole section of the chip as well as a metallic layer extending from the second contact arranged on the first face, along walls of the at least one through via up to the second and opposite face in correspondence with an additional pad. The electronic device comprises at least one interconnection layer for the electrical and mechanical connection between the chip and the metallic structure having at least one portion realized in correspondence with the at least one through via so as to bring the second contact placed on the second face of the chip back on its first face. An assembly process of such an electronic device is also described.
摘要翻译：描述了一种电子设备，其包括封装在封装中的至少一个芯片，其又设置有具有多个连接引脚的金属结构或引线框架，该芯片具有在第一面上实现的至少一个第一触点和至少一个第二触点在该芯片的第二个相对面上实现。芯片包括穿过芯片的整个部分的至少一个通孔以及从布置在第一面上的第二触点延伸的金属层，沿着至少一个通孔的壁延伸到对应的第二和相对面附加一个垫。电子设备包括用于芯片和金属结构之间的电气和机械连接的至少一个互连层，其具有与至少一个通孔相对应地实现的至少一个部分，以便将第二接触件放置在第二面芯片回到了第一张脸上。还描述了这种电子设备的组装过程。

2. 发明授权

US10964627B2 Integrated electronic device having a dissipative package, in particular dual side cooling package 有权
公开(公告)号：US10964627B2
公开(公告)日：2021-03-30
申请号：US16696698
申请日：2019-11-26
申请人： STMICROELECTRONICS S.R.L.
发明人： Concetto Privitera , Maurizio Maria Ferrara , Fabio Vito Coppone
IPC分类号： H01L21/44 , H01L21/48 , H01L23/495 , H01L23/34 , H01L23/00
摘要： Packaged semiconductor device having a frame, of conductive material; a body of semiconductor material, fixed to the frame through a first adhesive layer; a heatsink element, fixed to the body through a second adhesive layer; and a packaging mass surrounding the body and, at least partially, the frame and the heatsink element. The heatsink element is formed by a heatsink die facing, and coplanar to, a main face of the device and by a spacer structure, which includes a pair of pedestals projecting from the perimeter of the heatsink die towards the body and rest on the body.

3. 发明授权

US10535587B2 Integrated electronic device having a dissipative package, in particular dual side cooling package 有权
公开(公告)号：US10535587B2
公开(公告)日：2020-01-14
申请号：US14961586
申请日：2015-12-07
申请人： STMICROELECTRONICS S.R.L.
发明人： Concetto Privitera , Maurizio Maria Ferrara , Fabio Vito Coppone
IPC分类号： H01L23/495 , H01L23/34 , H01L23/00
摘要： Packaged semiconductor device having a frame, of conductive material; a body of semiconductor material, fixed to the frame through a first adhesive layer; a heat-sink element, fixed to the body through a second adhesive layer; and a packaging mass surrounding the body and, at least partially, the frame and the heat-sink element. The heat-sink element is formed by a heat-sink die facing, and coplanar to, a main face of the device and by a spacer structure, which includes a pair of pedestals projecting from the perimeter of the heat-sink die towards the body and rest on the body.

4. 发明授权

US08453917B1 Wave soldering of surface-mounting electronic devices on printed circuit board 有权
标题翻译：表面贴装电子元件在印刷电路板上的波峰焊接
公开(公告)号：US08453917B1
公开(公告)日：2013-06-04
申请号：US13655555
申请日：2012-10-19
申请人： STMicroelectronics S.r.l.
发明人： Concetto Privitera , Cristiano Gianluca Stella
IPC分类号： B23K31/02
CPC分类号： H05K3/3468 , H05K1/0206 , H05K1/112 , H05K3/303 , H05K3/3431 , H05K2201/09836 , H05K2201/10166 , H05K2203/044 , Y02P70/613
摘要： A system includes a device of the surface-mounting type having an insulating package provided with a mounting surface and a contact pin exposed on the mounting surface. The device is attached to an insulating board including a gluing surface and an opposite surface. The process for manufacturing the system includes forming through holes a contact region on the gluing surface. The mounting surface is glued to the gluing surface with the contact pin aligned with the contact region. Wave soldering is performed to electrically join the device to the board by hitting the opposite surface with a wave of soldering paste to form, by capillary action with the soldering paste ascending in the through holes up to the overflow on the gluing surface, a conductive contact electrically connecting the contact pin of the electronic device through a solder connection to the contact region of the electronic board.
摘要翻译：一种系统包括表面安装型的装置，其具有设置有安装表面的绝缘封套和暴露在安装表面上的接触销。该装置附接到包括胶合表面和相对表面的绝缘板。制造该系统的方法包括在胶合表面上形成通孔的接触区域。安装表面胶合到胶合表面，接触销与接触区域对准。进行波峰焊接以通过用焊膏波撞击相对表面来将该装置电连接到板上，通过毛细作用形成通过在通孔中上升至焊接表面上的溢流的焊膏的导电接触通过焊接连接将电子设备的接触针电连接到电子板的接触区域。

5. 发明申请

US20140239502A1 ELECTRONIC DEVICE COMPRISING AT LEAST A CHIP ENCLOSED IN A PACKAGE AND A CORRESPONDING ASSEMBLY PROCESS 有权
标题翻译：包含至少一个封装在一起的芯片的电子设备和相应的组装过程
公开(公告)号：US20140239502A1
公开(公告)日：2014-08-28
申请号：US14183156
申请日：2014-02-18
申请人： STMicroelectronics S.r.l.
发明人： Concetto Privitera
IPC分类号： H01L23/48 , H01L21/768 , H01L23/28 , H01L21/56
CPC分类号： H01L23/481 , H01L21/56 , H01L21/76877 , H01L23/28 , H01L23/3107 , H01L23/49562 , H01L24/02 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/02372 , H01L2224/0401 , H01L2224/04026 , H01L2224/05009 , H01L2224/05572 , H01L2224/0603 , H01L2224/06051 , H01L2224/13009 , H01L2224/13025 , H01L2224/13111 , H01L2224/1329 , H01L2224/133 , H01L2224/16058 , H01L2224/16145 , H01L2224/29009 , H01L2224/29025 , H01L2224/29034 , H01L2224/29111 , H01L2224/2929 , H01L2224/293 , H01L2224/3003 , H01L2224/30051 , H01L2224/32058 , H01L2224/32245 , H01L2224/73203 , H01L2224/81121 , H01L2224/81192 , H01L2224/81447 , H01L2224/81815 , H01L2224/8185 , H01L2224/81855 , H01L2224/83121 , H01L2224/83192 , H01L2224/83447 , H01L2224/83815 , H01L2224/83851 , H01L2224/83855 , H01L2224/9201 , H01L2224/9211 , H01L2924/00014 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/00012 , H01L2924/01047 , H01L2224/81 , H01L2224/83 , H01L2924/00 , H01L2224/05552
摘要： An electronic device is described comprising at least one chip enclosed in a package, in turn provided with a metallic structure or leadframe having a plurality of connection pins, this chip having at least one first contact realized on a first face and at least one second contact realized on a second and opposite face of this chip. The chip comprises at least one through via crossing the whole section of the chip as well as a metallic layer extending from the second contact arranged on the first face, along walls of the at least one through via up to the second and opposite face in correspondence with an additional pad. The electronic device comprises at least one interconnection layer for the electrical and mechanical connection between the chip and the metallic structure having at least one portion realized in correspondence with the at least one through via so as to bring the second contact placed on the second face of the chip back on its first face. An assembly process of such an electronic device is also described.
摘要翻译：描述了一种电子设备，其包括封装在封装中的至少一个芯片，其又设置有具有多个连接引脚的金属结构或引线框架，该芯片具有在第一面上实现的至少一个第一触点和至少一个第二触点在该芯片的第二个相对面上实现。芯片包括穿过芯片的整个部分的至少一个通孔以及从布置在第一面上的第二触点延伸的金属层，沿着至少一个通孔的壁延伸到对应的第二和相对面附加一个垫。电子设备包括用于芯片和金属结构之间的电气和机械连接的至少一个互连层，具有至少一个部分，其与至少一个通孔对应地实现，以使第二接触件位于第二面芯片回到了第一张脸上。还描述了这种电子设备的组装过程。

6. 发明申请

US20130126590A1 WAVE SOLDERING OF SURFACE-MOUNTING ELECTRONIC DEVICES ON PRINTED CIRCUIT BOARD 有权
标题翻译：表面安装电子设备在印刷电路板上的波纹焊接
公开(公告)号：US20130126590A1
公开(公告)日：2013-05-23
申请号：US13655555
申请日：2012-10-19
申请人： STMICROELECTRONICS S.R.L.
发明人： Concetto Privitera , Cristiano Gianluca Stella
IPC分类号： B23K31/02
CPC分类号： H05K3/3468 , H05K1/0206 , H05K1/112 , H05K3/303 , H05K3/3431 , H05K2201/09836 , H05K2201/10166 , H05K2203/044 , Y02P70/613
摘要： A system includes a device of the surface-mounting type having an insulating package provided with a mounting surface and a contact pin exposed on the mounting surface. The device is attached to an insulating board including a gluing surface and an opposite surface. The process for manufacturing the system includes forming through holes a contact region on the gluing surface. The mounting surface is glued to the gluing surface with the contact pin aligned with the contact region. Wave soldering is performed to electrically join the device to the board by hitting the opposite surface with a wave of soldering paste to form, by capillary action with the soldering paste ascending in the through holes up to the overflow on the gluing surface, a conductive contact electrically connecting the contact pin of the electronic device through a solder connection to the contact region of the electronic board.
摘要翻译：一种系统包括表面安装型的装置，其具有设置有安装表面的绝缘封套和暴露在安装表面上的接触销。该装置附接到包括胶合表面和相对表面的绝缘板。制造该系统的方法包括在胶合表面上形成通孔的接触区域。安装表面胶合到胶合表面，接触销与接触区域对准。进行波峰焊接以通过用焊膏波撞击相对表面来将该装置电连接到板上，通过毛细作用形成通过在通孔中上升至焊接表面上的溢流的焊膏的导电接触通过焊接连接将电子设备的接触针电连接到电子板的接触区域。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式