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1. 发明申请

US20220315695A1 ENCAPSULATING RESIN COMPOSITION AND ELECTRONIC COMPONENT 有权
公开(公告)号：US20220315695A1
公开(公告)日：2022-10-06
申请号：US17630566
申请日：2020-08-07
申请人： SUMITOMO BAKELITE CO., LTD.
发明人： Tetsuya KITADA
IPC分类号： C08G59/50 , C08G59/68 , C08K3/36 , C08K5/548 , C08K5/544 , C08G59/62 , C08G59/32 , H01R13/52 , H01R12/72
摘要： Provided is an encapsulating resin composition that is used for collectively encapsulating a circuit board (10) and at least a part of a connector portion (20), in which the encapsulating resin composition contains a curing accelerator, the connector portion (20) includes a terminal (21) that electrically connects the circuit board (10) with the external device, and a housing (22) that is disposed on an outer periphery of the terminal (21) and is encapsulated by the encapsulating resin composition, the housing (22) contains a thermoplastic resin, and in a differential scanning calorimetry (DSC) curve of the encapsulating resin composition obtained in a case where a temperature is increased from 30° C. to 200° C. under conditions of a temperature increase rate of 10° C./min using a DSC meter, a maximum heat release peak temperature is equal to or higher than 100° C. and equal to or lower than 163° C., and a half-value width of a maximum heat release peak is equal to or higher than 5° C. and equal to or lower than 25° C.

2. 发明申请

US20210384573A1 ENCAPSULATING RESIN COMPOSITION FOR POWER DEVICE AND POWER DEVICE 有权
公开(公告)号：US20210384573A1
公开(公告)日：2021-12-09
申请号：US17290507
申请日：2019-10-17
申请人： SUMITOMO BAKELITE CO., LTD.
发明人： Tetsuya KITADA
IPC分类号： H01M50/121 , C08G59/32 , C08G59/24 , C08G59/62 , C08G59/68 , C08K3/36 , C08K7/18
摘要： Provided is an encapsulating resin composition for a power device including an epoxy resin, an inorganic filler, a curing agent, and a curing accelerator. This composition is molded under a condition of 175° C. for 2 minutes and then subjected to after-curing under a condition of 175° C. for 4 hours to obtain a test piece having a diameter of 100 mm and a thickness of 2 mm, and a half width of a current-time curve obtained by measuring the test piece with a thermally stimulated depolarization current method according to an order of (i) to (v) below is equal to or less than 800 seconds, (i) increase a temperature of the test piece to 150° C. at a rate of 5° C./min without applying a voltage, (ii) applying a constant voltage of 500 V for 30 minutes while maintaining the temperature of the test piece at 150° C., (iii) lower the temperature of the test piece to 45° C. at a rate of 5° C./min while applying the constant voltage of 500 V, (iv) stop applying the voltage while maintaining the temperature of the test piece at 45° C. and leave the test piece to stand for 5 minutes, and (v) increase the temperature of the test piece at a rate of 3.5° C./min without applying a voltage to the test piece, and measure a value of a current flowing during the increase in the temperature to obtain a current-time curve.

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