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1. 发明授权

US10965046B2 Board with terminal 有权
公开(公告)号：US10965046B2
公开(公告)日：2021-03-30
申请号：US16630067
申请日：2018-06-28
申请人： AutoNetworks Technologies, Ltd. , Sumitomo Wiring Systems, Ltd. , SUMITOMO ELECTRIC INDUSTRIES, LTD. , SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
发明人： Takanobu Shimada , Hiroki Hirai , Jyunichi Ono , Yoshio Oka , Yoshifumi Uchita , Yoshiro Adachi
IPC分类号： H01R12/58 , H01R12/65 , H01R13/10
摘要： A terminal 20 includes a terminal connection portion 21 connected to a counterpart terminal and a board connection portion 24 connected to a conductive path 13 of a board 11. The board connection portion 24 has a plate shape portion 25 that is a plate shape. The plate shape portion is disposed behind the terminal connection portion 21 and is soldered to the conductive path 13 of the board 11. The board connection portion has a plate-shape first projection walls 28A to 28D that are bent from edge portions of a lateral direction side of the plate shape portion 25 and that project to an opposite side to the board 11 side. The plate shape portion 25 and the first projection walls 28A to 28D have a plating layer 37 that is formed on a plate surface of the plate shape portion and the first projection walls.

2. 发明授权

US10796812B2 Coating liquid for forming conductive layer, method for producing conductive layer, and conductive layer 有权
公开(公告)号：US10796812B2
公开(公告)日：2020-10-06
申请号：US16084350
申请日：2017-03-14
申请人： SUMITOMO ELECTRIC INDUSTRIES, LTD. , SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
发明人： Motohiko Sugiura , Issei Okada , Yoshio Oka , Atsushi Kimura , Kenji Ohki
IPC分类号： H01B1/22 , B05D5/12 , C09D7/40 , C09D7/65 , C09D11/52 , H05K1/09 , H01B1/02 , C09D5/24 , C08L79/02
摘要： A coating liquid for forming a conductive layer according to the present invention is a coating liquid for forming a conductive layer, the coating liquid containing fine metal particles, a dispersant, and a dispersion medium. In the coating liquid for forming a conductive layer, the fine metal particles contain copper or a copper alloy as a main component, the dispersant is a polyethyleneimine-polyethylene oxide graft copolymer, a polyethyleneimine moiety in the graft copolymer has a weight-average molecular weight of 300 or more and 1,000 or less, a molar ratio of polyethylene oxide chains to nitrogen atoms in the polyethyleneimine moiety is 10 or more and 50 or less, and the graft copolymer has a weight-average molecular weight of 3,000 or more and 54,000 or less.

3. 发明申请

US20140332258A1 DOUBLE-SIDED PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME 审中-公开
标题翻译：双面印刷接线板及其制造方法
公开(公告)号：US20140332258A1
公开(公告)日：2014-11-13
申请号：US14368869
申请日：2013-08-20
申请人： SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
发明人： Yoshifumi Uchida , Yoshio Oka , Takashi Kasuga
IPC分类号： H05K1/11 , H05K3/40
CPC分类号： H05K1/116 , H05K1/0393 , H05K3/0035 , H05K3/4038 , H05K3/4069 , H05K2201/0939 , H05K2201/09481 , H05K2203/1453 , Y10T29/49165
摘要： An object of the present invention is to provide a double-sided printed wiring board in which a blind via hole can be easily and reliably formed, which can be accurately applied to lands of a surface-mounted component that are arranged at a narrow pitch, and in which an impedance mismatch can be effectively suppressed. The double-sided printed wiring board according to the present invention includes a substrate having an insulating property, a first conductive pattern stacked on a surface of the substrate and having a first land portion, a second conductive pattern stacked on another surface of the substrate and having a second land portion opposing the first land portion, and a blind via hole penetrating through the first land portion and the substrate, in which an average diameter of an outer shape of the first land portion is larger than an average diameter of an outer shape of the second land portion. The blind via hole, the first land portion, and the second land portion preferably have substantially circular outer shapes, and are preferably formed so as to be substantially concentric with each other.
摘要翻译：本发明的目的是提供一种双面印刷布线板，其中可以容易且可靠地形成盲孔，能够精确地施加到以窄间距布置的表面安装部件的平台上，并且其中可以有效地抑制阻抗失配。根据本发明的双面印刷布线板包括具有绝缘性的基板，层叠在基板的表面上的第一导电图案，并且具有第一接地部分，在基板的另一表面上堆叠的第二导电图案，以及具有与第一接地部相对的第二接地部，以及穿过第一接地部和基板的盲通孔，第一接地部的外形的平均直径大于外形的平均直径的第二土地部分。盲通孔，第一接地部和第二接地部优选具有大致圆形的外形，并且优选形成为基本上彼此同心。

4. 发明授权

US11245237B2 Method of manufacturing flexible printed interconnect board 有权
公开(公告)号：US11245237B2
公开(公告)日：2022-02-08
申请号：US16634640
申请日：2018-07-26
申请人： SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
发明人： Yoshiro Adachi , Yoshifumi Uchita , Manabu Sudou , Yoshio Oka
IPC分类号： H01R43/00 , H01R43/02 , H01R12/57 , H01R43/20 , H05K3/00 , H05K3/34
摘要： According to one aspect of the present invention, a method of manufacturing a flexible printed interconnect board, including an insulating base film; a conductive pattern that is layered on one surface side of the base film; and a plurality of connection terminals that are fixed to a terminal connection area on one edge side of the conductive pattern, includes: fixing the plurality of connection terminals in parallel to a component fixing jig; and mounting the plurality of fixed connection terminals together with the component fixing jig.

5. 发明授权

US10143083B2 Substrate for printed circuit board and method for producing substrate for printed circuit board 有权
公开(公告)号：US10143083B2
公开(公告)日：2018-11-27
申请号：US15536954
申请日：2015-12-18
申请人： SUMITOMO ELECTRIC INDUSTRIES, LTD. , SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
发明人： Motohiko Sugiura , Takashi Kasuga , Yoshio Oka , Shigeaki Uemura , Jinjoo Park , Hiroshi Ueda , Kousuke Miura
IPC分类号： H05K1/09 , H05K3/20 , H05K3/24 , H05K3/38 , H05K1/02 , H05K1/03 , H05K1/05 , B82Y30/00 , B82Y40/00
摘要： A substrate for a printed circuit board according to an embodiment of the present invention includes a base film having an insulating property, and a metal layer formed on at least one surface side of the base film. In the substrate for a printed circuit board, a plurality of fine particles are disposed between the base film and the metal layer, and the fine particles are formed of a metal the same as a main metal of the metal layer or formed of a metal compound of the main metal. The fine particles preferably have an average particle size of 0.1 nm or more and 20 nm or less. The fine particles are preferably formed of a metal oxide or a metal hydroxide. The fine particles are preferably present between the base film and the metal layer so as to form a layer. The metal layer preferably includes a metal grain layer formed by firing metal nanoparticles.

6. 发明授权

US11343918B2 Method of making printed circuit board and laminated structure 有权
公开(公告)号：US11343918B2
公开(公告)日：2022-05-24
申请号：US16633271
申请日：2018-12-17
申请人： SUMITOMO ELECTRIC INDUSTRIES, LTD.
发明人： Shigeaki Uemura , Eiko Imazaki , Koji Nitta , Yoshio Oka , Hideki Matsuoka , Ippei Tanaka , Takayuki Yonezawa
IPC分类号： H05K1/00 , H05K1/02 , H05K1/03 , H05K1/11 , H05K1/16 , H05K3/00 , H05K3/02 , H05K3/06 , H05K3/10 , H05K3/18 , H05K3/22 , H05K3/38 , H05K3/46 , B24C1/00 , B24C1/04 , B24C3/00 , B24C3/32 , G06F3/044 , G03F7/00 , G03F7/004 , G03F7/027 , G03F7/031 , G03F7/033 , G03F7/039 , G03F7/085 , G03F7/12
摘要： A method of making a printed circuit board includes a step of providing a double-sided plate that is an insulating substrate having conductive layers on respective surfaces thereof, a first coating step of coating a first surface of the double-sided plate with a first photosensitive resin film, a second coating step of coating a second surface of the double-sided plate with a second photosensitive resin film, a first exposure step of exposing the photosensitive resin film coating the first surface after the first and second coating steps, and a second exposure step of exposing the photosensitive resin film coating the second surface after the first exposure step, wherein a maximum depth of a depression in an outermost surface of the second photosensitive resin film used in the second exposure step is less than 1.0 μm.

7. 发明授权

US11051399B2 Flexible printed circuit board 有权
公开(公告)号：US11051399B2
公开(公告)日：2021-06-29
申请号：US16618253
申请日：2018-06-25
申请人： SUMITOMO ELECTRIC INDUSTRIES, LTD. , SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
发明人： Yoshio Oka , Yoshifumi Uchita , Yoshiro Adachi
IPC分类号： H05K1/02
摘要： A flexible printed circuit board according to one aspect of the present invention includes a base film having an insulating property and a conductive pattern laminated on one surface of the base film, and has a terminal connecting area toward one end edge of the conductive pattern, the flexible printed circuit board including a reinforcement member laminated on another surface of the base film and situated opposite at least the terminal connecting area, wherein a thickness of the reinforcement member increases toward the one end edge in a stepwise or gradual manner.

8. 发明授权

US11013113B2 Base material for printed circuit board and printed circuit board 有权
公开(公告)号：US11013113B2
公开(公告)日：2021-05-18
申请号：US16955351
申请日：2018-09-24
申请人： SUMITOMO ELECTRIC INDUSTRIES, LTD. , SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
发明人： Motohiko Sugiura , Issei Okada , Takashi Kasuga , Yoshio Oka , Kenji Ohki
IPC分类号： H05K1/09
摘要： According to the present invention, a base material for a printed circuit board includes: an insulating base film; and a metal layer that is layered on at least one surface of the base film and that includes copper as a main component, wherein in a content per unit area in a region of 100 nm or less from an interface of the metal layer with the base film, Cr

9. 发明授权

US09967976B2 Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board 有权
公开(公告)号：US09967976B2
公开(公告)日：2018-05-08
申请号：US15536851
申请日：2015-12-21
申请人： SUMITOMO ELECTRIC INDUSTRIES, LTD. , SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
发明人： Kazuhiro Miyata , Issei Okada , Takashi Kasuga , Yoshio Oka , Yasuhiro Okuda , Jinjoo Park , Hiroshi Ueda , Kousuke Miura
IPC分类号： H05K1/09 , H05K3/10 , H05K3/02 , H05K3/12 , H05K3/24 , H05K1/03
CPC分类号： H05K1/092 , C09D11/52 , H05K1/03 , H05K1/0346 , H05K1/09 , H05K1/097 , H05K3/022 , H05K3/064 , H05K3/102 , H05K3/1208 , H05K3/245 , H05K3/246 , H05K2201/0154 , H05K2201/0347 , H05K2203/072 , H05K2203/1131 , H05K2203/1157
摘要： A substrate for a printed circuit board according to an embodiment of the present invention includes a base film having an insulating property, and a conductive layer formed on at least one of surfaces of the base film. In the substrate for a printed circuit board, at least the conductive layer contains titanium in a dispersed manner. The conductive layer preferably contains copper or a copper alloy as a main component. A mass ratio of titanium in the conductive layer is preferably 10 ppm or more and 1,000 ppm or less. The conductive layer is preferably formed by application and heating of a conductive ink containing metal particles. The conductive ink preferably contains titanium or a titanium ion. The metal particles are preferably obtained by a titanium redox process including reducing metal ions using trivalent titanium ions as a reducing agent in an aqueous solution by an action of the reducing agent.

10. 发明授权

US11375615B2 Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board 有权
公开(公告)号：US11375615B2
公开(公告)日：2022-06-28
申请号：US15753017
申请日：2016-08-06
申请人： SUMITOMO ELECTRIC INDUSTRIES, LTD. , SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. , SUMITOMO ELECTRIC FINE POLYMER, INC.
发明人： Yuichiro Yamanaka , Yoshio Oka , Satoshi Kiya , Yoshifumi Uchita , Makoto Nakabayashi
IPC分类号： H05K3/38 , H05K1/03 , B32B15/08 , B32B15/088
摘要： A substrate for a printed circuit board according to an embodiment of the present invention includes a base film and a metal layer disposed on at least one of surfaces of the base film. In the substrate for a printed circuit board, an amount of nitrogen present per unit area, the amount being determined on the basis of a peak area of a N1s spectrum in XPS analysis of a surface of the base film exposed after removal of the metal layer by etching with an acidic solution, is 1 atomic % or more and 10 atomic % or less.

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