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    • 3. 发明申请
    • DOUBLE-SIDED PRINTED WIRING BOARD AND METHOD FOR PRODUCING THE SAME
    • 双面印刷接线板及其制造方法
    • US20140332258A1
    • 2014-11-13
    • US14368869
    • 2013-08-20
    • SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.SUMITOMO ELECTRIC INDUSTRIES, LTD.
    • Yoshifumi UchidaYoshio OkaTakashi Kasuga
    • H05K1/11H05K3/40
    • H05K1/116H05K1/0393H05K3/0035H05K3/4038H05K3/4069H05K2201/0939H05K2201/09481H05K2203/1453Y10T29/49165
    • An object of the present invention is to provide a double-sided printed wiring board in which a blind via hole can be easily and reliably formed, which can be accurately applied to lands of a surface-mounted component that are arranged at a narrow pitch, and in which an impedance mismatch can be effectively suppressed. The double-sided printed wiring board according to the present invention includes a substrate having an insulating property, a first conductive pattern stacked on a surface of the substrate and having a first land portion, a second conductive pattern stacked on another surface of the substrate and having a second land portion opposing the first land portion, and a blind via hole penetrating through the first land portion and the substrate, in which an average diameter of an outer shape of the first land portion is larger than an average diameter of an outer shape of the second land portion. The blind via hole, the first land portion, and the second land portion preferably have substantially circular outer shapes, and are preferably formed so as to be substantially concentric with each other.
    • 本发明的目的是提供一种双面印刷布线板,其中可以容易且可靠地形成盲孔,能够精确地施加到以窄间距布置的表面安装部件的平台上, 并且其中可以有效地抑制阻抗失配。 根据本发明的双面印刷布线板包括具有绝缘性的基板,层叠在基板的表面上的第一导电图案,并且具有第一接地部分,在基板的另一表面上堆叠的第二导电图案,以及 具有与第一接地部相对的第二接地部,以及穿过第一接地部和基板的盲通孔,第一接地部的外形的平均直径大于外形的平均直径 的第二土地部分。 盲通孔,第一接地部和第二接地部优选具有大致圆形的外形,并且优选形成为基本上彼此同心。