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1. 发明授权

US09562147B2 Transparent polyamide resin composition and crosslinked transparent polyamide resin molded body 有权
标题翻译：透明聚酰胺树脂组合物和交联透明聚酰胺树脂成型体
公开(公告)号：US09562147B2
公开(公告)日：2017-02-07
申请号：US14784825
申请日：2014-10-28
申请人： SUMITOMO ELECTRIC INDUSTRIES, LTD. , SUMITOMO ELECTRIC FINE POLYMER, INC.
发明人： Satoshi Yamasaki , Shouhei Okabe , Makoto Nakabayashi
IPC分类号： C08G69/26 , C08L77/00 , C08K5/3492 , C08J5/00 , C08L77/06
CPC分类号： C08K5/34924 , C08J5/00 , C08J2377/06 , C08L77/06 , G02B1/041
摘要： A transparent polyamide resin composition includes a transparent polyamide resin which is a copolymer of an alicyclic diamine and a dicarboxylic acid and which has a refractive index of 1.500 to 1.550, and a transparent crosslinking auxiliary having a refractive index of 1.500 to 1.550, in which the amount of the crosslinking auxiliary added is 13 to 26 parts by mass relative to 100 parts by mass of the transparent polyamide resin, and the crosslinking auxiliary is dispersed, as phases with a diameter of 350 nm or less, in the transparent polyamide resin. A crosslinked transparent polyamide resin molded body is obtained by molding the transparent polyamide resin composition and crosslinking the transparent polyamide resin.
摘要翻译：透明聚酰胺树脂组合物包括作为脂环族二胺和二羧酸的共聚物，折射率为1.500〜1.550的透明聚酰胺树脂和折射率为1.500〜1.550的透明交联助剂，其中，相对于100质量份的透明聚酰胺树脂，交联助剂的添加量为13〜26质量份，在透明聚酰胺树脂中，交联助剂以350nm以下的相分散。通过模塑透明聚酰胺树脂组合物并交联透明聚酰胺树脂来获得交联的透明聚酰胺树脂成型体。

2. 发明授权

US11375615B2 Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board 有权
公开(公告)号：US11375615B2
公开(公告)日：2022-06-28
申请号：US15753017
申请日：2016-08-06
申请人： SUMITOMO ELECTRIC INDUSTRIES, LTD. , SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. , SUMITOMO ELECTRIC FINE POLYMER, INC.
发明人： Yuichiro Yamanaka , Yoshio Oka , Satoshi Kiya , Yoshifumi Uchita , Makoto Nakabayashi
IPC分类号： H05K3/38 , H05K1/03 , B32B15/08 , B32B15/088
摘要： A substrate for a printed circuit board according to an embodiment of the present invention includes a base film and a metal layer disposed on at least one of surfaces of the base film. In the substrate for a printed circuit board, an amount of nitrogen present per unit area, the amount being determined on the basis of a peak area of a N1s spectrum in XPS analysis of a surface of the base film exposed after removal of the metal layer by etching with an acidic solution, is 1 atomic % or more and 10 atomic % or less.

3. 外观设计

USD734732S1 Circuit board material 有权
标题翻译：电路板材料
公开(公告)号：USD734732S1
公开(公告)日：2015-07-21
申请号：US29478679
申请日：2014-01-07
申请人： SUMITOMO ELECTRIC FINE POLYMER, INC. , SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
设计人： Makoto Nakabayashi , Masahiko Kouchi

4. 发明申请

US20150079343A1 FLUORORESIN SUBSTRATE 审中-公开
标题翻译：氟菊酯底物
公开(公告)号：US20150079343A1
公开(公告)日：2015-03-19
申请号：US14387272
申请日：2013-03-25
申请人： Sumitomo Electric Fine Polymer, Inc.
发明人： Makoto Nakabayashi , Kazuaki Ikeda
IPC分类号： H05K1/02 , H05K1/03
CPC分类号： H05K1/0271 , H05K1/024 , H05K1/0242 , H05K1/0306 , H05K1/0373 , H05K3/381 , H05K2201/015 , H05K2201/0209 , H05K2201/0254 , H05K2201/0358 , H05K2201/09136 , H05K2203/092 , Y10T428/24355 , Y10T428/249974
摘要： The invention offers a fluororesin substrate that has a dielectric layer being mainly composed of fluororesin and being formed on a metal conductor, that sufficiently suppresses the occurrence of warpage at the time of the reflow, and that enables the exhibiting of sufficiently outstanding high-frequency characteristics, the dielectric layer including hollow glass beads; a fluororesin substrate that has a metal conductor having a surface roughness, Rz, of 2.0 μm or less; a fluororesin substrate that has fluororesin irradiated with an ionizing radiation at an exposure dose of 0.01 to 500 kGy; and a fluororesin substrate that has fluororesin being one or two or more of polytetrafluoroethylene (PTFE), a tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA), a tetrafluoroethylene-hexafluoropropylene copolymer (FEP), and a tetrafluoroethylene-ethylene copolymer (ETFE).
摘要翻译：本发明提供一种氟树脂基材，其具有主要由氟树脂组成的介电层，并形成在金属导体上，充分抑制了回流时的翘曲发生，并且能够表现出足够突出的高频特性介电层包括中空玻璃珠; 具有2.0μm以下的表面粗糙度Rz的金属导体的氟树脂基板; 以0.01〜500kGy的曝光剂量照射电离辐射的氟树脂的氟树脂基材; 以及具有氟树脂为聚四氟乙烯（PTFE），四氟乙烯 - 全氟烷基乙烯基醚共聚物（PFA），四氟乙烯 - 六氟丙烯共聚物（FEP）和四氟乙烯 - 乙烯共聚物（ETFE）中的一种或两种以上的氟树脂基材。

5. 外观设计

USD716741S1 Wiring board 有权
公开(公告)号：USD716741S1
公开(公告)日：2014-11-04
申请号：US29476981
申请日：2013-12-18
申请人： Sumitomo Electric Printed Circuits, Inc. , Sumitomo Electric Fine Polymer, Inc.
设计人： Masahiko Kouchi , Tetsuya Shimakata , Makoto Nakabayashi

6. 发明授权

US11552356B2 Electricity storage device member, method of manufacturing the same, and electricity storage device 有权
公开(公告)号：US11552356B2
公开(公告)日：2023-01-10
申请号：US16617816
申请日：2018-03-20
申请人： Sumitomo Electric Fine Polymer, Inc. , TOYOTA JIDOSHA KABUSHIKI KAISHA
发明人： Makoto Nakabayashi , Hong-Phuc Nguyen , Keiji Kaita , Motoyoshi Okumura , Takuro Kikuchi
IPC分类号： H01M4/02 , H01M50/124 , B32B15/08 , H01G11/80 , H01M50/172
摘要： An electricity storage device member is provided. The electricity storage device member includes a base material mainly composed of a metal and a resin layer stacked on the base material, in which the resin layer contains a crosslinked fluororesin.

7. 外观设计

USD716241S1 Wiring board 有权
标题翻译：接线板
公开(公告)号：USD716241S1
公开(公告)日：2014-10-28
申请号：US29476992
申请日：2013-12-18
申请人： Sumitomo Electric Printed Circuits, Inc. , Sumitomo Electric Fine Polymer, Inc.
设计人： Masahiko Kouchi , Tetsuya Shimomura , Makoto Nakabayashi

8. 发明授权

US11364714B2 Fluororesin base material, printed wiring board, and circuit module 有权
公开(公告)号：US11364714B2
公开(公告)日：2022-06-21
申请号：US15027323
申请日：2014-10-08
申请人： SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. , SUMITOMO ELECTRIC INDUSTRIES, LTD.
发明人： Satoshi Kiya , Sumito Uehara , Kousuke Miura , Makoto Nakabayashi
IPC分类号： B32B27/32 , H05K1/03 , H05K3/38 , B32B7/12 , H05K3/20 , B32B27/30 , H05K1/02 , H05K3/28 , H05K3/06 , H05K3/00
摘要： A fluororesin base material containing a fluororesin as a main component includes a modified layer on at least a partial region of a surface thereof, the modified layer containing a siloxane bond and a hydrophilic organofunctional group, and a surface of the modified layer having a contact angle of 90° or less with pure water.

9. 发明授权

US10383215B2 Radio-frequency printed circuit board and wiring material 有权
公开(公告)号：US10383215B2
公开(公告)日：2019-08-13
申请号：US14890497
申请日：2014-01-16
申请人： SUMITOMO ELECTRIC INDUSTRIES, LTD. , SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
发明人： Masahiko Kouchi , Kazuo Murata , Makoto Nakabayashi
IPC分类号： H01K1/02 , H05K1/02 , B32B15/08 , H05K1/03 , H05K1/05 , B32B7/10
摘要： (1) A conductor layer is disposed on at least one surface of a dielectric layer, the dielectric layer including an intermediate layer and a pair or more of fluororesin layers disposed on both surfaces of the intermediate layer, in which the ratio of the total average thickness of the intermediate layer to the total average thickness of the fluororesin layers is 0.001 to 30, the relative dielectric constant of the intermediate layer is 1.2 to 10, the coefficient of linear expansion of the intermediate layer is −1×10−4/° C. to 5×10−5/° C., and the adhesive strength between the fluororesin layer and the conductor layer is 300 g/cm or more. (2) Conductor layers are disposed on both surfaces of a dielectric layer made of a fluororesin, in which at least one of the conductor layers constitutes a wiring pattern, the average trace width of the wiring pattern is 25 to 300 μm, the average thickness of the dielectric layer in the region where traces of the wiring pattern are disposed is 5 to 125 μm, and the ratio of the average trace width to the average thickness of the dielectric layer is 2.4 to 30. (3) A multilayer structure includes conductor layers and dielectric layers made of a fluororesin alternately disposed, in which the fluororesin of the dielectric layers is crosslinked and chemically bonded to the conductor layers, the average thickness of the multilayer structure is 30 to 2,000 μm, and the crush resistance of the multilayer structure measured by a loop stiffness test is 0.1 to 20,000 N/cm.

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