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    • 8. 发明授权
    • Electronic device having heat-radiating structure
    • US11800632B2
    • 2023-10-24
    • US17262973
    • 2019-07-24
    • SAMSUNG ELECTRONICS CO., LTD.
    • Yonghwa KimMin ParkDongil SonHyunwoo SimJaedeok LimChunghyo JungSeungbum Choi
    • H05K1/02
    • H05K1/0207H05K1/0209H05K1/0219
    • According to various embodiments, an electronic device may include a first plate, a second plate facing away from the first plate, and a side member surrounding a space between the first plate and the second plate, a middle plate disposed in the space between the first plate and the second plate in parallel with the second plate, a first Printed Circuit Board (PCB) disposed in a space between the second plate and the middle plate, a first electronic component mounted on the first PCB between the first PCB and the middle plate, a first heat transfer structure disposed between the first electronic component and the middle plate, a second electronic component including a first surface disposed in the space and spaced apart from the first PCB, a second surface facing away from the first surface, and a side face substantially perpendicular to the first surface or the second surface, and a second heat transfer structure. The second heat transfer structure may include a first thermal conductive layer including a first portion attached to the first surface or the second surface, and a second portion extending from the first portion toward the middle plate and at least partially having a thermal conductive path between the second electronic component and the middle plate, and a second electrical conductive layer including a third portion attached to the first portion so that the third portion constructs an electromagnetic shielding structure for the second electric component. Other various embodiments may also be possible.