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1. 发明授权

US11233894B2 Apparatus and method for controlling built-in microphone of portable terminal 有权
公开(公告)号：US11233894B2
公开(公告)日：2022-01-25
申请号：US16876978
申请日：2020-05-18
申请人： Samsung Electronics Co., Ltd.
发明人： Sang-Kyu Park , Seung-Yup Lee , Jung-Ho Park , Soo-Ho Song
IPC分类号： H04M1/72412 , H04W4/80 , H04M1/60 , H04M1/725
摘要： An electronic device is provided that includes a wireless communication device configured to connect with wireless external devices. The electronic device obtains information regarding the wireless external devices. Before and after a call connection event, it is determined whether each of the wireless external devices includes a microphone based on the information. In response to receiving the call connection event, when it is determined that only one of the wireless external devices includes a microphone, an audio input is obtained from the one of the wireless external devices that includes the microphone. In response to receiving the call connection event, when it is determined that at least two of the wireless external devices each include a respective microphone, an audio input is selectively obtained from a microphone of one of the at least two of the plurality of wireless external devices.

2. 发明授权

US09373656B2 Image sensor and method of manufacturing the same 有权
标题翻译：图像传感器及其制造方法
公开(公告)号：US09373656B2
公开(公告)日：2016-06-21
申请号：US14579311
申请日：2014-12-22
申请人： Samsung Electronics Co., Ltd.
发明人： Jung-Ho Park
IPC分类号： H01L23/58 , H01L27/146
CPC分类号： H01L27/1463 , H01L27/1462 , H01L27/14621 , H01L27/14627 , H01L27/14636 , H01L27/1464 , H01L27/14654 , H01L27/14689 , H01L2224/11
摘要： Image sensor and method of manufacturing the same are provided. The image sensor includes a semiconductor substrate including a pixel area, a voltage connection area, and a pad area, a plurality of photoelectric conversion devices in the pixel area, an anti-reflective layer on a back side of the semiconductor substrate and on the plurality of photoelectric conversion devices, a device isolation structure between the plurality of photoelectric conversion devices, at least one voltage connection structure in the voltage connection area, and electrically connected to the device isolation structure, at least one voltage applying device electrically connected to the at least one voltage connection structure, an internal circuit including at least one conductive inner wire and at least one conductive inner via in an insulating layer, and a through via structure in the pad area.
摘要翻译：提供了图像传感器及其制造方法。图像传感器包括：半导体衬底，包括像素区域，电压连接区域和焊盘区域，像素区域中的多个光电转换器件，半导体衬底的背侧上的抗反射层以及多个的光电转换装置，多个光电转换装置之间的器件隔离结构，电压连接区域中的至少一个电压连接结构，并且电连接到器件隔离结构，至少一个电压施加装置电连接到至少一个电压连接结构，包括绝缘层中的至少一个导电内部导线和至少一个导电内部通孔的内部电路，以及所述焊盘区域中的通孔结构。

3. 发明授权

US09887461B2 Re-configurable built-in antenna for portable terminal 有权
公开(公告)号：US09887461B2
公开(公告)日：2018-02-06
申请号：US14582714
申请日：2014-12-24
申请人： Samsung Electronics Co., Ltd.
发明人： Jin-U Kim , Austin Kim , Dong-Hwan Kim , Jae-Ho Lee , Jung-Ho Park
IPC分类号： H04M1/00 , H01Q11/12 , H01Q9/16 , H01Q7/00 , H01Q5/364 , H01Q1/24 , H01Q9/04
CPC分类号： H01Q5/364 , H01Q1/243 , H01Q9/0421 , H01Q9/0442
摘要： A re-reconfigurable built-in antenna of a portable terminal is provided. The antenna includes an antenna radiator having a feeding pad electrically connected to a feeding portion of a main board of the terminal and at least one ground pad disposed in a position different from that of the feeding pad for selectively establishing an electrical connection to a ground portion of the terminal, and a switching element, commonly connected to the at least one ground pad of the antenna radiator, for selectively establishing an electrical connection to the ground portion by a switching operation. The antenna radiator changes a shape of the antenna radiator by using the selective electrical connection of the ground portion so as to have various operational frequency bands and radiation properties.

4. 发明授权

US09456073B2 Apparatus and method for controlling built-in microphone of portable terminal 有权
标题翻译：用于控制便携式终端内置麦克风的装置和方法
公开(公告)号：US09456073B2
公开(公告)日：2016-09-27
申请号：US14842515
申请日：2015-09-01
申请人： Samsung Electronics Co., Ltd.
发明人： Sang-Kyu Park , Seung-Yup Lee , Jung-Ho Park , Soo-Ho Song
IPC分类号： H04B7/00 , H04M1/725 , H04M1/60 , H04W4/00
CPC分类号： H04M1/7253 , H04M1/6016 , H04M1/6058 , H04M1/6066 , H04M1/725 , H04W4/80
摘要： An electronic device and method are provided. The electronic device includes a built-in microphone; a Bluetooth communication module configured to wirelessly connect to a first wireless external device including a speaker and a second wireless external device including a speaker; and a controller configured to detect a call establishment, if the call establishment is detected while one of the first and second wireless external devices is connected to the electronic device, operate the built-in microphone to receive sound based on information regarding the connected one of the first and second wireless external devices, and if the call establishment is detected while both of the first and second wireless external devices are connected to the electronic device, provide an incoming call audio signal received via the call establishment to one of the first and second wireless external devices.
摘要翻译：提供了一种电子设备和方法。电子设备包括内置麦克风; 蓝牙通信模块，被配置为无线地连接到包括扬声器的第一无线外部设备和包括扬声器的第二无线外部设备; 以及控制器，被配置为检测呼叫建立，如果在所述第一和第二无线外部设备中的一个连接到所述电子设备的同时检测到所述呼叫建立，则基于关于所连接的所述第二和第二无线外部设备的信息来操作所述内置麦克风以接收声音第一和第二无线外部设备，并且如果在第一和第二无线外部设备都连接到电子设备的同时检测到呼叫建立，则将经由呼叫建立接收的呼入音频信号提供给第一和第二无线外部设备之一无线外部设备。

5. 发明授权

US09124710B2 Apparatus and method for controlling built-in microphone of portable terminal 有权
标题翻译：用于控制便携式终端内置麦克风的装置和方法
公开(公告)号：US09124710B2
公开(公告)日：2015-09-01
申请号：US14325848
申请日：2014-07-08
申请人： Samsung Electronics Co., Ltd.
发明人： Sang-Kyu Park , Seung-Yup Lee , Jung-Ho Park , Soo-Ho Song
IPC分类号： H04M3/00 , H04M1/60 , H04M1/725 , H04W4/00 , H04B1/38 , H04M1/00 , H01R3/00
CPC分类号： H04M1/7253 , H04M1/6016 , H04M1/6058 , H04M1/6066 , H04M1/725 , H04W4/80
摘要： An apparatus and method for controlling a built-in microphone of a portable terminal is provided. The method includes checking whether a connection device connected to the portable electronic device includes an external microphone; operating the built-in microphone of the portable electronic device to receive a first signal, upon connecting a call, when the connection device does not include the external microphone; and selecting, upon connecting the call while a plurality of connection devices are connected to the portable electronic device, one connection device from among the plurality of connection devices to output a second signal.
摘要翻译：提供了一种用于控制便携式终端的内置麦克风的装置和方法。该方法包括检查连接到便携式电子设备的连接装置是否包括外部麦克风; 当所述连接装置不包括所述外部麦克风时，操作所述便携式电子设备的内置麦克风以在连接呼叫时接收第一信号; 以及在多个连接装置连接到所述便携式电子装置的同时，在连接所述呼叫时选择来自所述多个连接装置中的一个连接装置，以输出第二信号。

6. 发明授权

US11121064B2 Semiconductor package 有权
公开(公告)号：US11121064B2
公开(公告)日：2021-09-14
申请号：US16819318
申请日：2020-03-16
申请人： Samsung Electronics Co., Ltd.
发明人： Jung-Ho Park , Da Hye Kim , Jin-Woo Park , Jae Gwon Jang
IPC分类号： H01L23/495 , H01L23/498 , H01L23/31
摘要： A semiconductor package having a redistribution structure including a first face and a second face and a first semiconductor chip mounted on the first face. The semiconductor package may further include a first redistribution pad exposed from the second face of the redistribution structure and a second redistribution pad exposed from the second face of the redistribution structure. The semiconductor package may further include a first solder ball being in contact with the first redistribution pad and a second solder ball being in contact with the second redistribution pad. In some embodiments, a first distance of the first redistribution pad is smaller than a second distance of the second redistribution pad, the first and second distances are measured with respect to a reference plane that intersects a lower portion of the first solder ball and a lower portion of the second solder ball.

7. 发明申请

US20200280627A1 APPARATUS AND METHOD FOR CONTROLLING BUILT-IN MICROPHONE OF PORTABLE TERMINAL 审中-公开
公开(公告)号：US20200280627A1
公开(公告)日：2020-09-03
申请号：US16876978
申请日：2020-05-18
申请人： Samsung Electronics Co., Ltd.
发明人： Sang-Kyu PARK , Seung-Yup Lee , Jung-Ho Park , Soo-Ho Song
IPC分类号： H04M1/725 , H04W4/80 , H04M1/60
摘要： An electronic device is provided that includes a wireless communication device configured to connect with wireless external devices. The electronic device obtains information regarding the wireless external devices. Before and after a call connection event, it is determined whether each of the wireless external devices includes a microphone based on the information. In response to receiving the call connection event, when it is determined that only one of the wireless external devices includes a microphone, an audio input is obtained from the one of the wireless external devices that includes the microphone. In response to receiving the call connection event, when it is determined that at least two of the wireless external devices each include a respective microphone, an audio input is selectively obtained from a microphone of one of the at least two of the plurality of wireless external devices.

8. 发明申请

US20190289113A1 APPARATUS AND METHOD FOR CONTROLLING BUILT-IN MICROPHONE OF PORTABLE TERMINAL 审中-公开
公开(公告)号：US20190289113A1
公开(公告)日：2019-09-19
申请号：US16432606
申请日：2019-06-05
申请人： Samsung Electronics Co., Ltd.
发明人： Sang-Kyu PARK , Seung-Yup Lee , Jung-Ho Park , Soo-Ho Song
IPC分类号： H04M1/725 , H04M1/60 , H04W4/80
摘要： An electronic device is provided that includes a wireless communication circuitry, and a controller operatively connected with the wireless communication circuitry. The controller is configured to obtain, from at least one of wireless external devices, information indicating whether each of the wireless external devices includes a microphone. In response to receiving a call connection event while the wireless communication circuitry is wirelessly connected with the at least one of the wireless external devices: when the obtained information indicates that only one of the wireless external devices includes a microphone, an audio input is obtained from the one of the wireless external devices that includes the microphone; and when the obtained information indicates that at least two of the wireless external devices each include a respective microphone, an audio input is selectively obtained from a microphone of one of the at least two wireless external devices.

9. 发明授权

US10334093B2 Apparatus and method for controlling built-in microphone of portable terminal 有权
公开(公告)号：US10334093B2
公开(公告)日：2019-06-25
申请号：US16134397
申请日：2018-09-18
申请人： Samsung Electronics Co., Ltd.
发明人： Sang-Kyu Park , Seung-Yup Lee , Jung-Ho Park , Soo-Ho Song
IPC分类号： H04M1/60 , H04M1/725 , H04W4/80
摘要： A mobile phone is provided that is configured to obtain information of one or more external wireless devices operatively coupled with the mobile phone. In response to a call connection event, when the mobile phone is operatively coupled with one external wireless device among the one or more external wireless devices, and if obtained information regarding the one external wireless device indicates that the one external wireless device does not include a microphone, an audio input is obtained via the built-in microphone. In response to a call connection event, when the mobile phone is operatively coupled with one external wireless device among the one or more external wireless devices, and if obtained information regarding the one external wireless device indicates that the one external wireless device includes a microphone, an audio input is obtained via the microphone of the one external wireless device.

10. 发明授权

US11515260B2 Method for fabricating a semiconductor package 有权
公开(公告)号：US11515260B2
公开(公告)日：2022-11-29
申请号：US16874284
申请日：2020-05-14
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Da Hye Kim , Dong Kyu Kim , Jung-Ho Park
IPC分类号： H01L23/538 , H01L23/00 , H01L25/16 , H01L25/00 , H01L21/683 , H01L21/48 , H01L21/56 , H01L23/31
摘要： A method for fabricating a semiconductor package includes forming a release layer on a first carrier substrate. An etch stop layer is formed on the release layer. A first redistribution layer is formed on the etch stop layer and includes a plurality of first wires and a first insulation layer surrounding the plurality of first wires. A first semiconductor chip is formed on the first redistribution layer. A solder ball is formed between the first redistribution layer and the first semiconductor chip. A second carrier substrate is formed on the first semiconductor chip. The first carrier substrate, the release layer, and the etch stop layer are removed. The second carrier substrate is removed.

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