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1. 发明授权

US11507143B2 Electronic device including a plurality of displays and method for operating same 有权
公开(公告)号：US11507143B2
公开(公告)日：2022-11-22
申请号：US17339376
申请日：2021-06-04
申请人： Samsung Electronics Co., Ltd.
发明人： Minsoo Kim , Joungmin Cho , Myunghoon Kwak , Kibeom Kim , Teayoung Kim , Sanghyuk Park , Yangwook Kim , Hyunju Hong , Hyunggwang Kang
IPC分类号： G06F1/16 , H04M1/02
摘要： Various embodiments may provide an electronic device including: a housing; a first display configured to be slidable through the housing, wherein at least a portion of the first display is exposed to an outside through the housing, and a region of the first display, exposed to the outside, is capable of being changed based on sliding of the first display through the housing; a second display spaced a certain distance apart from the exposed at least portion of the first display and disposed to form a flat surface with the exposed at least portion of the first display; and at least one processor disposed in the housing, wherein the at least one processor is configured to display first content on the first display and second content on the second display. Various other embodiments are possible.

2. 发明授权

US11051251B2 Hardware reset control method and electronic device 有权
公开(公告)号：US11051251B2
公开(公告)日：2021-06-29
申请号：US17104471
申请日：2020-11-25
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Junghui Park , Minsoo Kim , Chanhun Yun , Jinkyu Kim , Jiwoo Lee , Yeunwook Lim
IPC分类号： H04W52/02 , H04W4/80
摘要： The disclosure relates to a method for providing hardware reset in an electronic device having at least one non-physical key and the electronic device thereof, and an operating method of the electronic device may include detecting a current amount supplied to a processor, detecting whether wireless power is input, generating a hardware reset signal based on the detected current amount and the wireless power input, and transmitting the generated hardware reset signal to the processor.

3. 发明授权

US10477675B1 Electronic device including capacitive structure 有权
公开(公告)号：US10477675B1
公开(公告)日：2019-11-12
申请号：US16377582
申请日：2019-04-08
申请人： SAMSUNG ELECTRONICS CO., LTD.
发明人： Minsoo Kim , Hyuntae Jung , Jiwoo Lee
IPC分类号： H05K1/02 , H01Q1/48 , H04M1/02 , H01Q1/52
摘要： Various embodiments of the disclosure relate to an electronic device including a capacitive structure. The electronic device may include: a housing including a first plate, a second plate facing a direction opposite the first plate, and a side member comprising a side wall surrounding a space between the first plate and the second plate, the side member including a conductive portion; a conductive mid-plate disposed in the housing parallel to the second plate; a dielectric gap formed between the conductive portion and the conductive mid-plate; a printed circuit board (PCB) disposed inside the housing between the conductive mid-plate and the second plate, the PCB including a ground plane; and a capacitive structure comprising a conductive material disposed at a boundary portion of the dielectric gap and the conductive mid-plate between the conductive mid-plate and the PCB, the capacitive structure including a first conductive layer connected to the conductive mid-plate, a second conductive layer spaced apart from the first conductive layer and electrically connected to the ground plane, and a dielectric layer interposed between the first conductive layer and the second conductive layer.

4. 外观设计

USD854028S1 Display screen or portion thereof with transitional graphical user interface 有权
公开(公告)号：USD854028S1
公开(公告)日：2019-07-16
申请号：US29618081
申请日：2017-09-19
申请人： SAMSUNG ELECTRONICS CO., LTD.
设计人： Saegee Oh , Sihak Jang , Jamin Goo , Kiyoung Kwon , Gangheok Kim , Kiwon Kim , Minsoo Kim , Yonguk Kim , Jimin Kim , Chulkwi Kim , Joo Namkung , Seonghoon Yu , Yongju Yu , Dongkyu Lee , Yosub Lee , Imsung Lee , Chanwon Lee

5. 外观设计

USD847020S1 Drone 有权
公开(公告)号：USD847020S1
公开(公告)日：2019-04-30
申请号：US29600871
申请日：2017-04-17
申请人： Samsung Electronics Co., Ltd.
设计人： Minsoo Kim

6. 外观设计

USD846440S1 Drone 有权
公开(公告)号：USD846440S1
公开(公告)日：2019-04-23
申请号：US29600874
申请日：2017-04-17
申请人： Samsung Electronics Co., Ltd.
设计人： Minsoo Kim

7. 发明授权

US10108230B2 Electronic device including flexible display 有权
公开(公告)号：US10108230B2
公开(公告)日：2018-10-23
申请号：US14877437
申请日：2015-10-07
申请人： Samsung Electronics Co., Ltd.
发明人： Minsoo Kim , Jaehwan Kim , Jinman Kim , Youngtae Jeong
IPC分类号： G06F3/041 , G06F1/16 , G02F1/1333
摘要： An electronic device including a flexible display and a method capable of determining a bending direction of the flexible display by using at least one bending confirmation touch recognition pattern are provided. The electronic device includes a flexible display unit including a display panel and a support structure configured to support the display panel; a sensor unit configured to sensing bending of the flexible display unit; and a control unit configured to determine a bending extent and a bending direction of the flexible display unit based on a sensing result of the sensor unit, wherein a plurality of touch recognition patterns are arranged on the display panel and the support structure, and the arranged touch recognition patterns include a bending confirmation pattern.

8. 发明授权

US09931838B2 Method of controlling film thickness distribution and method of manufacturing display apparatus using the method 有权
公开(公告)号：US09931838B2
公开(公告)日：2018-04-03
申请号：US15254019
申请日：2016-09-01
申请人： SAMSUNG DISPLAY CO., LTD. , SAMSUNG ELECTRONICS CO., LTD.
发明人： Dongjun Lee , Minsoo Kim , Jongwon Kim , Seungdon Lee , Hyunjin Lee
IPC分类号： B41J2/045 , H01L51/56 , H01L51/52 , H01L27/32 , G02F1/133 , G02F1/1337 , G02F1/1341
CPC分类号： B41J2/04541 , B41J2/04586 , G02F1/1303 , G02F1/13306 , G02F1/1337 , G02F1/1341 , H01L27/3244 , H01L51/0005 , H01L51/5253 , H01L51/56 , H01L2227/323 , H01L2251/558
摘要： An inkjet printing method includes: setting a first region to be printed at a constant print density within a target region to be printed; setting a second region within the target region and closer than the first region to an edge of the target region, wherein the second region is to be printed at a print density that varies according to a position; generating control data for a plurality of nozzles provided on an inkjet head in order to print the first region and the second region; and driving the inkjet head according to the control data.

9. 发明授权

US09721930B2 Semiconductor package and method for fabricating the same 有权
公开(公告)号：US09721930B2
公开(公告)日：2017-08-01
申请号：US15168236
申请日：2016-05-30
申请人： Samsung Electronics Co., Ltd.
发明人： Hyoungjoo Lee , Minsoo Kim , Teak Hoon Lee , Young Kun Jee
IPC分类号： H01L23/52 , H01L25/065 , H01L23/498 , H01L25/00 , H01L23/31
CPC分类号： H01L25/0657 , H01L23/3128 , H01L23/49838 , H01L25/0652 , H01L25/50 , H01L2224/0401 , H01L2224/0557 , H01L2224/13025 , H01L2224/16145 , H01L2224/16227 , H01L2224/17181 , H01L2224/32145 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2924/15311 , H01L2924/18161 , H01L2924/00
摘要： A semiconductor package includes a first semiconductor chip stacked on a package substrate in which a first surface of the first semiconductor chip faces the package substrate and a second surface that is opposite to the first surface, a second semiconductor chip stacked on the first semiconductor chip that includes a third surface facing the first semiconductor chip and a fourth surface that is opposite to the third surface, and an integral adhesive structure that substantially continuously fills a first space between the package substrate and the first semiconductor chip and a second space between the first and second semiconductor chips. The integral adhesive structure includes an extension protruding from outer sidewalls of the first and second semiconductor chips. The extension has one continuously convex sidewall between a level of the first surface and a level of the fourth surface.

10. 外观设计

USD764466S1 Head-mounted display device 有权
公开(公告)号：USD764466S1
公开(公告)日：2016-08-23
申请号：US29536748
申请日：2015-08-19
申请人： Samsung Electronics Co., Ltd.
设计人： Minsoo Kim , Jinsoo Kim , Yongseok Bang

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