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1. 发明授权

US11324111B1 Apparatus for shielding of surface-mount devices 有权
公开(公告)号：US11324111B1
公开(公告)日：2022-05-03
申请号：US17072871
申请日：2020-10-16
申请人： Scientific Components Corporation
发明人： Aaron Vaisman , Benjamin Kahtan , Behnam Tabrizi , Himat Hayer
IPC分类号： H05K1/18 , H05K1/02 , H05K1/03
摘要： An apparatus for a shielding structure for surface-mount components and filters to increase the signal isolation from input signal port to output signal port. An LTCC filter device with an increased rejection of undesired frequencies in a stopband and minimal distortion or loss of desired signals in a passband.

2. 发明授权

US11638370B1 Method and apparatus for a shielding structure of surface-mount LTCC devices 有权
公开(公告)号：US11638370B1
公开(公告)日：2023-04-25
申请号：US17072924
申请日：2020-10-16
申请人： Scientific Components Corporation
发明人： Aaron Vaisman
IPC分类号： H05K9/00 , H03H1/00 , H05K1/18 , H05K3/30
摘要： An apparatus and method for a shielding structure for surface-mount LTCC components and filters to increase the signal isolation from input signal port to output signal port. An LTCC filter device with an increased rejection of undesired frequencies in a stopband and minimal distortion or loss of desired signals in a passband.

3. 发明授权

US10861803B1 Low cost millimeter wave integrated LTCC package and method of manufacturing 有权
公开(公告)号：US10861803B1
公开(公告)日：2020-12-08
申请号：US15924787
申请日：2018-03-19
申请人： Scientific Components Corporation
发明人： Aaron Vaisman
IPC分类号： H01L21/00 , H01L23/66 , H01L23/00 , H01L23/13 , H01L25/18 , H01L23/538 , H01L23/15
摘要： LTCC structure extends between top and bottom surfaces, with at least one cavity being formed within the structure and extending from the top surface inwardly in the direction of the bottom surface. A die is disposed within the cavity a top surface of the die is positioned flush with the top surface of the package, resulted in the shortest length of the wire box connecting the die with the LTCC structure and ultimately reducing the inductance.

4. 发明申请

US20150303547A1 VAISMAN BALUNS AND MICROWAVE DEVICES EMPLOYING THE SAME 审中-公开
标题翻译： VAISMAN BALUNS和MICROWAVE设备使用它们
公开(公告)号：US20150303547A1
公开(公告)日：2015-10-22
申请号：US14244997
申请日：2014-04-04
申请人： Scientific Components Corporation
发明人： Aaron Vaisman
IPC分类号： H01P5/10 , H01P11/00
CPC分类号： H01P5/10 , H03H7/422
摘要： A planar balun comprises a balun input, a first balun output, a second balun output, two primary coupled lines with a first cross-sectional area disposed on an inhomogeneous medium, and two secondary coupled lines with a second cross-sectional area, the second coupled lines disposed on an inhomogeneous medium. Each of the primary coupled lines are coupled to one of the secondary coupled lines with a predetermined uniform surface space therebetween. The first cross-sectional area and the second cross-sectional area are unequal, thereby producing pairs of asymmetric coupled lines.
摘要翻译：平面平衡 - 不平衡变压器包括平衡 - 不平衡转换器输入，第一平衡 - 不平衡变换器输出，第二平衡 - 不平衡变换器输出，具有设置在不均匀介质上的第一横截面积的两个主耦合线，以及具有第二横截面积的两个辅助耦合线，设置在不均匀介质上的耦合线。每个主耦合线路之间具有预定的均匀表面空间耦合到二次耦合线路之一。第一横截面积和第二横截面面积不相等，从而产生成对的不对称耦合线。

5. 发明授权

US11430752B1 Low cost millimiter wave integrated LTCC package 有权
公开(公告)号：US11430752B1
公开(公告)日：2022-08-30
申请号：US17112604
申请日：2020-12-04
申请人： Scientific Components Corporation
发明人： Aaron Vaisman
IPC分类号： H01L23/00 , H01L23/13 , H01L25/18 , H01L23/538 , H01L23/15 , H01L23/66
摘要： LTCC structure extends between top and bottom surfaces, with at least one cavity being formed within the structure and extending from the top surface inwardly in the direction of the bottom surface. A die is disposed within the cavity a top surface of the die is positioned flush with the top surface of the package, resulted in the shortest length of the wire box connecting the die with the LTCC structure and ultimately reducing the inductance.

6. 发明授权

US09949361B1 Geometrically inverted ultra wide band microstrip balun 有权
公开(公告)号：US09949361B1
公开(公告)日：2018-04-17
申请号：US15146577
申请日：2016-05-04
申请人： Scientific Components Corporation
发明人： Aaron Vaisman
IPC分类号： H03H7/42 , H05K1/02 , H05K1/11 , H01P5/10 , H01P5/08 , H01P5/19 , H01P3/08
CPC分类号： H01P5/085 , H01P5/028 , H01P5/10 , H05K1/0245 , H05K1/0251 , H05K2201/09609 , H05K2201/09618
摘要： A balun device comprises an input microstrip, a first output microstrip, a second output microstrip, and a junction comprising a conductive termination of the input microstrip, the first output microstrip, and the second output microstrip, whereby an input signal provided to the input microstrip will propagate through the first output microstrip as a first output signal and through the second output microstrip as a second output signal, wherein the phase of the first output signal is identical to the phase of the input signal, and wherein the junction inverts the phase of the second output signal relative to the phase of the input signal and the first output signal.

7. 发明授权

US09300022B2 Vaisman baluns and microwave devices employing the same 有权
标题翻译： Vaisman平衡不平衡变压器和采用相同的微波设备
公开(公告)号：US09300022B2
公开(公告)日：2016-03-29
申请号：US14244997
申请日：2014-04-04
申请人： Scientific Components Corporation
发明人： Aaron Vaisman
IPC分类号： H03H7/42 , H01P5/10 , H01P3/08
CPC分类号： H01P5/10 , H03H7/422
摘要： A planar balun comprises a balun input, a first balun output, a second balun output,two primary coupled lines with a first cross-sectional area disposed on an inhomogeneous medium, and two secondary coupled lines with a second cross-sectional area, the second coupled lines disposed on an inhomogeneous medium. Each of the primary coupled lines are coupled to one of the secondary coupled lines with a predetermined uniform surface space therebetween. The first cross-sectional area and the second cross-sectional area are unequal, thereby producing pairs of asymmetric coupled lines.
摘要翻译：平面平衡 - 不平衡变压器包括平衡 - 不平衡转换器输入，第一平衡 - 不平衡变换器输出，第二平衡 - 不平衡变换器输出，具有设置在不均匀介质上的第一横截面积的两个主耦合线，以及具有第二横截面积的两个辅助耦合线，设置在不均匀介质上的耦合线。每个主耦合线路之间具有预定的均匀表面空间耦合到二次耦合线路之一。第一横截面积和第二横截面面积不相等，从而产生成对的不对称耦合线。

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