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1. 发明申请

US20180323550A1 SINGLE-PAIR ETHERNET PLUG 审中-公开
公开(公告)号：US20180323550A1
公开(公告)日：2018-11-08
申请号：US15941223
申请日：2018-03-30
申请人： Sentinel Connector Systems, Inc.
发明人： Robert Brennan , Justin Wagner
IPC分类号： H01R13/6594 , H01R24/64
CPC分类号： H01R13/6594 , H01R13/514 , H01R24/64 , H01R2201/04
摘要： A modular plug including a housing having a single-pair of contacts for Ethernet data and power. Each contact includes a conductor termination portion disposed at the channel and a jack interface portion disposed at the mating end. The conductor termination portion has a width greater than a width of the jack interface portion.

2. 发明授权

US09627816B2 High speed grounded communication jack 有权
公开(公告)号：US09627816B2
公开(公告)日：2017-04-18
申请号：US15146019
申请日：2016-05-04
申请人： Sentinel Connector Systems, Inc.
发明人： Brett D. Robinson , Justin Wagner
IPC分类号： H01R13/658 , H01R13/6581 , H01R13/6474 , H01R24/64 , H01R107/00 , H01R13/66
CPC分类号： H01R13/6581 , H01R13/6474 , H01R13/6658 , H01R24/64 , H01R2107/00 , Y10T29/49165
摘要： A method of manufacturing a high speed jack, the method including the steps of forming a housing including a port for accepting a plug, the port including a plurality of pins each connected to a corresponding signal line in the plug, forming a shielding case surrounding the housing, forming a top layer of a substrate, a first shielding layer on a first side of the top layer in the substrate, a second shielding layer adjacent the first shielding layer in the substrate, and forming a bottom layer adjacent to the second shielding layer, forming a plurality of first vias extending through the substrate with each first via being configured to accommodate a pin on the housing, forming a plurality of second vias extending through the substrate with each second via being configured to accommodate a pin on the housing.

3. 发明授权

US10938166B2 Switched power over ethernet connector 有权
公开(公告)号：US10938166B2
公开(公告)日：2021-03-02
申请号：US16777104
申请日：2020-01-30
申请人： Sentinel Connector Systems, Inc.
发明人： Robert Brennan , Justin Wagner , Brett Robinson
IPC分类号： H01R13/70 , H01R13/713 , H01R13/627
摘要： An arc prevention system including a jack having a receptacle, a modular plug sized to be positioned in the receptacle of the jack, the modular connector including, a plurality of contacts, with at least two of the contacts creating an energized electrical path with an external power source in electrical communication with the external power source, a latch extending from a top surface of the modular plug, a switching unit positioned on the latch, a control circuit in electrical communication with the switch and the at least two energized contacts, where the electrical path between the control circuit and the switching unit is not energized, and the control circuit adjusts the energized electrical path to a predetermined electrical level.

4. 发明申请

US20220271467A1 TWO WIRE ELECTRICAL CONNECTOR 有权
公开(公告)号：US20220271467A1
公开(公告)日：2022-08-25
申请号：US17672846
申请日：2022-02-16
申请人： Sentinel Connector Systems, Inc.
发明人： Robert Brennan , Justin Wagner , Randy Schwartz
IPC分类号： H01R13/42 , H01R43/20 , H01R4/2404
摘要： A modular plug including a housing including an opening extending from a back end of the plug to an opposing front wall, a plurality of slots in a top surface of the plug that extend into the cavity, where at least two slots include a conductive material.

5. 发明申请

US20220013963A1 SWITCHED POWER OVER ETHERNET CONNECTOR 有权
公开(公告)号：US20220013963A1
公开(公告)日：2022-01-13
申请号：US17482957
申请日：2021-09-23
申请人： Sentinel Connector Systems, Inc.
发明人： Robert Brennan , Justin Wagner
IPC分类号： H01R13/703 , H01R13/627 , H01R43/26 , H01R24/64 , H01R13/71 , G06F1/26 , H04L12/10
摘要： An arc prevention system including a jack having a receptacle, with the receptacle having an upper wall, a bottom wall, two opposing side walls and a back wall between the two opposing side walls, a sensor unit positioned on the back wall of the receptacle, where the sensor unit is positioned on the back wall of the receptacle such that the sensor unit engages a plug inserted into the receptacle.

6. 发明授权

US11133625B2 Switched power over ethernet connector 有权
公开(公告)号：US11133625B2
公开(公告)日：2021-09-28
申请号：US16717874
申请日：2019-12-17
申请人： Sentinel Connector Systems, Inc.
发明人： Robert Brennan , Justin Wagner
IPC分类号： H01R13/703 , H01R13/627 , H01R43/26 , H01R24/64 , H01R13/71 , G06F1/26 , H04L12/10 , H01R107/00 , H01R13/66
摘要： An arc prevention system including a jack having a receptacle, a modular plug sized to be positioned in the receptacle of the jack, the modular connector including, a plurality of contacts, with at least two of the contacts creating an energized electrical path with an external power source in electrical communication with the external power source, a latch extending from a top surface of the modular plug, a switching unit positioned on the latch, a control circuit in electrical communication with the switch and the at least two energized contacts, where the electrical path between the control circuit and the switching unit is not energized, and the control circuit adjusts the energized electrical path to a predetermined electrical level.

7. 发明申请

US20230112630A1 Switched Power over Ethernet Connector 有权
公开(公告)号：US20230112630A1
公开(公告)日：2023-04-13
申请号：US17973892
申请日：2022-10-26
申请人： Sentinel Connector Systems, Inc.
发明人： Robert Brennan , Justin Wagner , Brett Robinson
IPC分类号： H01R13/70 , H01R13/713 , H01R13/627
摘要： An arc prevention system including a jack having a receptacle, a modular connector sized to be positioned in the receptacle of the jack, the modular connector including a plurality of contacts, with at least two of the contacts creating an energized electrical path with an external power source in electrical communication with the external power source, a latch extending from a top surface of the modular connector, a switching unit positioned on the latch, a plug unit positioned between the latch and the jack that prevents the modular connector from moving out of the receptacle, a control circuit in electrical communication with switch and the at least two energized contacts, where the electrical path between the control circuit and the switching unit is energized when the plug engages the switching unit on the latch, and the control circuit adjusts the energized electrical path to a predetermined electrical level.

8. 发明授权

US09899776B2 High speed communication jack 有权
公开(公告)号：US09899776B2
公开(公告)日：2018-02-20
申请号：US15484294
申请日：2017-04-11
申请人： Sentinel Connector Systems, Inc.
发明人： Brett D Robinson , Justin Wagner
IPC分类号： H01R13/6599 , H01R13/6585 , H01R43/16 , H01R24/64 , H01R107/00
CPC分类号： H01R13/6599 , H01R13/6466 , H01R13/6585 , H01R24/64 , H01R43/16 , H01R2107/00 , H05K1/0218 , H05K1/0228 , H05K1/0245 , H05K1/025 , H05K1/028
摘要： A high speed communication jack including a housing including a port for accepting a plug, the port including a plurality of pins each connected to a corresponding signal line in the plug, a shielding case surrounding the housing, a circuit board in the housing having a substrate, a plurality of first vias extending through the substrate with each first via being configured to accommodate a pin on the housing, a plurality of second vias extending through the substrate with each second via being configured to accommodate a pin on the housing, a first set of traces on a top layer of the substrate that connects at least one first via with at least one corresponding second via; and a second set of traces on a side of the substrate opposite the top layer that connects at least one first via with at least one second via.

9. 发明申请

US20170229818A1 HIGH SPEED COMMUNICATION JACK 有权
公开(公告)号：US20170229818A1
公开(公告)日：2017-08-10
申请号：US15484294
申请日：2017-04-11
申请人： Sentinel Connector Systems, Inc.
发明人： Brett D. ROBINSON , Justin Wagner
IPC分类号： H01R13/6599 , H01R43/16 , H01R24/64 , H01R13/6585
CPC分类号： H01R13/6599 , H01R13/6466 , H01R13/6585 , H01R24/64 , H01R43/16 , H01R2107/00 , H05K1/0218 , H05K1/0228 , H05K1/0245 , H05K1/025 , H05K1/028
摘要： A high speed communication jack including a housing including a port for accepting a plug, the port including a plurality of pins each connected to a corresponding signal line in the plug, a shielding case surrounding the housing, a circuit board in the housing having a substrate, a plurality of first vias extending through the substrate with each first via being configured to accommodate a pin on the housing, a plurality of second vias extending through the substrate with each second via being configured to accommodate a pin on the housing, a first set of traces on a top layer of the substrate that connects at least one first via with at least one corresponding second via; and a second set of traces on a side of the substrate opposite the top layer that connects at least one first via with at least one second via.

10. 发明申请

US20160248205A1 HIGH SPEED GROUNDED COMMUNICATION JACK 有权
标题翻译：高速接地通讯插座
公开(公告)号：US20160248205A1
公开(公告)日：2016-08-25
申请号：US15146019
申请日：2016-05-04
申请人： Sentinel Connector Systems, Inc.
发明人： Brett D. ROBINSON , Justin Wagner
IPC分类号： H01R24/60 , H01R13/6599 , H01R43/16 , H01R13/6581
CPC分类号： H01R13/6581 , H01R13/6474 , H01R13/6658 , H01R24/64 , H01R2107/00 , Y10T29/49165
摘要： A method of manufacturing a high speed jack, the method including the steps of forming a housing including a port for accepting a plug, the port including a plurality of pins each connected to a corresponding signal line in the plug, forming a shielding case surrounding the housing, forming a top layer of a substrate, a first shielding layer on a first side of the top layer in the substrate, a second shielding layer adjacent the first shielding layer in the substrate, and forming a bottom layer adjacent to the second shielding layer, forming a plurality of first vias extending through the substrate with each first via being configured to accommodate a pin on the housing, forming a plurality of second vias extending through the substrate with each second via being configured to accommodate a pin on the housing.
摘要翻译：一种制造高速千斤顶的方法，所述方法包括以下步骤：形成包括用于接收插头的端口的壳体，所述端口包括多个引脚，每个引脚各自连接到插头中的相应信号线，形成围绕所述插头的屏蔽壳形成衬底的顶层，在衬底顶层的第一侧的第一屏蔽层，与衬底中的第一屏蔽层相邻的第二屏蔽层，以及形成与第二屏蔽层相邻的底层形成延伸穿过所述基板的多个第一通孔，每个第一通孔被配置为容纳所述壳体上的销，形成延伸穿过所述基板的多个第二通孔，每个第二通孔被配置成容纳所述壳体上的销。

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