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    • 1. 发明授权
    • Solid-state curved focal plane arrays
    • 固态弯曲焦平面阵列
    • US07786421B2
    • 2010-08-31
    • US10940591
    • 2004-09-13
    • Shouleh NikzadMichael HoenkTodd Jones
    • Shouleh NikzadMichael HoenkTodd Jones
    • H01L27/00
    • H04N5/3696H01L27/1464H01L27/14683H01L27/14806
    • The present invention relates to curved focal plane arrays. More specifically, the present invention relates to a system and method for making solid-state curved focal plane arrays from standard and high-purity devices that may be matched to a given optical system. There are two ways to make a curved focal plane arrays starting with the fully fabricated device. One way, is to thin the device and conform it to a curvature. A second way, is to back-illuminate a thick device without making a thinned membrane. The thick device is a special class of devices; for example devices fabricated with high purity silicon. One surface of the device (the non VLSI fabricated surface, also referred to as the back surface) can be polished to form a curved surface.
    • 本发明涉及弯曲焦平面阵列。 更具体地,本发明涉及一种用于从可以与给定光学系统匹配的标准和高纯度器件制造固态弯曲焦平面阵列的系统和方法。 从完全制造的器件开始制作一个弯曲的焦平面阵列有两种方法。 一种方法是使设备变薄并使其符合曲率。 第二种方法是在不形成薄膜的情况下背光照亮厚装置。 厚装置是一类特殊装置; 例如用高纯硅制造的器件。 该装置的一个表面(非VLSI制造表面,也称为背面)可被抛光以形成弯曲表面。
    • 2. 发明申请
    • Solid-state curved focal plane arrays
    • 固态弯曲焦平面阵列
    • US20050109918A1
    • 2005-05-26
    • US10940591
    • 2004-09-13
    • Shouleh NikzadMichael HoenkTodd Jones
    • Shouleh NikzadMichael HoenkTodd Jones
    • H01L27/00H01L27/148
    • H04N5/3696H01L27/1464H01L27/14683H01L27/14806
    • The present invention relates to curved focal plane arrays. More specifically, the present invention relates to a system and method for making solid-state curved focal plane arrays from standard and high-purity devices that may be matched to a given optical system. There are two ways to make a curved focal plane arrays starting with the fully fabricated device. One way, is to thin the device and conform it to a curvature. A second way, is to back-illuminate a thick device without making a thinned membrane. The thick device is a special class of devices; for example devices fabricated with high purity silicon. One surface of the device (the non VLSI fabricated surface, also referred to as the back surface) can be polished to form a curved surface.
    • 本发明涉及弯曲焦平面阵列。 更具体地,本发明涉及一种用于从可以与给定光学系统匹配的标准和高纯度器件制造固态弯曲焦平面阵列的系统和方法。 从完全制造的器件开始制作一个弯曲的焦平面阵列有两种方法。 一种方法是使设备变薄并使其符合曲率。 第二种方法是在不形成薄膜的情况下背光照亮厚装置。 厚装置是一类特殊装置; 例如用高纯硅制造的器件。 该装置的一个表面(非VLSI制造表面,也称为背面)可被抛光以形成弯曲表面。