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1. 发明授权

US09252468B1 Microwave signal connector 有权
标题翻译：微波信号连接器
公开(公告)号：US09252468B1
公开(公告)日：2016-02-02
申请号：US13891941
申请日：2013-05-10
申请人： Signal Microwave, LLC
发明人： William Rosas , Eric Gebhard
IPC分类号： H01P1/04 , H01P5/00 , H01P11/00
CPC分类号： H01P1/04 , H01P1/045 , H01P5/00 , H01P5/026 , H01P11/00 , H01R24/44 , H01R24/50 , H01R24/542
摘要： A microwave signal connector can comprise a first portion of an inner conductor comprising a first diameter. A second portion of the inner conductor comprises a second diameter less than the first diameter and is in contact with the first portion of the inner conductor. An outer conductor is disposed around the first portion of the inner conductor and the second portion of the inner conductor with a first inner diameter disposed over the first diameter and a second inner diameter disposed over the second diameter. A dielectric material is disposed between the second portion of the inner conductor and the outer conductor that extends along a length of the second portion of the inner conductor. An adhesive is attached to the dielectric material, the second portion of the inner conductor, and the outer conductor.
摘要翻译：微波信号连接器可以包括包含第一直径的内部导体的第一部分。内导体的第二部分包括小于第一直径的第二直径并与内导体的第一部分接触。外导体设置在内导体的第一部分周围并且内导体的第二部分具有设置在第一直径上的第一内径和设置在第二直径上的第二内径。电介质材料设置在内部导体的第二部分和沿着内部导体的第二部分的长度延伸的外部导体之间。粘合剂附着到电介质材料，内导体的第二部分和外导体。

2. 发明授权

US11543434B1 High-frequency data differential testing probe 有权
公开(公告)号：US11543434B1
公开(公告)日：2023-01-03
申请号：US17107757
申请日：2020-11-30
申请人： Signal Microwave, LLC
发明人： William Rosas , Eric Gebhard , Brian Shumaker
IPC分类号： G01R1/073 , G01R31/28 , G01R1/067
摘要： A high-frequency testing probe having a probe substrate and at least two probe tips. The probe substrate is a printed circuit board and the probe tips are coupled to and extend outward from the printed circuit board. The first and second probe tips are each communicatively coupled to respective first and second probe connectors through respective first and second conducting traces disposed upon the printed circuit board. The probe connectors are configured to couple the testing probe to at least one of a high-frequency vector network analyzer and a high-frequency time domain reflectometer. The probe tips translate along their respective central longitudinal axes through respective adjustable couplings to modify respective distances the probe tips extend outward from the printed circuit board.

3. 发明授权

US11175311B1 High-frequency layered testing probe 有权
公开(公告)号：US11175311B1
公开(公告)日：2021-11-16
申请号：US16775185
申请日：2020-01-28
申请人： Signal Microwave, LLC
发明人： William Rosas , Eric Gebhard , Peter Frank
IPC分类号： G01R1/067 , G01R1/073
摘要： A high-frequency testing probe is disclosed. The probe includes a layered probe substrate having a first and second PCB, as well as first and second conducting traces disposed on opposite sides of the substrate. The probe substrate has an ungrounded differential region including two probe tips coupled to the traces, a grounded differential region, and a decoupled differential region including two probe connectors coupled to the traces. The probe also includes a ground plane between the two PCBs and between the two traces in the decoupled and grounded differential regions. In the ungrounded differential region, the first and second traces form a first differential transmission pair having a differential impedance. In the grounded differential region, the first and second traces form a second differential transmission pair having the differential impedance. The probe connectors are configured to couple to one of a vector network analyzer and a time domain reflectometer.

4. 发明授权

US10852322B1 High-frequency data differential testing probe 有权
公开(公告)号：US10852322B1
公开(公告)日：2020-12-01
申请号：US16214015
申请日：2018-12-07
申请人： Signal Microwave, LLC
发明人： William Rosas , Eric Gebhard , Brian Shumaker
IPC分类号： G01R1/073 , G01R31/28 , G01R1/067
摘要： A high-frequency testing probe having a probe substrate and at least two probe tips. The probe substrate is a printed circuit board and the probe tips are coupled to and extend outward from the printed circuit board. The first and second probe tips are each communicatively coupled to respective first and second probe connectors through respective first and second conducting traces disposed upon the printed circuit board. The probe connectors are configured to couple the testing probe to at least one of a high-frequency vector network analyzer and a high-frequency time domain reflectometer. The probe tips translate along their respective central longitudinal axes through respective adjustable couplings to modify respective distances the probe tips extend outward from the printed circuit board.

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