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1. 发明申请

US20150318651A1 BRUSH-TYPE CONTACT MATERIAL AND MANUFACTUING METHOD FOR THE SAME 有权
标题翻译： BRUSH型接触材料及其制造方法
公开(公告)号：US20150318651A1
公开(公告)日：2015-11-05
申请号：US14652195
申请日：2013-12-13
申请人： TANAKA KIKINZOKU KOGYO K.K.
发明人： Kazuo UEDA , Yukimasa NOMURA
IPC分类号： H01R39/00 , H01R43/16
CPC分类号： H01R39/00 , H01C1/12 , H01C10/28 , H01R43/16
摘要： The present invention relates to a brush type contact material, including one or more curved metal pawls of which ends come into contact with objects to be contacted. The ends of the pawls have an arc-like cross section in a thickness direction, a curvature radius R1 on a front side from a contact point with the object to be contacted and a curvature radius R2 on a back side from the contact point are formed so as to be R1≧R2, and also both ends in a width direction of the pawl are chamfered. At this time, preferably, R1 is larger than R2 (R1>R2), and R1 divided by R2 (R1/R2) is 3.0 or less. The brush type contact material according to the present invention enables a smoother sliding movement than ever before and can be relatively simply manufactured.
摘要翻译：本发明涉及一种刷式接触材料，其包括一个或多个弯曲的金属爪，其端部与待接触的物体接触。棘爪的端部在厚度方向上具有弧形横截面，形成从与接触物接触的接触点的前侧的曲率半径R1和从接触点的背侧的曲率半径R2 为R1≥R2，并且爪的宽度方向的两端都被倒角。此时，R1优选大于R2（R1> R2），R1除以R2（R1 / R2）为3.0以下。根据本发明的刷式接触材料能够比以往更平滑的滑动运动，并且可以相对简单地制造。

2. 发明申请

US20230053435A1 CONDUCTIVE BONDING MATERIAL, BONDING MEMBER INCLUDING THE CONDUCTIVE BONDING MATERIAL, AND BONDING METHOD 有权
公开(公告)号：US20230053435A1
公开(公告)日：2023-02-23
申请号：US17796846
申请日：2020-09-28
申请人： TANAKA KIKINZOKU KOGYO K.K.
发明人： Toshinori OGASHIWA , Kazuo UEDA
IPC分类号： H01L21/52 , H01B1/02 , H01B5/00
摘要： A bonding method in which applied is a prescribed conductive bonding material, which contains a molded article of a metal powder. The metal powder is one or more selected from the group consisting of a gold powder, a silver powder, a platinum powder, and a palladium powder, and has a purity of 99.9% by mass or more, and an average particle size of 0.005 µm to 1.0 µm, and the conductive bonding material has a compressive deformation rate M, represented by the following expression, of 5 % or more and 30% or less when compressed with a compression pressure of 5 MPa. [Expression 1] M = {(h1 - h2)/h1} x 100, wherein h1 represents an average thickness of the conductive bonding material before compression, and h2 represents an average thickness of the conductive bonding material after the compression.

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