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1. 发明授权

US10541078B2 Electronic component 有权
公开(公告)号：US10541078B2
公开(公告)日：2020-01-21
申请号：US15488876
申请日：2017-04-17
申请人： TDK CORPORATION
发明人： Shinichi Sato , Yohei Tadaki , Akihiko Oide , Yuma Ishikawa , Hidekazu Sato , Kazuhiro Ebina , Hiroyuki Tanoue
IPC分类号： H01F5/00 , H01F27/28 , H01F27/29 , H01F27/32 , H01F41/04 , H01F41/12
摘要： An electronic component includes: an element body in which a plurality of insulator layers are stacked; a coil in which a plurality of inner conductors installed in the element body are electrically connected to each other; and an outer electrode that is disposed on an outer surface of the element body, is electrically connected to the coil, and includes at least a baked electrode layer. The inner conductor connected to the outer electrode includes a connection conductor that electrically connects the baked electrode layer to the inner conductor. The connection conductor includes a protruding portion that protrudes from the outer surface of the element body to the outer electrode. The protruding portion includes a metal having a smaller diffusion coefficient than a metal of a main component included in the baked electrode layer. The inner conductors have a lower electric resistance value than the metal included in the protruding portion.

2. 发明授权

US11631521B2 Electronic component 有权
公开(公告)号：US11631521B2
公开(公告)日：2023-04-18
申请号：US16396913
申请日：2019-04-29
申请人： TDK CORPORATION
发明人： Yoji Tozawa , Takuo Abe , Yuma Ishikawa , Hidekazu Sato , Takashi Endo , Masashi Shimoyasu , Kazuma Takahashi
IPC分类号： H01F27/28 , H03H1/00 , H03H7/09 , H01F41/04 , H01F27/29
摘要： An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes an underlying metal layer, a conductive resin layer, and a plating layer. The underlying metal layer is disposed on the element body. The conductive resin layer contains a plurality of conductive fillers and is disposed on the underlying metal layer. The plating layer is disposed on the conductive resin layer. A part of the plurality of conductive fillers is sintered with the underlying metal layer and is coupled to the underlying metal layer. Another part of the plurality of conductive fillers is exposed to a surface of the conductive resin layer and is in contact with the plating layer.

3. 发明授权

US10115515B2 Multilayer common mode filter 有权
公开(公告)号：US10115515B2
公开(公告)日：2018-10-30
申请号：US15263824
申请日：2016-09-13
申请人： TDK CORPORATION
发明人： Yuma Ishikawa , Takuo Hattori , Makoto Yoshino
IPC分类号： H01F5/00 , H01F27/28 , H01F27/245 , H01F27/29 , H01F17/00
摘要： A second coil opposes a first coil in a first direction. The first and second coils are positioned between a first conductor and a second conductor in the first direction. The first conductor is adjacent to the first coil in the first direction and overlaps a part of the first coil when viewed from the first direction. The second conductor is adjacent to the second coil in the first direction and overlaps a part of the second coil when viewed from the first direction. The first and second conductors are of a shape extending in a line. Inner regions of the first and second coils include regions not overlapping the first and second conductors when viewed from the first direction.

4. 发明授权

US11482371B2 Electronic component 有权
公开(公告)号：US11482371B2
公开(公告)日：2022-10-25
申请号：US16715245
申请日：2019-12-16
申请人： TDK CORPORATION
发明人： Shinichi Sato , Yohei Tadaki , Akihiko Oide , Yuma Ishikawa , Hidekazu Sato , Kazuhiro Ebina , Hiroyuki Tanoue
IPC分类号： H01F5/00 , H01F27/28 , H01F17/00 , H01F27/29 , H01F27/32 , H01F41/04 , H01F41/12
摘要： An electronic component includes: an element body in which a plurality of insulator layers are stacked; a coil in which a plurality of inner conductors installed in the element body are electrically connected to each other; and an outer electrode that is disposed on an outer surface of the element body, is electrically connected to the coil, and includes at least a baked electrode layer. The inner conductor connected to the outer electrode includes a connection conductor that electrically connects the baked electrode layer to the inner conductor. The connection conductor includes a protruding portion that protrudes from the outer surface of the element body to the outer electrode. The protruding portion includes a metal having a smaller diffusion coefficient than a metal of a main component included in the baked electrode layer. The inner conductors have a lower electric resistance value than the metal included in the protruding portion.

5. 发明授权

US09293913B2 ESD protection component and method for manufacturing ESD protection component 有权
标题翻译： ESD保护元件及ESD保护元件制造方法
公开(公告)号：US09293913B2
公开(公告)日：2016-03-22
申请号：US14339979
申请日：2014-07-24
申请人： TDK CORPORATION
发明人： Hidenobu Umeda , Yuma Ishikawa , Makoto Yoshino , Keigo Higashida
IPC分类号： H02H9/00 , H02H9/04 , H01G4/38 , H01G4/40 , H01C13/02
CPC分类号： H02H9/044 , H01C13/02 , H01G4/38 , H01G4/40
摘要： An ESD suppressor is configured including first and second discharge electrodes arranged as separated from each other, and a discharge inducing portion kept in contact with the first and second discharge electrodes so as to connect mutually opposed portions of the first and second discharge electrodes to each other. The discharge inducing portion contains metal particles. The first and second discharge electrodes are located on the coil side with respect to the discharge inducing portion when viewed in a stack direction of a plurality of insulator layers. An element body has a cavity portion located so as to cover the whole of the discharge inducing portion when viewed in the stack direction from the coil side. The cavity portion is in contact with the mutually opposed portions of the first and second discharge electrodes and with the discharge inducing portion.
摘要翻译： ESD抑制器被配置为包括彼此分离布置的第一和第二放电电极以及与第一和第二放电电极保持接触以便将第一和第二放电电极的相互相对的部分彼此连接的放电诱导部分。放电诱导部分含有金属颗粒。当在多个绝缘体层的堆叠方向上观察时，第一和第二放电电极相对于放电诱导部位于线圈侧。元件本体具有空腔部分，当从线圈侧沿堆叠方向观察时，覆盖整个放电诱导部分的位置。空腔部分与第一和第二放电电极的相互相对的部分和放电诱导部分接触。

6. 发明授权

US11011294B2 Multilayer coil component 有权
公开(公告)号：US11011294B2
公开(公告)日：2021-05-18
申请号：US15497314
申请日：2017-04-26
申请人： TDK CORPORATION
发明人： Shinichi Sato , Yohei Tadaki , Akihiko Oide , Yuma Ishikawa , Hidekazu Sato
IPC分类号： H01F5/00 , H01F27/245 , H01F27/02 , H01F17/00 , H01F27/29 , H01F17/04 , H01F27/255 , H01F27/28 , H01F27/32 , H01F41/12 , H01F41/04
摘要： A multilayer coil component includes an element body made of a ferrite sintered body and a coil. The coil is configured with a plurality of internal conductors juxtaposed in the element body and electrically connected to one another. An average crystal grain size in a surface region of the element body is smaller than an average crystal grain size in a region between the internal conductors in the element body. A surface of the element body is covered with a layer made of an insulating material. The insulating material is not present among the crystal grains in the surface region of the element body.

7. 发明授权

US09667036B2 ESD protection component 有权
公开(公告)号：US09667036B2
公开(公告)日：2017-05-30
申请号：US14572100
申请日：2014-12-16
申请人： TDK CORPORATION
发明人： Yuma Ishikawa , Makoto Yoshino
IPC分类号： H02H9/00 , H01T4/12
CPC分类号： H01T4/12
摘要： An ESD protection component includes opposite electrodes and a ground electrode. The opposite electrodes and the ground electrode each have an extraction portion and an opposite portion. The respective opposite portions of the opposite electrodes and the ground electrode are placed on the same layer. At least one of the opposite electrodes and the ground electrode, the extraction portion and the opposite portion are placed on respective different layers and, also, are electrically connected to each other via a through hole conductor.

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