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1. 发明授权

US08958213B2 Mounting structure of chip component 有权
标题翻译：芯片组件的安装结构
公开(公告)号：US08958213B2
公开(公告)日：2015-02-17
申请号：US13922409
申请日：2013-06-20
申请人： Taiyo Yuden Co., Ltd.
发明人： Yuji Hoshi , Masataka Watabe , Motoki Kobayashi , Shota Yajima
IPC分类号： H05K7/10 , H05K1/18 , H05K3/34
CPC分类号： H05K1/181 , H05K3/3442 , H05K2201/09381 , H05K2201/10636 , Y02P70/611 , Y02P70/613
摘要： A mounting structure of a chip component includes a chip component that is bonded by having a pair of external terminal electrodes provided on both ends of an element body of the thin chip component bonded to a pair of lands respectively through solder, the pair of lands being provided on an attaching substrate in a lateral direction with respect to each other. Where plan view distances from ends of the external terminal electrodes at the ridge lines formed between the surfaces and side faces of the element body of the chip component to the edges of the lands connected to the external terminal electrodes are designated as “d,” and the vertical distances from the bottom surfaces of the external terminal electrodes and the lands are designated as “t,” then d>t/tan 35° and preferably d>t/tan 25° is fulfilled.
摘要翻译：芯片部件的安装结构包括芯片部件，该芯片部件通过分别通过焊料将一对外部端子电极设置在分别结合到一对焊盘的薄片部件的元件主体的两端上，所述一对外部端子电极是在相对于彼此的横向方向上设置在附接基板上。在形成在芯片部件的元件主体的表面和侧面之间的棱线上的外部端子电极的端部到与外部端子电极连接的焊盘边缘的平面图距离被指定为“d”，并且将外部端子电极和焊盘的底面的垂直距离设为“t”，则d> t / tan 35°，最好d> t / tan 25°。

2. 发明授权

US10354801B2 Multi-layer ceramic electronic component 有权
公开(公告)号：US10354801B2
公开(公告)日：2019-07-16
申请号：US15881360
申请日：2018-01-26
申请人： Taiyo Yuden Co., Ltd.
发明人： Masataka Watabe , Yasutomo Suga
IPC分类号： H01G4/12 , H01G4/248 , H01G4/232 , H01G4/30 , H01G4/012
摘要： A multi-layer ceramic electronic component includes: a ceramic body including first and second main surfaces oriented in a first axial direction, first and second end surfaces oriented in a second axial direction orthogonal to the first axial direction, a first internal electrode, and a second internal electrode, the ceramic body being formed to be long in a third axial direction orthogonal to the first and second axial directions; a first external electrode including a first cover portion and a first extension portion; and a second external electrode including a second cover portion and a second extension portion, the multi-layer ceramic electronic component satisfying that, when T1 represents a dimension of the ceramic body in the first axial direction, and when T2 represents a dimension of each of the first and second extension portions in the first axial direction, T1 is 80 μm or less and T2/(T1+T2) is 0.32 or less.

3. 发明申请

US20180218839A1 Multi-Layer Ceramic Electronic Component 审中-公开
公开(公告)号：US20180218839A1
公开(公告)日：2018-08-02
申请号：US15881360
申请日：2018-01-26
申请人： Taiyo Yuden Co., Ltd.
发明人： Masataka Watabe , Yasutomo Suga
IPC分类号： H01G4/248 , H01G4/012 , H01G4/232 , H01G4/30
CPC分类号： H01G4/248 , H01G4/012 , H01G4/12 , H01G4/1218 , H01G4/1227 , H01G4/1236 , H01G4/1245 , H01G4/232 , H01G4/30
摘要： A multi-layer ceramic electronic component includes: a ceramic body including first and second main surfaces oriented in a first axial direction, first and second end surfaces oriented in a second axial direction orthogonal to the first axial direction, a first internal electrode, and a second internal electrode, the ceramic body being formed to be long in a third axial direction orthogonal to the first and second axial directions; a first external electrode including a first cover portion and a first extension portion; and a second external electrode including a second cover portion and a second extension portion, the multi-layer ceramic electronic component satisfying that, when T1 represents a dimension of the ceramic body in the first axial direction, and when T2 represents a dimension of each of the first and second extension portions in the first axial direction, T1 is 80 μm or less and T2/(T1+T2) is 0.32 or less.

4. 发明授权

US11024461B2 Multi-layer ceramic electronic component having external electrode with base film and electrically conductive thin film 有权
公开(公告)号：US11024461B2
公开(公告)日：2021-06-01
申请号：US16562731
申请日：2019-09-06
申请人： Taiyo Yuden Co., Ltd.
发明人： Yasutomo Suga , Masataka Watabe , Jun Nishikawa , Sadayoshi Kato
IPC分类号： H01G4/232 , H01G4/30 , H01G4/12
摘要： A multi-layer ceramic electronic component includes: a ceramic body including a main surface facing in a first direction, an end surface facing in a second direction orthogonal to the first direction, a side surface facing in a third direction orthogonal to the first and second directions, and internal electrodes laminated in the first direction; and an external electrode formed on a surface of the ceramic body, the external electrode including a base film including an end-surface-covering portion that covers the end surface, and a main-surface-covering portion that covers part of the main surface continuously from the end-surface-covering portion, an electrically conductive thin film including a base-covering portion that covers the main-surface-covering portion, and a ceramic-body-covering portion that extends from the base-covering portion in the second direction and covers part of the main surface, and a plating film that covers the electrically conductive thin film and the base film.

5. 发明授权

US10395830B2 Multi-layer ceramic electronic component 有权
公开(公告)号：US10395830B2
公开(公告)日：2019-08-27
申请号：US15881433
申请日：2018-01-26
申请人： Taiyo Yuden Co., Ltd.
发明人： Masataka Watabe , Yasutomo Suga
IPC分类号： H01G4/012 , H01G4/248 , H01G4/232 , H01G4/30 , H01G4/12
摘要： A multi-layer ceramic electronic component includes: a ceramic body including first and second main surfaces oriented in a first axial direction, first and second end surfaces oriented in a second axial direction orthogonal to the first axial direction, a first internal electrode drawn to the first end surface, and a second internal electrode facing the first internal electrode and being drawn to the second end surface, the ceramic body being formed to be long in a third axial direction orthogonal to the first and second axial directions, a dimension of the ceramic body in the first axial direction being 80 μm or less; a first external electrode covering the first end surface and extending from the first end surface to the first and second main surfaces; and a second external electrode covering the second end surface and extending from the second end surface to the first and second main surfaces.

6. 发明授权

US10319658B2 Electronic component package and method of housing an electronic component 有权
公开(公告)号：US10319658B2
公开(公告)日：2019-06-11
申请号：US15885129
申请日：2018-01-31
申请人： Taiyo Yuden Co., Ltd.
发明人： Yasutomo Suga , Masataka Watabe
IPC分类号： H01L23/31 , H05K3/30 , H01G4/232 , H01L21/56 , H01G4/12
摘要： An electronic component package includes: an electronic component that includes a body, the body having a first main surface that is convexly curved along a longitudinal direction, and a second main surface that is concavely curved along the longitudinal direction, a distance between the first main surface and the second main surface being 50 μm or less; a housing portion that includes a plurality of recesses, each of the recesses including a take-out opening and housing the electronic component with the first main surface facing toward the take-out opening; and a sealing portion that covers the take-out openings of the plurality of recesses.

7. 发明授权

US09502181B2 Low-height multilayer ceramic capacitor 有权
标题翻译：低高度多层陶瓷电容器
公开(公告)号：US09502181B2
公开(公告)日：2016-11-22
申请号：US14206237
申请日：2014-03-12
申请人： TAIYO YUDEN CO., LTD.
发明人： Yasutomo Suga , Masataka Watabe
IPC分类号： H01G4/30 , H01G4/228 , H01G4/232
CPC分类号： H01G4/30 , H01G4/232
摘要： A low-height multilayer ceramic capacitor offering excellent flexure strength meets the condition “t11c
摘要翻译：提供优异的挠曲强度的低高度多层陶瓷电容器满足条件“t11c

8. 发明授权

US08810993B2 Laminated capacitor 有权
标题翻译：层叠电容器
公开(公告)号：US08810993B2
公开(公告)日：2014-08-19
申请号：US14021841
申请日：2013-09-09
申请人： Taiyo Yuden Co., Ltd.
发明人： Yuji Hoshi , Masataka Watabe , Motoki Kobayashi
IPC分类号： H01G4/30 , H01G4/005 , H01G4/06
CPC分类号： H01G4/30 , H01G4/005
摘要： In a laminated capacitor, one additional first internal electrode layer, which has its edge connected to the first external electrode as do the first internal electrode layers, is provided to one of the five first internal electrode layers so as to face one another via the second dielectric layer having a thickness smaller than the thickness of the first dielectric layer and not contributing to the formation of capacity, and one additional second internal electrode layer, which has its edge connected to the second external electrode as do the second internal electrode layers, is provided to one of the five second internal electrode layers so as to face one another via the third dielectric layer having a thickness smaller than the thickness of the first dielectric layer and not contributing to the formation of capacity.
摘要翻译：在叠层电容器中，与第一内部电极层一样，其边缘与第一外部电极连接的第一内部电极层设置在五个第一内部电极层中的一个上，以便经由第二内部电极层电介质层的厚度小于第一电介质层的厚度，并且不有助于形成电容;以及附加的第二内部电极层，其第二内部电极层的边缘与第二内部电极层一样连接到第二外部电极，是提供给五个第二内部电极层中的一个，以便经由第三电介质层彼此面对，其厚度小于第一介电层的厚度，并且不会有助于形成容量。

9. 发明申请

US20140003014A1 MOUNTING STRUCTURE OF ELECTRIC CHIP DEVICE 有权
标题翻译：电芯片装置的安装结构
公开(公告)号：US20140003014A1
公开(公告)日：2014-01-02
申请号：US13922409
申请日：2013-06-20
申请人： Taiyo Yuden Co., Ltd.
发明人： Yuji Hoshi , Masataka Watabe , Motoki Kobayashi , Shota Yajima
IPC分类号： H05K1/18
CPC分类号： H05K1/181 , H05K3/3442 , H05K2201/09381 , H05K2201/10636 , Y02P70/611 , Y02P70/613
摘要： A mounting structure of a chip component includes a chip component that is bonded by having a pair of external terminal electrodes provided on both ends of an element body of the thin chip component bonded to a pair of lands respectively through solder, the pair of lands being provided on an attaching substrate in a lateral direction with respect to each other. Where plan view distances from ends of the external terminal electrodes at the ridge lines formed between the surfaces and side faces of the element body of the chip component to the edges of the lands connected to the external terminal electrodes are designated as “d,” and the vertical distances from the bottom surfaces of the external terminal electrodes and the lands are designated as “t,” then d≧t/tan 35° and preferably d≧t/tan 25° is fulfilled.
摘要翻译：芯片部件的安装结构包括芯片部件，该芯片部件通过分别通过焊料将一对外部端子电极设置在分别结合到一对焊盘的薄片部件的元件主体的两端上，所述一对外部端子电极为在相对于彼此的横向方向上设置在附接基板上。在形成在芯片部件的元件主体的表面和侧面之间的棱线上的外部端子电极的端部到与外部端子电极连接的焊盘边缘的平面图距离被指定为“d”，并且将外部端子电极和焊盘的底面的垂直距离设为“t”，则d> = t / tan 35°，最好d> = t / tan 25°。

10. 发明授权

US11557439B2 Multi-layer ceramic electronic component 有权
公开(公告)号：US11557439B2
公开(公告)日：2023-01-17
申请号：US17237452
申请日：2021-04-22
申请人： Taiyo Yuden Co., Ltd.
发明人： Yasutomo Suga , Masataka Watabe , Takeshi Nakajima , Yuji Tomizawa , Toshiya Kuji
IPC分类号： H01G4/30 , H01G4/012 , H01G4/12 , H01G4/228 , H01G4/008
摘要： A multi-layer ceramic electronic component includes: a ceramic body including first and second main surfaces facing in a first axis direction, first and second end surfaces facing in a second axis direction, and first and second internal electrodes; a first external electrode including a first cover portion covering the first end surface, and a first extended portion extending from the first cover portion to the second main surface; and a second external electrode including a second cover portion covering the second end surface, and a second extended portion extending from the second cover portion to the second main surface, the multi-layer ceramic electronic component satisfying that, when T1 represents a dimension of the ceramic body in the first axis direction and T2 represents a dimension of each extended portion in the first axis direction, T1+T2 is 50 μm or less, and T2/(T1+T2) is 0.32 or less.

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