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    • 3. 发明申请
    • Compression bonding method
    • 压接法
    • US20060011705A1
    • 2006-01-19
    • US10532965
    • 2003-05-22
    • Ja-Nam KuPotapov Sergey
    • Ja-Nam KuPotapov Sergey
    • B23K20/10
    • B23K20/023
    • A compression bonding method includes patterning a metal bonding film in predetermined shapes on a substrate; and disposing a bonded element above the metal bonding film and applying heat to the substrate and pressure to the bonded element, thereby bonding the bonded element to the substrate having the metal bonding film. Since the compression bonding method allows bonded elements having various shapes and sizes to be bonded to a substrate at a low temperature and pressure, manufacturing is simplified, and the compression bonding method can be applied to various sealing and packaging processes.
    • 压接方法包括在基板上图案化预定形状的金属接合膜; 并且在金属接合膜上设置接合元件,向基板施加热量并对接合元件施加压力,从而将接合元件粘合到具有金属接合膜的基板上。 由于压接方法允许具有各种形状和尺寸的接合元件在低温和低压下粘合到基底上,所以制造简化,并且压接方法可以应用于各种密封和包装过程。