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1. 发明授权

US08031071B2 IC tag label 有权
标题翻译： IC标签标签
公开(公告)号：US08031071B2
公开(公告)日：2011-10-04
申请号：US12444639
申请日：2007-10-12
申请人： Tetsuji Ogata , Hideto Sakata
发明人： Tetsuji Ogata , Hideto Sakata
IPC分类号： G08B13/14
CPC分类号： G06K19/07749 , G06K19/07722
摘要： An IC tag label 1A includes an inlet substrate 11; an antenna pattern 2 and an IC chip 3 which are provided on one surface of the inlet substrate 11; and an adhesive layer 6 which is mounted on the other surface of the inlet substrate 11. A release paper 7 is attached to the adhesive layer 6. An opening 12 which serves as a clearance for the IC chip 3 is provided in a portion of the release paper 7 and adhesive layer 6, the portion corresponding to the IC chip 3.
摘要翻译： IC标签标签1A包括入口基板11; 设置在入口基板11的一个表面上的天线图案2和IC芯片3; 以及安装在入口基板11的另一个表面上的粘合剂层6.将粘合层6安装在剥离纸7上。作为IC芯片3的间隙的开口12设置在剥离纸7和粘合剂层6，对应于IC芯片3的部分。

2. 发明授权

US08169323B2 Noncontact IC tag label, airline baggage tag label, and manufacturing method for noncontact IC tag label 有权
标题翻译：非接触IC标签标签，航空行李标签标签和非接触式IC标签标签的制造方法
公开(公告)号：US08169323B2
公开(公告)日：2012-05-01
申请号：US12513398
申请日：2007-10-30
申请人： Tetsuji Ogata , Hideto Sakata
发明人： Tetsuji Ogata , Hideto Sakata
IPC分类号： G08B13/14
CPC分类号： G06K19/07745 , G06K19/07718 , G06K19/07749 , G06K19/0775 , G06K19/07779 , G06K19/07783 , G09F3/10 , G09F3/16 , H01L2924/0002 , Y10T156/1082 , H01L2924/00
摘要： A noncontact IC tag label includes: a band-shaped label base material inclusive of a release surface formed at least at one end of the base material and releasably treated in advance, and a non-release surface; an electroconductive layer formed on the non-release surface of the band-shaped label base material and including a required antenna pattern; and an IC chip mounted on one face of the electroconductive layer. The electroconductive layer and the IC chip are shrouded by a surface protection sheet via a pressure-sensitive adhesive layer. A thermoadhesive resin layer bonded onto the non-release surface of the band-shaped label base material is provided on an opposite face of the electroconductive layer including the antenna pattern, with respect to the surface protection sheet. Also, the pressure-sensitive adhesive layer is bonded onto the non-release surface and release surface of the band-shaped label base material.
摘要翻译：非接触IC标签标签包括：带状标签基材，包括至少在基材的一端形成并可预先处理的剥离表面和非剥离表面; 形成在带状标签基材的非释放表面上并包括所需天线图案的导电层; 以及安装在导电层一面上的IC芯片。导电层和IC芯片通过压敏粘合剂层被表面保护片覆盖。粘结在带状标签基材的非剥离表面上的热粘合树脂层相对于表面保护片设置在包括天线图案的导电层的相对面上。此外，压敏粘合剂层粘合到带状标签基材的非剥离表面和剥离表面上。

3. 发明申请

US20100051701A1 NONCONTACT IC TAG LABEL AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：非标签IC标签标签及其制造方法
公开(公告)号：US20100051701A1
公开(公告)日：2010-03-04
申请号：US12447986
申请日：2007-10-16
申请人： Tetsuji Ogata , Hideto Sakata
发明人： Tetsuji Ogata , Hideto Sakata
IPC分类号： G06K19/07 , H01L21/607
CPC分类号： H01Q1/2225 , G06K19/07722 , G06K19/07749 , G06K19/0775 , H01L2924/0002 , H01L2924/00
摘要： This invention provides a thin type of noncontact IC tag label that allows materials costs to be reduced without using an antenna-supporting base film. The noncontact IC tag label includes an electroconductive layer 6 of a required antenna pattern shape, an IC chip 3 mounted on one face of the electroconductive layer 6, and a surface protection sheet 4 supporting the electroconductive layer 6 and the IC chip 3 from a side of the one face of the electroconductive layer 6 via a first pressure-sensitive adhesive layer 5. An adhesive resin layer 7 having the same shape as the antenna pattern shape of the electroconductive layer 6 is provided on the other face of the electroconductive layer 6. The adhesive resin layer 7 is temporarily bonded in separable manner onto a release paper 9 formed from paper or a plastic base material.
摘要翻译：本发明提供了一种薄型的非接触IC标签标签，其可以在不使用天线支撑基膜的情况下降低材料成本。非接触IC标签标签包括所需天线图案形状的导电层6，安装在导电层6的一面上的IC芯片3和从侧面支撑导电层6和IC芯片3的表面保护片4 经由第一粘合剂层5的导电层6的一个面。在导电层6的另一个面上设置具有与导电层6的天线图案形状相同形状的粘合树脂层7。粘合树脂层7可以分离地临时接合到由纸或塑料基材形成的剥离纸9上。

4. 发明申请

US20090303012A1 IC TAG LABEL 有权
标题翻译： IC标签标签
公开(公告)号：US20090303012A1
公开(公告)日：2009-12-10
申请号：US12444639
申请日：2007-10-12
申请人： Tetsuji Ogata , Hideto Sakata
发明人： Tetsuji Ogata , Hideto Sakata
IPC分类号： H04Q5/22
CPC分类号： G06K19/07749 , G06K19/07722
摘要： An IC tag label 1A includes an inlet substrate 11; an antenna pattern 2 and an IC chip 3 which are provided on one surface of the inlet substrate 11; and an adhesive layer 6 which is mounted on the other surface of the inlet substrate 11. A release paper 7 is attached to the adhesive layer 6. An opening 12 which serves as a clearance for the IC chip 3 is provided in a portion of the release paper 7 and adhesive layer 6, the portion corresponding to the IC chip 3.
摘要翻译： IC标签标签1A包括入口基板11; 设置在入口基板11的一个表面上的天线图案2和IC芯片3; 以及安装在入口基板11的另一个表面上的粘合剂层6.将粘合层6安装在剥离纸7上。作为IC芯片3的间隙的开口12设置在剥离纸7和粘合剂层6，对应于IC芯片3的部分。

5. 发明授权

US08162231B2 Noncontact IC tag label and method of manufacturing the same 有权
标题翻译：非接触IC标签标签及其制造方法
公开(公告)号：US08162231B2
公开(公告)日：2012-04-24
申请号：US12447986
申请日：2007-10-16
申请人： Tetsuji Ogata , Hideto Sakata
发明人： Tetsuji Ogata , Hideto Sakata
IPC分类号： G06K19/06
CPC分类号： H01Q1/2225 , G06K19/07722 , G06K19/07749 , G06K19/0775 , H01L2924/0002 , H01L2924/00
摘要： This invention provides a thin type of noncontact IC tag label that allows materials costs to be reduced without using an antenna-supporting base film. The noncontact IC tag label includes an electroconductive layer of a required antenna pattern shape, an IC chip mounted on one face of the electroconductive layer, and a surface protection sheet supporting the electroconductive layer and the IC chip from a side of the one face of the electroconductive layer via a first pressure-sensitive adhesive layer. An adhesive resin layer having the same shape as the antenna pattern shape of the electroconductive layer is provided on the other face of the electroconductive layer. The adhesive resin layer is temporarily bonded in separable manner onto a release paper formed from paper or a plastic base material.
摘要翻译：本发明提供了一种薄型的非接触IC标签标签，其可以在不使用天线支撑基膜的情况下降低材料成本。非接触IC标签标签包括所需天线图案形状的导电层，安装在导电层的一个面上的IC芯片以及从导电层的一个面的一侧支撑导电层和IC芯片的表面保护片导电层经由第一压敏粘合剂层。在导电层的另一面上设置具有与导电层的天线图案形状相同形状的粘合树脂层。粘合树脂层可以分离地临时接合到由纸或塑料基材形成的剥离纸上。

6. 发明申请

US20100066538A1 NONCONTACT IC TAG LABEL, AIRLINE BAGGAGE TAG LABEL, AND MANUFACTURING METHOD FOR NONCONTACT IC TAG LABEL 有权
标题翻译：非标IC IC标签标签，航空标签标签标签和非标签IC标签标签的制造方法
公开(公告)号：US20100066538A1
公开(公告)日：2010-03-18
申请号：US12513398
申请日：2007-10-30
申请人： Tetsuji Ogata , Hideto Sakata
发明人： Tetsuji Ogata , Hideto Sakata
IPC分类号： G08B13/14 , B32B38/10 , B32B38/04
CPC分类号： G06K19/07745 , G06K19/07718 , G06K19/07749 , G06K19/0775 , G06K19/07779 , G06K19/07783 , G09F3/10 , G09F3/16 , H01L2924/0002 , Y10T156/1082 , H01L2924/00
摘要： A noncontact IC tag label includes: a band-shaped label base material inclusive of a release surface formed at least at one end of the base material and releasably treated in advance, and a non-release surface; an electroconductive layer formed on the non-release surface of the band-shaped label base material and including a required antenna pattern; and an IC chip mounted on one face of the electroconductive layer. The electroconductive layer and the IC chip are shrouded by a surface protection sheet via a pressure-sensitive adhesive layer. A thermoadhesive resin layer bonded onto the non-release surface of the band-shaped label base material is provided on an opposite face of the electroconductive layer including the antenna pattern, with respect to the surface protection sheet. Also, the pressure-sensitive adhesive layer is bonded onto the non-release surface and release surface of the band-shaped label base material.
摘要翻译：非接触IC标签标签包括：带状标签基材，包括至少在基材的一端形成并可预先处理的剥离表面和非剥离表面; 形成在带状标签基材的非释放表面上并包括所需天线图案的导电层; 以及安装在导电层一面上的IC芯片。导电层和IC芯片通过压敏粘合剂层被表面保护片覆盖。粘结在带状标签基材的非剥离表面上的热粘合树脂层相对于表面保护片设置在包括天线图案的导电层的相对面上。此外，压敏粘合剂层粘合到带状标签基材的非剥离表面和剥离表面上。

7. 发明申请

US20070214637A1 Conductive Member for Non-Contact Type Data Carrier and Method and Device for Manufacturing the Same 有权
标题翻译：非接触式数据载体的导电构件及其制造方法和装置
公开(公告)号：US20070214637A1
公开(公告)日：2007-09-20
申请号：US11578311
申请日：2005-04-20
申请人： Yuki Nakanishi , Hideto Sakata , Akihiko Igarashi
发明人： Yuki Nakanishi , Hideto Sakata , Akihiko Igarashi
IPC分类号： H05K3/20 , G06K19/00
CPC分类号： H05K3/046 , H05K3/041 , H05K2201/0355 , H05K2203/0522 , H05K2203/1545 , Y10T29/49126 , Y10T29/49128 , Y10T29/49156 , Y10T29/49163 , Y10T156/1054
摘要： A conductive member for a non-contact type data carrier such as a wireless tag is simply and cheaply manufactured. A method for manufacturing a conductive member for a non-contact type data carrier comprises: a printing process during which, while a base material (4) is run, a bonding agent layer (5) is printed in a predetermined pattern on the surface thereof, and is dried; a bonding process during which a conductive layer (6) is laminated on the surface of the bonding agent layer (5) for heating and bonding; a punching process during which the conductive layer (6) is punched in the above-described pattern on the base material (4); and a separating process during which an unnecessary portion (6b) of the conductive layer (6) is separated from the base material (4). Accordingly, a conventional multilayered laminated sheet is not required to realize reduction in the material.
摘要翻译：用于非接触型数据载体（例如无线标签）的导电构件简单便宜地制造。一种用于非接触型数据载体的导电部件的制造方法，包括：在基材（4）运行的同时，在其表面上以规定的图案印刷接合剂层（5）的印刷工序，干燥; 在所述接合剂层（5）的表面上层叠导电层（6）进行加热和接合的接合工艺; 在基材（4）上以上述图案冲压导电层（6）的冲压工艺; 以及导电层（6）的不需要部分（6b）与基材（4）分离的分离过程。因此，不需要传统的多层层叠片来实现材料的减少。

8. 发明申请

US20070284759A1 Method For Producing Sheet With Ic Tags, Apparatus For Producing Sheet With Ic Tags, Sheet With Ic Tags, Method For Fixing Ic Chips, Apparatus For Fixing Ic Chips, And Ic Tag 有权
标题翻译：使用Ic标签生产薄片的方法，用Ic标签生产薄片的装置，具有Ic标签的薄片，用于固定Ic芯片的方法，用于固定Ic芯片和Ic标签的装置
公开(公告)号：US20070284759A1
公开(公告)日：2007-12-13
申请号：US11587240
申请日：2005-04-21
申请人： Hiroshi Suguro , Hideto Sakata , Terunao Tsuchiya , Takaichi Shimomura
发明人： Hiroshi Suguro , Hideto Sakata , Terunao Tsuchiya , Takaichi Shimomura
IPC分类号： H01L21/58 , B30B9/30 , H01L23/12
CPC分类号： H01L23/49855 , G06K19/07718 , G06K19/07749 , G06K19/07752 , G06K19/07754 , H01L21/67144 , H01L23/4985 , H01L24/81 , H01L2224/16238 , H01L2224/75 , H01L2224/75252 , H01L2224/7565 , H01L2224/759 , H01L2224/7598 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , H01L2924/07811 , H01L2924/14 , H01L2924/15151 , H01L2924/19041 , H01L2924/3011 , H01L2924/00
摘要： A method of producing a sheet 1 with IC tags comprises the steps of: preparing and feeding a sheet 21a with electrical conductors formed thereon; providing an adhesive 18 on the sheet 21a with electrical conductors; preparing multiple IC chips 20 and successively feeding the IC chips 20; successively arranging each IC chip 20 on the electrical conductors 22 of the sheet 21a; and fixing each IC chip 20 onto the electrical conductors 22 through the adhesive 18. The sheet 21a with electrical conductors formed thereon includes a non-conductive sheet 21 and a pair of electrical conductors 22. The pair of electrical conductors 22 of the sheet 21a with the electrical conductors are provided on the non-conductive sheet 21, extend in the feed direction, and are spaced apart from each other.
摘要翻译：制造具有IC标签的片材1的方法包括以下步骤：制备和供给片21a，其上形成有电导体; 在片材21a上提供具有电导体的粘合剂18; 制备多个IC芯片20并连续馈送IC芯片20; 将每个IC芯片20连续地布置在片材21a的电导体22上; 并且通过粘合剂18将每个IC芯片20固定到电导体22上。形成有电导体的片材21a包括非导电片21和一对电导体22。片21a的一对电导体22与电导体一起设置在非导电片21上，沿馈送方向延伸并且彼此间隔开。

9. 发明授权

US06366358B1 Method and apparatus for detecting stripe defects of printed matter 失效
标题翻译：用于检测印刷品条纹缺陷的方法和装置
公开(公告)号：US06366358B1
公开(公告)日：2002-04-02
申请号：US09077553
申请日：1998-06-01
申请人： Hiroshi Satou , Hideto Sakata , Masahiko Soeda , Kenta Hayashi
发明人： Hiroshi Satou , Hideto Sakata , Masahiko Soeda , Kenta Hayashi
IPC分类号： G06K1500
CPC分类号： G06T7/0004 , B41F33/0036 , G06T2207/30144
摘要： A printed matter inspection method and device which detects a defect on the printed matter including a partially inputting camera capable of being moved in a width direction of the printed matter by a mover which inputs a partial image of a pattern on the printed matter and a whole image inputting camera disposed apart from the partially inputting camera by a predetermined distance in the direction the printed matter flows which inputs a whole image including the whole pattern and coordinating, based on a relationship between a position on the whole image, of the partial image and a width-directionwise reference point set on the whole image, the width-directionwise position on the whole image and the width-directionwise position on the mover with each other, when the partially inputting camera is located on an origin set on the mover, positioning and then setting a photographing point, which is to be input by said partially inputting camera, on said whole image, calculating a width-directionwise pixel number between said set photographing point and said width-directionwise reference point on said whole image, multiplying said calculated width-directionwise pixel number by a width-directionwise resolution of said whole image to calculate the width-directionwise moving amount on said moving mechanism; moving said partially inputting camera up to a target position corresponding to said width-directionwise moving amount; and inputting said partial image at an arbitrary timing by said partially inputting camera moved up to said target position.
摘要翻译：一种印刷物检查方法和装置，其检测印刷品上的缺陷，包括部分输入的相机，能够通过在印刷品上输入图案的部分图像的整体的移动器在印刷品的宽度方向上移动图像输入摄像机，沿着打印物流动的方向与部分输入的照相机分开预定的距离，输入包括整个图案的整个图像，并且基于整个图像上的位置与部分图像之间的关系进行协调，设置在整个图像上的宽度方向参考点，整个图像上的宽度方向位置和移动体上的宽度方向位置，当部分输入的照相机位于移动器上的原点时，定位然后将由所述部分输入的相机输入的拍摄点设置在所述整个图像上，计算宽度在所述整个图像上的所述设置拍摄点和所述宽度方向参考点之间的方向像素数，将所述计算的宽度方向像素数乘以所述整个图像的宽度方向分辨率，以计算所述移动机构上的宽度方向移动量 ; 将所述部分输入摄像机移动到对应于所述宽度方向移动量的目标位置; 以及通过所述部分输入的相机移动到所述目标位置，在任意定时输入所述部分图像。

10. 发明授权

US08456307B2 Method for producing sheet with IC tags, apparatus for producing sheet with IC tags, sheet with IC tags, method for fixing IC chips, apparatus for fixing IC chips, and IC tag 有权
标题翻译：具有IC标签的片材的制造方法，具有IC标签的片材的制造装置，具有IC标签的片材，IC芯片的固定方法，IC芯片的固定装置以及IC标签
公开(公告)号：US08456307B2
公开(公告)日：2013-06-04
申请号：US11587240
申请日：2005-04-21
申请人： Hiroshi Suguro , Hideto Sakata , Terunao Tsuchiya , Takaichi Shimomura
发明人： Hiroshi Suguro , Hideto Sakata , Terunao Tsuchiya , Takaichi Shimomura
IPC分类号： G08B13/14
CPC分类号： H01L23/49855 , G06K19/07718 , G06K19/07749 , G06K19/07752 , G06K19/07754 , H01L21/67144 , H01L23/4985 , H01L24/81 , H01L2224/16238 , H01L2224/75 , H01L2224/75252 , H01L2224/7565 , H01L2224/759 , H01L2224/7598 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01079 , H01L2924/01082 , H01L2924/07802 , H01L2924/07811 , H01L2924/14 , H01L2924/15151 , H01L2924/19041 , H01L2924/3011 , H01L2924/00
摘要： A method of producing a sheet 1 with IC tags comprises the steps of: preparing and feeding a sheet 21a with electrical conductors formed thereon; providing an adhesive 18 on the sheet 21a with electrical conductors; preparing multiple IC chips 20 and successively feeding the IC chips 20; successively arranging each IC chip 20 on the electrical conductors 22 of the sheet 21a; and fixing each IC chip 20 onto the electrical conductors 22 through the adhesive 18. The sheet 21a with electrical conductors formed thereon includes a non-conductive sheet 21 and a pair of electrical conductors 22. The pair of electrical conductors 22 of the sheet 21a with the electrical conductors are provided on the non-conductive sheet 21, extend in the feed direction, and are spaced apart from each other.
摘要翻译：制造具有IC标签的片材1的方法包括以下步骤：制备并供给具有形成在其上的电导体的片材21a; 在带有电导体的片材21a上提供粘合剂18; 制备多个IC芯片20并连续馈送IC芯片20; 将每个IC芯片20依次布置在片21a的电导体22上; 并且通过粘合剂18将每个IC芯片20固定到电导体22上。其上形成有电导体的片材21a包括非导电片21和一对电导体22.片21a的一对电导体22具有电导体设置在非导电片21上，沿进给方向延伸并且彼此间隔开。

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