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    • 1. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US08878270B2
    • 2014-11-04
    • US13443928
    • 2012-04-11
    • Toshihiko Saito
    • Toshihiko Saito
    • H01L31/18H01L49/02H01L29/786H01L27/02H01L27/12H01L21/84H01L27/108
    • H01L29/7869H01L21/84H01L27/0288H01L27/10876H01L27/10891H01L27/1203H01L28/60H01L28/86H01L28/90
    • A semiconductor memory device including a bit line, a word line, a transistor, and a capacitor is provided. The transistor includes source and drain electrodes; an oxide semiconductor film in contact with at least both top surfaces of the source and drain electrodes; a gate insulating film in contact with at least a top surface of the oxide semiconductor film; a gate electrode which overlaps with the oxide semiconductor film with the gate insulating film provided therebetween; and an insulating film covering the source and drain electrodes, the gate insulating film, and the gate electrode. The transistor is provided in a mesh of a netlike conductive film when seen from the above. Here, the drain electrode and the netlike conductive film serve as one and the other of a pair of capacitor electrodes of the capacitor. A dielectric film of the capacitor includes at least the insulating film.
    • 提供了包括位线,字线,晶体管和电容器的半导体存储器件。 晶体管包括源极和漏极; 与所述源极和漏极的至少两个顶表面接触的氧化物半导体膜; 与所述氧化物半导体膜的至少顶面接触的栅极绝缘膜; 与所述氧化物半导体膜重叠的栅电极,其间设置有所述栅极绝缘膜; 以及覆盖源极和漏极,栅极绝缘膜和栅电极的绝缘膜。 当从上面看时,晶体管设置在网状导电膜的网格中。 这里,漏电极和网状导电膜用作电容器的一对电容器电极中的一个和另一个。 电容器的电介质膜至少包括绝缘膜。
    • 3. 发明授权
    • Semiconductor memory device and method for inspecting the same
    • 半导体存储器件及其检测方法
    • US08767443B2
    • 2014-07-01
    • US13235967
    • 2011-09-19
    • Toshihiko Saito
    • Toshihiko Saito
    • G11C11/24
    • G11C16/26G11C11/403G11C11/404G11C16/0433
    • When the threshold voltage Vth of the transistor in the memory cell is within the allowable range is determined, a memory cell which does not have sufficient data retention characteristics is eliminated. In order to eliminate such a memory cell, the potential of a gate of the transistor is kept at an appropriate potential VGM and the potential of a drain of the transistor is set higher than or equal to VGM. When data is written to the memory cell in this state, the potential of a source of the transistor is expressed as a formula including the threshold voltage Vth, (VGM−Vth). By comparison between the level of the potential and the level of a reference potential, whether the threshold voltage Vth is within the allowable range can be determined.
    • 当确定存储单元中的晶体管的阈值电压Vth在允许范围内时,消除了不具有足够数据保持特性的存储单元。 为了消除这种存储单元,晶体管的栅极的电位保持在适当的电位VGM,并且晶体管的漏极的电位被设置为高于或等于VGM。 当在该状态下将数据写入存储单元时,晶体管的源极的电位被表示为包括阈值电压Vth(VGM-Vth)的公式。 通过比较电位的电平和参考电位的电平,可以确定阈值电压Vth是否在容许范围内。
    • 4. 发明授权
    • Semiconductor memory device and manufacturing method thereof
    • 半导体存储器件及其制造方法
    • US08709889B2
    • 2014-04-29
    • US13471667
    • 2012-05-15
    • Toshihiko Saito
    • Toshihiko Saito
    • H01L21/8242H01L27/108
    • H01L29/7869G11C11/404H01L21/02554H01L21/02565H01L21/02631H01L21/84H01L27/1156H01L27/1207H01L27/1225
    • A memory cell therein includes a first transistor and a capacitor and stores data corresponding to a potential held in the capacitor. The first transistor includes a pair of electrodes, an insulating film in contact with side surfaces of the electrodes, a first gate electrode provided between the electrodes with the insulating film provided between the first gate electrode and each electrode and whose top surface is at a lower level than top surfaces of the electrodes, a first gate insulating film over the first gate electrode, an oxide semiconductor film in contact with the first gate insulating film and the electrodes, a second gate insulating film at least over the oxide semiconductor film, and a second gate electrode over the oxide semiconductor film with the second gate insulating film provided therebetween. The capacitor is connected to the first transistor through one of the electrodes.
    • 其中的存储单元包括第一晶体管和电容器,并且存储对应于保持在电容器中的电位的数据。 所述第一晶体管包括一对电极,与所述电极的侧面接触的绝缘膜,设置在所述电极之间的第一栅电极,所述绝缘膜设置在所述第一栅电极与每个电极之间,并且其顶表面处于下部 比第一栅极电极上的第一栅极绝缘膜,与第一栅极绝缘膜和电极接触的氧化物半导体膜,至少在氧化物半导体膜上的第二栅极绝缘膜,和 第二栅极电极在氧化物半导体膜上方,其间设置有第二栅极绝缘膜。 电容器通过其中一个电极连接到第一晶体管。
    • 6. 发明授权
    • Semiconductor memory having a read circuit
    • 具有读取电路的半导体存储器
    • US08441868B2
    • 2013-05-14
    • US13078019
    • 2011-04-01
    • Toshihiko Saito
    • Toshihiko Saito
    • G11C7/00
    • G11C16/06G11C16/26
    • The semiconductor device includes the read circuit which reads data written to a memory cell. The read circuit includes a first transistor, a second transistor, a first switch, and a second switch. A first terminal of the first transistor is electrically connected to a gate of the first transistor, and a second terminal of the first transistor is electrically connected to an output from the read circuit via the first switch. A first terminal of the second transistor is electrically connected to a gate of the second transistor, and a second terminal of the second transistor is electrically connected to the output from the read circuit via the second switch. A channel formation region of the first transistor can be formed using an oxide semiconductor, and a channel formation region of the second transistor can be formed using silicon.
    • 半导体器件包括读取写入存储单元的数据的读取电路。 读取电路包括第一晶体管,第二晶体管,第一开关和第二开关。 第一晶体管的第一端子电连接到第一晶体管的栅极,并且第一晶体管的第二端子经由第一开关电连接到来自读取电路的输出端。 第二晶体管的第一端子电连接到第二晶体管的栅极,并且第二晶体管的第二端子经由第二开关电连接到来自读取电路的输出端。 可以使用氧化物半导体形成第一晶体管的沟道形成区域,并且可以使用硅形成第二晶体管的沟道形成区域。
    • 8. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE
    • 半导体存储器件
    • US20120261734A1
    • 2012-10-18
    • US13443027
    • 2012-04-10
    • Toshihiko Saito
    • Toshihiko Saito
    • H01L27/108
    • H01L27/10805G11C11/405G11C16/0433H01L21/84H01L27/0288H01L27/1156H01L27/1203H01L27/1225H01L28/60H01L28/86H01L28/90
    • In the semiconductor memory device, one of a source and a drain of a first transistor is connected to one of a source and a drain of a second transistor, a gate of the first transistor is connected to one of a source and a drain of a third transistor and one of a pair of capacitor electrodes included in a capacitor, the other of the source and the drain of the first transistor and the other of the source and the drain of the third transistor are connected to a bit line, the other of the pair of capacitor electrodes included in the capacitor is connected to a common wiring, and the common wiring is grounded (GND). The common wiring has a net shape when seen from the above, and the third transistor is provided in a mesh formed by the common wiring.
    • 在半导体存储器件中,第一晶体管的源极和漏极之一连接到第二晶体管的源极和漏极之一,第一晶体管的栅极连接到源极和漏极之一 第三晶体管和包括在电容器中的一对电容器电极中的一个,第一晶体管的源极和漏极中的另一个以及第三晶体管的源极和漏极中的另一个连接到位线,另一个 包括在电容器中的一对电容器电极连接到公共布线,并且公共布线接地(GND)。 当从上方观察时,公共布线具有净形状,并且第三晶体管设置在由公共布线形成的网格中。
    • 9. 发明授权
    • Semiconductor device
    • 半导体器件
    • US08264874B2
    • 2012-09-11
    • US12890856
    • 2010-09-27
    • Toshihiko SaitoTakanori Matsuzaki
    • Toshihiko SaitoTakanori Matsuzaki
    • G11C11/00
    • G11C13/004G11C17/16G11C2213/33G11C2213/34G11C2213/79H01L27/24
    • Objects of the present invention are to improve the manufacturing yield of semiconductor devices, reduce manufacturing cost of the semiconductor device, and reduce the circuit area of an integrated circuit included in the semiconductor device. A memory layer of a memory element and a resistive layer of a resistor included in the semiconductor device are formed of the same material. Therefore, the memory layer and the resistive layer are formed in the same step, whereby the number of manufacturing steps of the semiconductor device can be reduced. As a result, the manufacturing yield of the semiconductor devices can be improved and the manufacturing cost can be reduced. In addition, the semiconductor device includes a resistor having a resistive component which has high resistance value. Consequently, the area of the integrated circuit included in the semiconductor device can be reduced.
    • 本发明的目的是提高半导体器件的制造成品率,降低半导体器件的制造成本,并且减小包括在半导体器件中的集成电路的电路面积。 存储元件的存储层和包含在半导体器件中的电阻器的电阻层由相同的材料形成。 因此,在相同的步骤中形成存储层和电阻层,从而可以减少半导体器件的制造步骤的数量。 结果,可以提高半导体器件的制造成品率,并且可以降低制造成本。 此外,半导体器件包括具有高电阻值的电阻元件的电阻器。 因此,可以减少包括在半导体器件中的集成电路的面积。