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    • 7. 发明申请
    • Method for Determining BSIMSOI4 DC Model Parameters
    • 确定BSIMSOI4直流模型参数的方法
    • US20130054210A1
    • 2013-02-28
    • US13696455
    • 2011-09-25
    • Jing ChenQingqing WuJiexin LuoZhan ChaiXi Wang
    • Jing ChenQingqing WuJiexin LuoZhan ChaiXi Wang
    • G06F17/10
    • G01R31/2628G01R31/2603G06F17/5036
    • The present invention provides a method for determining BSIMSOI4 Direct Current (DC) model parameters, where a plurality of Metal Oxide Semiconductor Field Effect Transistor (MOSFET) devices of a body leading-out structure and of different sizes, and a plurality of MOSFET devices of a floating structure and of different sizes are provided; Id-Vg-Vp, Id/Ip-Vd-Vg, Ig-Vg-Vd, Ig-Vp, Ip-Vg-vd, Is/Id-Vp, and Id/Ip-Vp-Vd properties of all the MOSFET devices of a body leading-out structure, and Id-Vg-Vp, Id-Vd-Vg, and Ig-Vg-Vd properties of all the MOSFET devices of a floating structure are measured; electrical property curves without a self-heating effect of each MOSFET device of a body leading-out structure and each MOSFET device of a floating structure are obtained; and then DC parameters of a BSIMSOI4 model are successively extracted according to specific steps. In the present invention, proper test curves are successively selected according to model equations, and various kinds of parameters are successively determined, thereby accurately and effectively extracting the DC parameters of the BSIMSOI4 model.
    • 本发明提供了一种用于确定BSIMSOI4直流(DC)模型参数的方法,其中,体内引出结构和不同尺寸的多个金属氧化物半导体场效应晶体管(MOSFET)器件和多个MOSFET器件 提供浮动结构和不同尺寸; 所有MOSFET器件的Id-Vg-Vp,Id / Ip-Vd-Vg,Ig-Vg-Vd,Ig-Vp,Ip-Vg-vd,Is / Id-Vp和Id / Ip-Vp-Vd特性 测量浮体结构的所有MOSFET器件的体导体结构和Id-Vg-Vp,Id-Vd-Vg和Ig-Vg-Vd特性; 获得不具有体引出结构的每个MOSFET器件和浮置结构的每个MOSFET器件的自发热效应的电性能曲线; 然后根据具体步骤依次提取BSIMSOI4模型的DC参数。 在本发明中,根据模型方程依次选择适当的试验曲线,并连续确定各种参数,从而准确有效地提取BSIMSOI4型号的直流参数。
    • 8. 发明授权
    • Power module and circuit board assembly thereof
    • 电源模块及其电路板组件
    • US08373533B2
    • 2013-02-12
    • US12851237
    • 2010-08-05
    • Han LiGang LiuJing ChenJinfa Zhang
    • Han LiGang LiuJing ChenJinfa Zhang
    • H01F27/29
    • H05K7/1432H01F27/292H01F2027/408H02M3/33592Y02B70/1475
    • A power module includes a first bobbin, a primary winding coil, a circuit board assembly and a first magnetic core assembly. The primary winding coil is wound around the first bobbin. The circuit board assembly includes a printed circuit board, a second winding structure, at least one current-sensing element, a rectifier circuit and an electrical connector. The second winding structure has an output terminal. The current-sensing element includes a first conductor. The first conductor is a conductive sheet. A first end of the first conductor is in contact with the output terminal of the second winding structure. A second end of the first conductor is connected to the rectifier circuit. The primary winding coil is aligned with the second winding structure of the circuit board assembly and arranged within the first magnetic core assembly. The primary winding coil and the electrical connector are electrically connected with a system board.
    • 功率模块包括第一线圈架,初级绕组线圈,电路板组件和第一磁芯组件。 初级绕组线圈缠绕在第一线轴上。 电路板组件包括印刷电路板,第二绕组结构,至少一个电流感测元件,整流器电路和电连接器。 第二绕组结构具有输出端子。 电流检测元件包括第一导体。 第一导体是导电片。 第一导体的第一端与第二绕组结构的输出端接触。 第一导体的第二端连接到整流电路。 初级绕组线圈与电路板组件的第二绕组结构对准并且布置在第一磁芯组件内。 初级绕组线圈和电连接器与系统板电连接。
    • 9. 发明授权
    • Hybrid orientation accumulation mode GAA CMOSFET
    • 混合定向累加模式GAA CMOSFET
    • US08264042B2
    • 2012-09-11
    • US12810574
    • 2010-02-11
    • Deyuan XiaoXi WangMiao ZhangJing ChenZhong Ying Xue
    • Deyuan XiaoXi WangMiao ZhangJing ChenZhong Ying Xue
    • H01L27/12
    • H01L29/78696H01L21/823807H01L21/84H01L27/0688H01L27/1203H01L29/42392
    • A hybrid orientation accumulation mode GAA (Gate-All-Around) CMOSFET includes a PMOS region having a first channel, an NMOS region having a second channel and a gate region. The first channel and the second channel have a racetrack-shaped cross section and are formed of p-type Si(110) and n-type Si(100), respectively; the surfaces of the first channel and the second channel are substantially surrounded by the gate region; a buried oxide layer is disposed between the PMOS region and the NMOS region and between the PMOS or NMOS region and the Si substrate to isolate them from one another. The device structure according to the prevent invention is quite simple, compact and highly integrated. In an accumulation mode, current flows through the overall racetrack-shaped channel. The disclosed device results in high carrier mobility. Meanwhile polysilicon gate depletion and short channel effects are prevented, and threshold voltage is increased.
    • 混合取向累积模式GAA(Gate-All-Around)CMOSFET包括具有第一通道的PMOS区域,具有第二通道的NMOS区域和栅极区域。 第一通道和第二通道具有跑道形横截面并分别由p型Si(110)和n型Si(100)形成; 第一通道和第二通道的表面基本上被栅极区域包围; 在PMOS区域和NMOS区域之间以及在PMOS或NMOS区域和Si衬底之间设置掩埋氧化物层以将它们彼此隔离。 根据本发明的装置结构相当简单,紧凑且高度集成。 在积累模式中,电流流过整个跑道状通道。 所公开的装置导致高载流子迁移率。 同时防止多晶硅栅极耗尽和短沟道效应,并且阈值电压增加。