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1. 发明授权

US06555406B1 Fabrication of photonic band gap materials using microtransfer molded templates 失效
标题翻译：使用微转移模塑模板制造光子带隙材料
公开(公告)号：US06555406B1
公开(公告)日：2003-04-29
申请号：US10081729
申请日：2002-02-22
申请人： Wai Leung , Kristen Constant , Kai-Ming Ho , Mihail Sigalas , Henry Kang , Chang Hwan Kim , David Cann , Jae Hwang Lee
发明人： Wai Leung , Kristen Constant , Kai-Ming Ho , Mihail Sigalas , Henry Kang , Chang Hwan Kim , David Cann , Jae Hwang Lee
IPC分类号： H01L2100
CPC分类号： B82Y20/00 , G02B6/1225 , G02B6/13
摘要： A method of manufacturing photonic band gap structures operable in the optical spectrum has been presented. The method comprises the steps of creating a patterned template for an elastomeric mold, fabricating an elastomeric mold from poly-dimethylsiloxane (PDMS) or other suitable polymer, filling the elastomeric mold with a second polymer such as epoxy or other suitable polymer, stamping the second polymer by making contact with a substrate or multilayer structure, removing the elastomeric mold, infiltrating the multilayer structure with ceramic or metal, and heating the multilayer structure to remove the second polymer to form a photonic band gap structure.
摘要翻译：已经提出了在光谱中可操作的制造光子带隙结构的方法。该方法包括以下步骤：创建用于弹性体模具的图案化模板，由聚二甲基硅氧烷（PDMS）或其它合适的聚合物制造弹性体模具，用第二聚合物如环氧树脂或其它合适的聚合物填充弹性体模具，聚合物通过与基底或多层结构接触，去除弹性体模具，用陶瓷或金属渗透多层结构，并加热多层结构以除去第二聚合物以形成光子带隙结构。

2. 发明授权

US07723811B2 Packaged MEMS device assembly 失效
标题翻译：封装的MEMS器件组件
公开(公告)号：US07723811B2
公开(公告)日：2010-05-25
申请号：US11416709
申请日：2006-05-03
申请人： Charles C Haluzak , Jeffrey R Pollard , Kirby Sand , John R Sterner , Henry Kang , Chien-Hua Chen , James Denning Smith
发明人： Charles C Haluzak , Jeffrey R Pollard , Kirby Sand , John R Sterner , Henry Kang , Chien-Hua Chen , James Denning Smith
IPC分类号： H01L29/82
CPC分类号： B81C3/001 , H01L21/67092 , H01L25/0657 , H01L25/50 , H01L2924/0002 , H01L2924/00
摘要： A packaged micro-electromechanical systems (MEMS) device assembly includes a MEMS device, a substrate within which the MEMS device is disposed, and a lid disposed over the substrate. The assembly may include one or more first cavities within the lid having a predetermined volume satisfying packaging specifications for the packaged MEMS device assembly. The assembly may include one or more second cavities within the lid and one or more corresponding overflow areas within the lid, where each second cavity contains a material and each corresponding overflow area is adapted to catch overflow of the material. The assembly may include one or more third cavities within the lid and one or more channels within one of the substrate and the lid to fluidically connect the MEMS device to the third cavities.
摘要翻译：封装的微机电系统（MEMS）设备组件包括MEMS器件，其中设置MEMS器件的衬底以及设置在衬底上的盖子。组件可以包括盖内的一个或多个第一空腔，其具有满足封装的MEMS装置组件的包装规格的预定体积。组件可以包括盖内的一个或多个第二空腔和盖内的一个或多个对应的溢流区域，其中每个第二空腔包含材料，并且每个相应的溢流区域适于捕获材料的溢流。组件可以包括盖内的一个或多个第三空腔和衬底和盖子之一内的一个或多个通道，以将MEMS器件流体连接到第三腔。

3. 发明申请

US20080272446A1 Packaged MEMS device assembly 失效
标题翻译：封装的MEMS器件组件
公开(公告)号：US20080272446A1
公开(公告)日：2008-11-06
申请号：US11416709
申请日：2006-05-03
申请人： Charles C. Haluzak , Jeffrey R. Pollard , Kirby Sand , John R. Sterner , Henry Kang , Chien-Hua Chen , James Denning Smith
发明人： Charles C. Haluzak , Jeffrey R. Pollard , Kirby Sand , John R. Sterner , Henry Kang , Chien-Hua Chen , James Denning Smith
IPC分类号： H01L29/84 , H01L21/00
CPC分类号： B81C3/001 , H01L21/67092 , H01L25/0657 , H01L25/50 , H01L2924/0002 , H01L2924/00
摘要： A packaged micro-electromechanical systems (MEMS) device assembly includes a MEMS device, a substrate within which the MEMS device is disposed, and a lid disposed over the substrate. The assembly may include one or more first cavities within the lid having a predetermined volume satisfying packaging specifications for the packaged MEMS device assembly. The assembly may include one or more second cavities within the lid and one or more corresponding overflow areas within the lid, where each second cavity contains a material and each corresponding overflow area is adapted to catch overflow of the material. The assembly may include one or more third cavities within the lid and one or more channels within one of the substrate and the lid to fluidically connect the MEMS device to the third cavities.
摘要翻译：封装的微机电系统（MEMS）设备组件包括MEMS器件，其中设置MEMS器件的衬底以及设置在衬底上的盖子。组件可以包括盖内的一个或多个第一空腔，其具有满足封装的MEMS装置组件的包装规格的预定体积。组件可以包括盖内的一个或多个第二空腔和盖内的一个或多个对应的溢流区域，其中每个第二空腔包含材料，并且每个相应的溢流区域适于捕获材料的溢流。组件可以包括盖内的一个或多个第三空腔和衬底和盖子之一内的一个或多个通道，以将MEMS器件流体连接到第三腔。

4. 发明授权

US08863388B2 Stacked adhesive lines 有权
标题翻译：堆叠粘合线
公开(公告)号：US08863388B2
公开(公告)日：2014-10-21
申请号：US13052401
申请日：2011-03-21
申请人： Chris Aschoff , Anthony J. Galvan , Henry Kang , Kelly B. Smith , Lawrence Thurber
发明人： Chris Aschoff , Anthony J. Galvan , Henry Kang , Kelly B. Smith , Lawrence Thurber
IPC分类号： B21D53/76 , B23P17/00 , B41J2/16
CPC分类号： B41J2/16 , B41J2/1623 , Y10T29/49401
摘要： A method for adhesive stacking includes dispensing a first line of adhesive onto a first substrate; dispensing at least one additional line of adhesive stacked onto the first line of adhesive; and placing a second substrate onto the at least one additional line of adhesive to join the first and second substrates.
摘要翻译：粘合剂堆叠的方法包括将第一线粘合剂分配到第一基底上; 分配至少一个附加的粘合剂层的层叠在第一粘合剂线上; 以及将第二衬底放置在所述至少一个附加的粘合剂线上以连接所述第一和第二衬底。

5. 发明申请

US20130050347A1 FLUID EJECTION DEVICE AND METHODS OF FABRICATION 失效
标题翻译：流体喷射装置和制造方法
公开(公告)号：US20130050347A1
公开(公告)日：2013-02-28
申请号：US13217307
申请日：2011-08-25
申请人： Rio Rivas , Minalben Bhavin Shah , Henry Kang
发明人： Rio Rivas , Minalben Bhavin Shah , Henry Kang
IPC分类号： B41J2/05 , H01L21/306
CPC分类号： B41J2/1601 , B41J2/14145 , B41J2/1623 , B41J2/1628 , B41J2/1629 , B41J2/1642
摘要： In an embodiment, a fluid ejection device includes a die including a fluid feed slot that extends from a back side to a front side of the die, a firing chamber formed on the front side to receive fluid from the feed slot, a fluid distribution manifold adhered to the back side to provide fluid to the feed slot, and a corrosion-resistant layer coating the back side of the die so as not to extend into the feed slot.
摘要翻译：在一个实施例中，流体喷射装置包括：模具，其包括从模具的背面延伸到前侧的流体供给槽;形成在前侧的喷射室，用于从进料槽接收流体;流体分配歧管粘附到后侧以向进料槽提供流体，以及涂覆模具背面的耐腐蚀层，以便不延伸到进料槽中。

6. 发明申请

US20060226524A1 Micro-device packaging 有权
公开(公告)号：US20060226524A1
公开(公告)日：2006-10-12
申请号：US11105234
申请日：2005-04-12
申请人： Chien-Hua Chen , Henry Kang , Bradley John
发明人： Chien-Hua Chen , Henry Kang , Bradley John
IPC分类号： H01L23/02
CPC分类号： B81B7/0067 , B81C2203/0109 , B81C2203/019
摘要： In one embodiment, a package for a micro-device includes a substrate, a transparent material covering the substrate, and a bond ring bonding the transparent material to the substrate. The bond ring comprises a silicon oxide layer on one of the substrate or the transparent material bonded to a silicon layer on the other of the substrate or the transparent material.

7. 发明授权

US08382253B1 Fluid ejection device and methods of fabrication 失效
标题翻译：流体喷射装置及其制造方法
公开(公告)号：US08382253B1
公开(公告)日：2013-02-26
申请号：US13217307
申请日：2011-08-25
申请人： Rio Rivas , Minalben Bhavin Shah , Henry Kang
发明人： Rio Rivas , Minalben Bhavin Shah , Henry Kang
IPC分类号： B41J2/05
CPC分类号： B41J2/1601 , B41J2/14145 , B41J2/1623 , B41J2/1628 , B41J2/1629 , B41J2/1642
摘要： In an embodiment, a fluid ejection device includes a die including a fluid feed slot that extends from a back side to a front side of the die, a firing chamber formed on the front side to receive fluid from the feed slot, a fluid distribution manifold adhered to the back side to provide fluid to the feed slot, and a corrosion-resistant layer coating the back side of the die so as not to extend into the feed slot.
摘要翻译：在一个实施例中，流体喷射装置包括：模具，其包括从模具的背面延伸到前侧的流体供给槽;形成在前侧的喷射室，用于从进料槽接收流体;流体分配歧管粘附到后侧以向进料槽提供流体，以及涂覆模具背面的耐腐蚀层，以便不延伸到进料槽中。

8. 发明申请

US20120242757A1 STACKED ADHESIVE LINES 有权
标题翻译：堆叠粘合线
公开(公告)号：US20120242757A1
公开(公告)日：2012-09-27
申请号：US13052401
申请日：2011-03-21
申请人： Chris Aschoff , Anthony J. Galvan , Henry Kang , Kelly B. Smith , Lawrence Thurber
发明人： Chris Aschoff , Anthony J. Galvan , Henry Kang , Kelly B. Smith , Lawrence Thurber
IPC分类号： B41J2/045 , B41J2/16
CPC分类号： B41J2/16 , B41J2/1623 , Y10T29/49401
摘要： A method for adhesive stacking includes dispensing a first line of adhesive onto a first substrate; dispensing at least one additional line of adhesive stacked onto the first line of adhesive; and placing a second substrate onto the at least one additional line of adhesive to join the first and second substrates.
摘要翻译：粘合剂堆叠的方法包括将第一线粘合剂分配到第一基底上; 分配至少一个附加的粘合剂层的层叠在第一粘合剂线上; 以及将第二衬底放置在所述至少一个附加的粘合剂线上以连接所述第一和第二衬底。

9. 发明申请

US20070128828A1 Micro electro-mechanical system packaging and interconnect 有权
标题翻译：微机电系统封装和互连
公开(公告)号：US20070128828A1
公开(公告)日：2007-06-07
申请号：US11192945
申请日：2005-07-29
申请人： Chien-Hua Chen , John Bamber , Henry Kang
发明人： Chien-Hua Chen , John Bamber , Henry Kang
IPC分类号： H01L21/30
CPC分类号： B81C3/002
摘要： A micro electro-mechanical system (MEMS) device includes an electrical wafer, a mechanical wafer, a plasma treated oxide seal bonding the electrical wafer to the mechanical wafer, and an electrical interconnect between the electrical wafer and the mechanical wafer.
摘要翻译：微电子机械系统（MEMS）装置包括电晶片，机械晶片，将电晶片结合到机械晶片的等离子体处理的氧化物密封，以及电晶片和机械晶片之间的电互连。

10. 发明授权

US09019303B2 Method of processing image and apparatus for the same 有权
标题翻译：图像处理方法及其设备
公开(公告)号：US09019303B2
公开(公告)日：2015-04-28
申请号：US13266047
申请日：2011-05-26
申请人： Seung Yong Lee , Yun Jin Lee , Min Jung Son , Henry Kang
发明人： Seung Yong Lee , Yun Jin Lee , Min Jung Son , Henry Kang
IPC分类号： G09G5/00 , G06T11/00 , G06T11/20
CPC分类号： G06T11/001 , G06T11/20
摘要： Provided are a method of generating a resulting image as if drawn by an artist and an apparatus for executing the method. The apparatus includes a first generation unit configured to generate a vector field expressing a shape of an image using feature pixels of the image captured by an image device and direction information of the feature pixels, a second generation unit configured to generate a structure grid indicating a structure for rendering the shape of the image using the vector field, and a rendering unit configured to render primitives expressing predetermined tones on the generated structure grid. Accordingly, it is possible to automatically and rapidly generate a resulting image from one image. Anyone can easily generate a hedcut from one photo without the limitation that a limited number of artists need to invest a great deal of time to complete one hedcut.
摘要翻译：提供了如何由艺术家和用于执行该方法的装置绘制的产生的图像的方法。该装置包括：第一生成单元，被配置为使用由图像设备捕获的图像的特征像素和特征像素的方向信息来生成表示图像的形状的矢量场;第二生成单元，被配置为生成表示用于使用矢量场渲染图像的形状的结构，以及渲染单元，被配置为在生成的结构网格上渲染表示预定色调的图元。因此，可以从一个图像自动且快速地生成结果图像。任何人都可以轻松地从一张照片中产生一个hedcut，而不限于数量有限的艺术家需要投入大量时间来完成一个hedcut。

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