专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07683459B2 Bonding method for through-silicon-via based 3D wafer stacking 有权
标题翻译：基于硅通孔的3D晶片堆叠的粘合方法
公开(公告)号：US07683459B2
公开(公告)日：2010-03-23
申请号：US12131788
申请日：2008-06-02
申请人： Wei Ma , Xunqing Shu , Chang Hwa Chung
发明人： Wei Ma , Xunqing Shu , Chang Hwa Chung
IPC分类号： H01L29/40 , H01L21/00
CPC分类号： H01L23/481 , H01L21/6836 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/94 , H01L25/0657 , H01L25/50 , H01L2221/6834 , H01L2224/0401 , H01L2224/0557 , H01L2224/13025 , H01L2224/13099 , H01L2224/83194 , H01L2224/9202 , H01L2224/9205 , H01L2224/9212 , H01L2224/94 , H01L2225/06541 , H01L2924/0002 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/07811 , H01L2924/10253 , H01L2924/14 , H01L2224/83 , H01L2224/81 , H01L2924/00 , H01L2224/05552
摘要： There is described a hybrid bonding method for through-silicon-via based wafer stacking. Patterned adhesive layers are provided to join together adjacent wafers in the stack, while solder bonding is used to electrically connect the vias. The adhesive layers are patterned to enable outgassing and to provide stress relief.
摘要翻译：描述了用于基于硅通孔的晶片堆叠的混合结合方法。提供图案化的粘合剂层以将堆叠中的相邻晶片连接在一起，同时使用焊接来电连接通孔。图案化粘合剂层以能够脱气并提供应力消除。

2. 发明申请

US20090243046A1 Pulse-Laser Bonding Method for Through-Silicon-Via Based Stacking of Electronic Components 有权
标题翻译：脉冲激光焊接方法，用于电子元件的基于硅通孔的堆叠
公开(公告)号：US20090243046A1
公开(公告)日：2009-10-01
申请号：US12057241
申请日：2008-03-27
申请人： Xunqing Shi , Wei Ma , Bin Xie , Chang Hwa Chung
发明人： Xunqing Shi , Wei Ma , Bin Xie , Chang Hwa Chung
IPC分类号： H01L23/538 , B23K26/22 , H01L21/44
CPC分类号： H01L21/76898 , H01L21/6835 , H01L24/13 , H01L24/27 , H01L24/29 , H01L24/81 , H01L24/94 , H01L25/0657 , H01L25/50 , H01L2221/68359 , H01L2224/0401 , H01L2224/05166 , H01L2224/05171 , H01L2224/0557 , H01L2224/056 , H01L2224/05611 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/13099 , H01L2224/16 , H01L2224/274 , H01L2224/29101 , H01L2224/2919 , H01L2224/8182 , H01L2225/06513 , H01L2225/06541 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/0106 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/351 , H01L2924/00 , H01L2224/05552 , H01L2924/00014 , H01L2924/013
摘要： There is described a method of forming a through-silicon-via to form an interconnect between two stacked semiconductor components using pulsed laser energy. A hole is formed in each component, and each hole is filled with a plug formed of a first metal. One component is then stacked on another component such that the holes are in alignment, and a pulse of laser energy is applied to form a bond between the metal plugs.
摘要翻译：描述了形成穿硅通孔以形成使用脉冲激光能量的两个堆叠的半导体部件之间的互连的方法。在每个部件中形成孔，并且每个孔填充有由第一金属形成的塞子。然后将一个部件堆叠在另一部件上，使得孔对准，并且施加激光能量的脉冲以在金属插塞之间形成结合。

3. 发明授权

US08138577B2 Pulse-laser bonding method for through-silicon-via based stacking of electronic components 有权
标题翻译：脉冲激光焊接方法，用于电子元件的基于硅通孔的堆叠
公开(公告)号：US08138577B2
公开(公告)日：2012-03-20
申请号：US12057241
申请日：2008-03-27
申请人： Xunqing Shi , Wei Ma , Bin Xie , Chang Hwa Chung
发明人： Xunqing Shi , Wei Ma , Bin Xie , Chang Hwa Chung
IPC分类号： H01L23/538 , H01L21/44
CPC分类号： H01L21/76898 , H01L21/6835 , H01L24/13 , H01L24/27 , H01L24/29 , H01L24/81 , H01L24/94 , H01L25/0657 , H01L25/50 , H01L2221/68359 , H01L2224/0401 , H01L2224/05166 , H01L2224/05171 , H01L2224/0557 , H01L2224/056 , H01L2224/05611 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/13099 , H01L2224/16 , H01L2224/274 , H01L2224/29101 , H01L2224/2919 , H01L2224/8182 , H01L2225/06513 , H01L2225/06541 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/0106 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/351 , H01L2924/00 , H01L2224/05552 , H01L2924/00014 , H01L2924/013
摘要： There is described a method of forming a through-silicon-via to form an interconnect between two stacked semiconductor components using pulsed laser energy. A hole is formed in each component, and each hole is filled with a plug formed of a first metal. One component is then stacked on another component such that the holes are in alignment, and a pulse of laser energy is applied to form a bond between the metal plugs.
摘要翻译：描述了形成穿硅通孔以形成使用脉冲激光能量的两个堆叠的半导体部件之间的互连的方法。在每个部件中形成孔，并且每个孔填充有由第一金属形成的塞子。然后将一个部件堆叠在另一部件上，使得孔对准，并且施加激光能量的脉冲以在金属插塞之间形成结合。

4. 发明申请

US20090294916A1 BONDING METHOD FOR THROUGH-SILICON-VIA BASED 3D WAFER STACKING 有权
标题翻译：用于基于硅的三维WAFER堆叠的绑定方法
公开(公告)号：US20090294916A1
公开(公告)日：2009-12-03
申请号：US12131788
申请日：2008-06-02
申请人： Wei Ma , Xunqing Shi , Chang Hwa Chung
发明人： Wei Ma , Xunqing Shi , Chang Hwa Chung
IPC分类号： H01L23/538 , H01L21/50
CPC分类号： H01L23/481 , H01L21/6836 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/94 , H01L25/0657 , H01L25/50 , H01L2221/6834 , H01L2224/0401 , H01L2224/0557 , H01L2224/13025 , H01L2224/13099 , H01L2224/83194 , H01L2224/9202 , H01L2224/9205 , H01L2224/9212 , H01L2224/94 , H01L2225/06541 , H01L2924/0002 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/07811 , H01L2924/10253 , H01L2924/14 , H01L2224/83 , H01L2224/81 , H01L2924/00 , H01L2224/05552
摘要： There is described a hybrid bonding method for through-silicon-via based wafer stacking. Patterned adhesive layers are provided to join together adjacent wafers in the stack, while solder bondng is used to electrically connect the vias. The adhesive layers are patterned to enable outgassing and to provide stress relief.
摘要翻译：描述了用于基于硅通孔的晶片堆叠的混合结合方法。提供图案化的粘合剂层以将堆叠中的相邻晶片连接在一起，而焊接焊接用于电连接通孔。图案化粘合剂层以能够脱气并提供应力消除。

5. 发明授权

US08954054B2 Method for processing and testing of called terminal and long term evolution system 有权
标题翻译：被叫终端和长期演进系统的处理和测试方法
公开(公告)号：US08954054B2
公开(公告)日：2015-02-10
申请号：US13635285
申请日：2011-03-18
申请人： Wei Ma
发明人： Wei Ma
IPC分类号： H04W24/00 , H04W68/00 , H04W48/18 , H04W60/00 , H04W76/02
CPC分类号： H04W68/00 , H04W48/18 , H04W60/00 , H04W76/10
摘要： The disclosure discloses a method for processing/testing of a called terminal and a Long Time Evolution (LTE) system. The method comprises that: a network side of the LTE system sends a paging message to the terminal residing in an LTE cell which is called by a Circuit Switched (CS) domain service; the terminal establishes a Radio Resource Control (RRC) connection with the network side; the terminal sends to the network side a message for requesting to establish a CS domain service; the network side indicates, to the terminal, carrier frequency information of a Global System for Mobile Communications (GSM) cell to which the terminal needs to be redirected; the terminal sends a channel request message to the GSM cell; the terminal performs routing area updating in the GSM cell; the terminal sends a paging response message to the GSM cell; the terminal establishes the CS domain service in the GSM cell. By using the disclosure, when being called by the CS domain service, the terminal residing in the LTE cell can return to a cell of a corresponding network to establish the CS domain service.
摘要翻译：本公开公开了一种用于处理/测试被叫终端和长时间演进（LTE）系统的方法。该方法包括：LTE系统的网络侧向驻留在通过电路交换（CS）域服务调用的LTE小区的终端发送寻呼消息; 终端与网络侧建立无线资源控制（RRC）连接; 终端向网络侧发送请求建立CS域服务的消息; 网络侧向终端指示终端需要被重定向到的全球移动通信系统（GSM）小区的载波频率信息; 终端向GSM小区发送信道请求消息; 终端在GSM小区中执行路由区域更新; 终端向GSM小区发送寻呼响应消息; 该终端在GSM小区中建立CS域服务。通过使用本公开，当被CS域服务调用时，驻留在LTE小区中的终端可以返回到相应网络的小区以建立CS域服务。

6. 发明授权

US08363846B1 Frequency domain signal processor for close talking differential microphone array 有权
标题翻译：频域信号处理器用于近距离差分麦克风阵列
公开(公告)号：US08363846B1
公开(公告)日：2013-01-29
申请号：US11684076
申请日：2007-03-09
申请人： Yunhong Li , Lin Sun , Wei Ma
发明人： Yunhong Li , Lin Sun , Wei Ma
IPC分类号： H04R3/00
CPC分类号： G10K11/178 , H04M1/6008
摘要： A system and method for processing close talking differential microphone array (CTDMA) signals in which incoming microphone signals are transformed from time domain signals to frequency domain signals having separable magnitude and phase information. Processing of the frequency domain signals is performed using the magnitude information, following which phase information is reintroduced using phase information of one of the original frequency domain signals. As a result, high pass filtering effects of conventional differential signal processing of CTDMA signals are substantially avoided.
摘要翻译：用于处理紧密通话的差分麦克风阵列（CTDMA）信号的系统和方法，其中输入的麦克风信号从时域信号变换到具有可分离的幅度和相位信息的频域信号。使用幅度信息来执行频域信号的处理，随后使用原始频域信号之一的相位信息重新引入相位信息。结果，实质上避免了CTDMA信号的常规差分信号处理的高通滤波效应。

7. 发明申请

US20110051937A1 BEAM FORMING IN SPATIALIZED AUDIO SOUND SYSTEMS USING DISTRIBUTED ARRAY FILTERS 有权
标题翻译：使用分布式阵列滤波器形成空间音频声音系统中的波束形成
公开(公告)号：US20110051937A1
公开(公告)日：2011-03-03
申请号：US12874502
申请日：2010-09-02
申请人： Wei Ma , Yunhong Li , Ahmad Bahai
发明人： Wei Ma , Yunhong Li , Ahmad Bahai
IPC分类号： H04R5/00 , H03F99/00
CPC分类号： H04R5/02
摘要： A system includes multiple speakers arranged in a speaker array configuration. The system also includes one or more filters configured to filter audio signals and generate filtered audio signals. The one or more filters are configured to operate using filter coefficients associated with a desired beam pattern to be produced by the multiple speakers. The system further includes at least one amplifier configured to amplify the filtered audio signals and provide the amplified filtered audio signals to the speakers. The one or more filters reside within or are coupled to the at least one amplifier. The system may further include a controller configured to modify at least one of the filter coefficients based on a change in the speaker configuration. The filters may operate independently of a centralized processor, and a centralized processor may not even be required to provide electronic beam forming.
摘要翻译：系统包括布置在扬声器阵列配置中的多个扬声器。该系统还包括被配置为过滤音频信号并产生滤波后的音频信号的一个或多个滤波器。一个或多个滤波器被配置为使用与由多个扬声器产生的期望波束图案相关联的滤波器系数进行操作。该系统还包括至少一个放大器，其被配置为放大经滤波的音频信号并将放大的经滤波的音频信号提供给扬声器。一个或多个滤波器驻留在或耦合到至少一个放大器。该系统还可以包括控制器，其被配置为基于扬声器配置的变化来修改至少一个滤波器系数。滤波器可以独立于集中处理器操作，并且中央处理器甚至可能不需要提供电子束形成。

8. 发明授权

US07643253B2 HGA rotational micro-actuator including an s-shaped frame and method of making thereof 失效
标题翻译： HGA旋转微致动器，其包括s形框架及其制造方法
公开(公告)号：US07643253B2
公开(公告)日：2010-01-05
申请号：US11536558
申请日：2006-09-28
申请人： Minggao Yao , Yiru Xie , Wei Ma
发明人： Minggao Yao , Yiru Xie , Wei Ma
IPC分类号： G11B5/56
CPC分类号： G11B5/5552
摘要： A rotational micro-actuator (20) used in hard disk driver is disclosed. It comprises a frame (21) approximately in the shape of letter “S” and PZT pieces (28, 29) attached to said frame (21), wherein said frame (21) is formed with a central coupling portion (213) by which the micro-actuator (20) is coupled to a suspension tongue (177), and two pieces of said PZT (28, 29) are arranged in central symmetry manner about said central coupling portion (213) such that said micro-actuator (20) can rotate about said central coupling portion (213) in response to the driving signals applied to said PZT pieces (28, 29), thus cause the displacement of the head element secured to the micro-actuator (20) so as to achieve the fine positioning of the head element. With above configuration, the micro-actuator of this invention will not cause the resonance of the suspension base plate during operation. Thereby the servo bandwidth of the hard disk driver is expanded.
摘要翻译：公开了一种用于硬盘驱动器的旋转微致动器（20）。它包括大致为字母“S”的框架（21）和附着到所述框架（21）上的PZT片（28,29），其中所述框架（21）形成有中心联接部分（213）微致动器（20）联接到悬挂舌（177），并且两个所述PZT（28,29）围绕所述中心联接部分（213）以中心对称的方式布置，使得所述微致动器（20））可以响应于施加到所述PZT片（28,29）的驱动信号而围绕所述中心联接部分（213）旋转，从而导致固定到微致动器（20）的头元件的位移，以便实现头元素的精细定位。通过上述结构，本发明的微型致动器在操作中不会引起悬架基板的共振。从而扩大了硬盘驱动器的伺服带宽。

9. 发明申请

US20080232606A1 SYNCHRONOUS DETECTION AND CALIBRATION SYSTEM AND METHOD FOR DIFFERENTIAL ACOUSTIC SENSORS 有权
标题翻译：同步声学传感器同步检测与校准系统及方法
公开(公告)号：US20080232606A1
公开(公告)日：2008-09-25
申请号：US11688437
申请日：2007-03-20
申请人： Peter Holloway , Yunhong Li , Wei Ma , Peter Kamp
发明人： Peter Holloway , Yunhong Li , Wei Ma , Peter Kamp
IPC分类号： G10K11/16
CPC分类号： H04R29/006 , H04R3/005 , H04R2499/11
摘要： A synchronous detection and calibration system is provided for expedient calibration of differential acoustic sensors in a manufacturing and testing environment. By processing a series of sequentially received tones, respective portions of a system using differential acoustic sensors are tuned for optimum individual operation, following which corresponding control data are generated and stored for use in selecting among predetermined calibration vectors which establish and maintain optimum system operation.
摘要翻译：提供同步检测和校准系统，用于在制造和测试环境中对差分声学传感器进行便利校准。通过处理一系列顺序接收的音调，调整使用差分声传感器的系统的各部分以实现最佳的个人操作，随后生成并存储对应的控制数据，以用于建立和维持最佳系统操作的预定校准向量之间的选择。

10. 发明申请

US20080076813A1 Benzene, Pyridine, and Pyridazine Derivatives 审中-公开
标题翻译：苯，吡啶和哒嗪衍生物
公开(公告)号：US20080076813A1
公开(公告)日：2008-03-27
申请号：US11844704
申请日：2007-08-24
申请人： Kenneth Huang , Philip Hughes , Wei Ma , Andy Ommen , Angela Woodward , James Veal , Thomas Barta
发明人： Kenneth Huang , Philip Hughes , Wei Ma , Andy Ommen , Angela Woodward , James Veal , Thomas Barta
IPC分类号： A61K31/403 , A61K31/277 , A61K31/4184 , A61P19/02 , A61P25/00 , A61P29/00 , A61P31/00 , A61P35/00 , A61P37/00 , A61P9/00 , C07C255/58 , C07D207/36 , C07D235/26 , C07D405/02
CPC分类号： C07D209/34 , C07D235/26
摘要： Disclosed are compounds and pharmaceutically acceptable salts of Formula I wherein A, Q1, Q2, Q3, R3, and R4 are as defined herein. Compounds of Formula I are useful in the treatment of diseases and/or conditions related to cell proliferation, such as cancer, inflammation, arthritis, angiogenesis, or the like. Also disclosed are pharmaceutical compositions comprising compounds of the invention and methods of treating the aforementioned conditions using such compounds.
摘要翻译：公开了其中A，Q 1，Q 2，Q 3，R 3，且R 4和R 4如本文所定义。式I化合物可用于治疗与细胞增殖相关的疾病和/或病症，例如癌症，炎症，关节炎，血管生成等。还公开了包含本发明化合物的药物组合物和使用这些化合物治疗上述病症的方法。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式