专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07279782B2 FBGA and COB package structure for image sensor 有权
标题翻译：图像传感器的FBGA和COB封装结构
公开(公告)号：US07279782B2
公开(公告)日：2007-10-09
申请号：US11029929
申请日：2005-01-05
申请人： Wen-Kun Yang , Chin-Chen Yang , Wen-Bin Sun , Jui-Hsien Chang , Chun Hui Yu , His-Ying Yuan
发明人： Wen-Kun Yang , Chin-Chen Yang , Wen-Bin Sun , Jui-Hsien Chang , Chun Hui Yu , His-Ying Yuan
IPC分类号： H01L23/02
CPC分类号： H01L27/14618 , H01L27/14625 , H01L27/14627 , H01L2224/48227 , H01L2924/10253 , H01L2924/16235 , H01L2924/181 , H01L2924/3011 , H01L2924/00 , H01L2924/00012
摘要： A structure of package comprises a die placed on printed circuit board. A glass substrate is adhered on an adhesive film pattern to form an air gap area between the glass substrate and the chip. Micro lens are disposed on the chip. A lens holder is fixed on printed circuit board. The glass substrate can prevent the micro lens from particle contamination.
摘要翻译：封装结构包括放置在印刷电路板上的管芯。将玻璃基板粘附在粘合膜图案上以在玻璃基板和芯片之间形成气隙区域。微透镜设置在芯片上。透镜架固定在印刷电路板上。玻璃基板可防止微透镜受到颗粒污染。

2. 发明授权

US07525139B2 Image sensor with a protection layer 有权
标题翻译：具有保护层的图像传感器
公开(公告)号：US07525139B2
公开(公告)日：2009-04-28
申请号：US11025746
申请日：2004-12-29
申请人： Wen-Kun Yang , Chin-Chen Yang , Wen-Ping Yang , Wen-Bin Sun , Chao-nan Chou , His-Ying Yuan , Jui-Hsien Chang
发明人： Wen-Kun Yang , Chin-Chen Yang , Wen-Ping Yang , Wen-Bin Sun , Chao-nan Chou , His-Ying Yuan , Jui-Hsien Chang
IPC分类号： H01L31/062
CPC分类号： H01L27/14687 , H01L21/561 , H01L24/97 , H01L27/14618 , H01L27/14625 , H01L27/14627 , H01L27/14632 , H01L27/14685 , H01L31/0203 , H01L31/02325 , H01L2224/04105 , H01L2224/20 , H01L2224/211 , H01L2224/24137 , H01L2224/32145 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2924/01068 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/15788 , H05K1/189 , H01L2924/00 , H01L2224/83 , H01L2224/82
摘要： An image sensor die comprises a substrate and an image sensor array formed over the substrate. Micro lens are disposed on the image sensor array. A protection layer is formed on the micro lens to prevent the micro lens from particle containment.
摘要翻译：图像传感器管芯包括衬底和形成在衬底上的图像传感器阵列。微透镜设置在图像传感器阵列上。在微透镜上形成保护层，以防止微透镜受到颗粒的抑制。

3. 发明申请

US20050242409A1 Imagine sensor with a protection layer 有权
标题翻译：想象一下具有保护层的传感器
公开(公告)号：US20050242409A1
公开(公告)日：2005-11-03
申请号：US11025746
申请日：2004-12-29
申请人： Wen-Kun Yang , Chin-Chen Yang , Wen-Ping Yang , Wen-Bin Sun , Chao-nan Chou , His-Ying Yuan , Jui-Hsien Chang
发明人： Wen-Kun Yang , Chin-Chen Yang , Wen-Ping Yang , Wen-Bin Sun , Chao-nan Chou , His-Ying Yuan , Jui-Hsien Chang
IPC分类号： H01L27/14 , H01L21/00 , H01L21/50 , H01L21/56 , H01L23/12 , H01L23/50 , H01L27/144 , H01L27/146 , H01L29/06 , H01L31/00 , H01L31/0203 , H01L31/0232 , H01L31/10 , H04N5/225 , H05K1/18
CPC分类号： H01L27/14687 , H01L21/561 , H01L24/97 , H01L27/14618 , H01L27/14625 , H01L27/14627 , H01L27/14632 , H01L27/14685 , H01L31/0203 , H01L31/02325 , H01L2224/04105 , H01L2224/20 , H01L2224/211 , H01L2224/24137 , H01L2224/32145 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2224/97 , H01L2924/01068 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/15788 , H05K1/189 , H01L2924/00 , H01L2224/83 , H01L2224/82
摘要： An image sensor die comprises a substrate and an image sensor array formed over the substrate. Micro lens are disposed on the image sensor array. A protection layer is formed on the micro lens to prevent the micro lens from particle containment.
摘要翻译：图像传感器管芯包括衬底和形成在衬底上的图像传感器阵列。微透镜设置在图像传感器阵列上。在微透镜上形成保护层，以防止微透镜受到颗粒的抑制。

4. 发明申请

US20060145325A1 FBGA and COB package structure for image sensor 有权
标题翻译：图像传感器的FBGA和COB封装结构
公开(公告)号：US20060145325A1
公开(公告)日：2006-07-06
申请号：US11029929
申请日：2005-01-05
申请人： Wen-Kun Yang , Chin-Chen Yang , Wen-Bin Sun , Jui-Hsien Chang , Chun Yu , His-Ying Yuan
发明人： Wen-Kun Yang , Chin-Chen Yang , Wen-Bin Sun , Jui-Hsien Chang , Chun Yu , His-Ying Yuan
IPC分类号： H01L23/02
CPC分类号： H01L27/14618 , H01L27/14625 , H01L27/14627 , H01L2224/48227 , H01L2924/10253 , H01L2924/16235 , H01L2924/181 , H01L2924/3011 , H01L2924/00 , H01L2924/00012
摘要： A structure of package comprises a die placed on printed circuit board. A glass substrate is adhered on an adhesive film pattern to form an air gap area between the glass substrate and the chip. Micro lens are disposed on the chip. A lens holder is fixed on printed circuit board. The glass substrate can prevent the micro lens from particle contamination.
摘要翻译：封装结构包括放置在印刷电路板上的管芯。将玻璃基板粘附在粘合膜图案上以在玻璃基板和芯片之间形成气隙区域。微透镜设置在芯片上。透镜架固定在印刷电路板上。玻璃基板可防止微透镜受到颗粒污染。

5. 发明授权

US07400037B2 Packaging structure with coplanar filling paste and dice and with patterned glue for WL-CSP 有权
标题翻译：包装结构具有共面填充膏和骰子，并具有WL-CSP图案胶
公开(公告)号：US07400037B2
公开(公告)日：2008-07-15
申请号：US11026488
申请日：2004-12-30
申请人： Wen-Kun Yang , Chin-Chen Yang , Cheng-hsien Chiu , Wen-Bin Sun , Kuang-Chi Chao , His-Ying Yuan , Chun-Hui Yu
发明人： Wen-Kun Yang , Chin-Chen Yang , Cheng-hsien Chiu , Wen-Bin Sun , Kuang-Chi Chao , His-Ying Yuan , Chun-Hui Yu
IPC分类号： H01L23/34
CPC分类号： H01L21/6835 , H01L23/5389 , H01L24/29 , H01L24/83 , H01L2224/2919 , H01L2224/8385 , H01L2924/01006 , H01L2924/01015 , H01L2924/01027 , H01L2924/01033 , H01L2924/01094 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： A filling paste structure and process of wafer level package is disclosed. The process comprises filling an adhesive material to fill among plurality of dice and cover the plurality of dice. The pluralities of dice are adhered to glue pattern with viscosity in common state formed on a removable substrate. A rigid substrate is coated by adhesive material to adhere the dice. Then, pluralities of dice are departed from the glue pattern by a special environment after attaching the rigid base substrate.
摘要翻译：公开了一种填充浆料结构和晶片级封装的工艺。该方法包括填充粘合剂材料以填充多个骰子并覆盖多个骰子。多个骰子粘附在形成在可移除基底上的共同状态下的粘度的胶图案上。用粘合剂材料涂覆刚性基材以粘附骰子。然后，在连接刚性基底之后，多个骰子由特殊的环境离开胶合图案。

6. 发明申请

US20060145364A1 Filling paste structure and process for WL-CSP 有权
标题翻译： WL-CSP灌装浆料结构及工艺
公开(公告)号：US20060145364A1
公开(公告)日：2006-07-06
申请号：US11026488
申请日：2004-12-30
申请人： Wen-Kun Yang , Chin-Chen Yang , Cheng-hsien Chiu , Wen-Bin Sun , Kuang-Chi Chao , His-Ying Yuan , Chun-Hui Yu
发明人： Wen-Kun Yang , Chin-Chen Yang , Cheng-hsien Chiu , Wen-Bin Sun , Kuang-Chi Chao , His-Ying Yuan , Chun-Hui Yu
IPC分类号： H01L23/29
CPC分类号： H01L21/6835 , H01L23/5389 , H01L24/29 , H01L24/83 , H01L2224/2919 , H01L2224/8385 , H01L2924/01006 , H01L2924/01015 , H01L2924/01027 , H01L2924/01033 , H01L2924/01094 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/14 , H01L2924/181 , H01L2924/00
摘要： A filling paste structure and process of wafer level package is disclosed. The process comprises filling an adhesive material to fill among plurality of dice and cover the plurality of dice. The pluralities of dice are adhered to glue pattern with viscosity in common state formed on a removable substrate. A rigid substrate is coated by adhesive material to adhere the dice. Then, pluralities of dice are departed from the glue pattern by a special environment after attaching the rigid base substrate.
摘要翻译：公开了一种填充浆料结构和晶片级封装的工艺。该方法包括填充粘合剂材料以填充多个骰子并覆盖多个骰子。多个骰子粘附在形成在可移除基底上的共同状态下的粘度的胶图案上。用粘合剂材料涂覆刚性基材以粘附骰子。然后，在连接刚性基底之后，多个骰子由特殊的环境离开胶合图案。

7. 发明授权

US07258322B1 Manually operated switch for a faucet 有权
标题翻译：水龙头手动开关
公开(公告)号：US07258322B1
公开(公告)日：2007-08-21
申请号：US11406605
申请日：2006-04-19
申请人： Chin-Chen Yang
发明人： Chin-Chen Yang
IPC分类号： F16K31/44
CPC分类号： F16K1/12 , E03C1/0404 , E03C2201/30 , Y10T137/9464
摘要： A manually operated switch for a faucet has a body, an inner pipe, a switching valve assembly. The body is hollow. The inner pipe is located inside of the body and has a flowing way. The flowing way is formed through the inner pipe. The switching valve assembly is slidably mounted inside of the flowing way of the inner pipe and extends out the body. When the switching valve assembly closes the flowing way of the inner pipe, the water pressure will keep the switching valve assembly closed. After the water pressure applied to the switching valve assembly is released or dismissed, the switching valve assembly returns back to an original position so that the flowing way is opened. The opening and closing flowing way can manually control the way of water flowing so that a user may not be scared or burned by the water.
摘要翻译：用于水龙头的手动操作开关具有主体，内管，切换阀组件。身体是空洞的内管位于身体内部并具有流动的方式。流动的方式通过内管形成。切换阀组件可滑动地安装在内管的流动方式的内部并延伸出主体。当切换阀组件关闭内管的流动方式时，水压将保持切换阀组件关闭。在施加到切换阀组件的水压被释放或解除之后，切换阀组件返回到初始位置，使得流动方式打开。打开和关闭流动的方式可以手动控制水的流动方式，使得使用者不会被水吓到或燃烧。

8. 发明授权

US06556268B1 Method for forming compact LCD packages and devices formed in which first bonding PCB to LCD panel and second bonding driver chip to PCB 有权
标题翻译：用于形成紧凑型LCD封装和器件的方法，其中将PCB粘合到LCD面板和将第二粘合驱动器芯片粘合到PCB
公开(公告)号：US06556268B1
公开(公告)日：2003-04-29
申请号：US09282689
申请日：1999-03-31
申请人： Yu-Chi Lee , Chin-Chen Yang , Hong-Yu Lin , Fang-I Shieh
发明人： Yu-Chi Lee , Chin-Chen Yang , Hong-Yu Lin , Fang-I Shieh
IPC分类号： G02F11345
CPC分类号： G02F1/13452 , H05K1/189 , H05K3/361
摘要： A method for forming a compact LCD package and devices formed by such method are disclosed. In the method, an LCD display panel is formed by bonding an upper glass panel and a lower glass panel together and exposing an edge portion formed by a larger lower glass panel. Conductive traces formed of a conductive film layer such as ITO is provided on the edge portion of the LCD display panel for providing electrical connection to the drive lines and scan lines for the LCD panel. A two-step bonding method is used to first bond a printed circuit board in a pre-bonding step to the exposed edge portion of the LCD panel by using an anisotropic conductive film layer. The bonding is conducted under pressure and heat such that electrical communication is established through the conductive metal particles contained in the anisotropic conductive film. In a second, or post-bonding step, an IC chip or a driver chip is bonded to the top of the PCB by a multiplicity of solder bumps formed on the driver chip connecting electrically to a second multiplicity of conductive pads formed on top of the PCB substrate. The present invention novel method therefore produces a more compact LCD package which saves a planar area in an edge portion by at least 50%. In the first pre-bonding method that utilizes an anisotropic conductive film, fabrication equipment for an outer lead bonding method can be utilized. In the post-bonding step, fabrication equipment for an inner lead bonding method can be used.
摘要翻译：公开了一种用于形成紧凑型LCD封装的方法和通过这种方法形成的器件。在该方法中，通过将上玻璃面板和下玻璃面板结合在一起并露出由较大的下玻璃面板形成的边缘部分而形成LCD显示面板。在LCD显示面板的边缘部分设置由诸如ITO的导电膜层形成的导电迹线，用于提供与LCD面板的驱动线和扫描线的电连接。使用两步接合方法通过使用各向异性导电膜层将预粘合步骤中的印刷电路板首先结合到LCD面板的暴露边缘部分。在压力和热量下进行接合，使得通过各向异性导电膜中所含的导电金属颗粒建立电连通。在第二或后贴合步骤中，IC芯片或驱动器芯片通过形成在驱动器芯片上的多个焊料凸块接合到PCB的顶部，该焊料凸块电连接到形成在第二多个导电焊盘上的第二多个导电焊盘 PCB基板。因此，本发明的新方法产生更紧凑的LCD封装，其将边缘部分中的平面区域保持至少50％。在利用各向异性导电膜的第一预接合方法中，可以利用外引线接合方法的制造设备。在后贴合步骤中，可以使用内引线接合方法的制造设备。

9. 发明授权

US07686909B2 Reel-type package of flexible printed circuit boards and method for supplying thereof 有权
标题翻译：柔性印刷电路板的卷绕式封装及其供电方法
公开(公告)号：US07686909B2
公开(公告)日：2010-03-30
申请号：US11896498
申请日：2007-09-04
申请人： Ping-Chin Cheng , Sheng-Hsiung Ho , Chin-Chen Yang
发明人： Ping-Chin Cheng , Sheng-Hsiung Ho , Chin-Chen Yang
IPC分类号： B32B38/04
CPC分类号： H05K3/0052 , H05K1/0393 , H05K3/005 , H05K3/0097 , H05K3/361 , H05K2203/1545 , Y10T156/1052 , Y10T156/1067 , Y10T156/1087 , Y10T156/12
摘要： A method for reel-type packaging flexible printed circuit boards (FPCs) is disclosed. Firstly, a flexible plate having a plurality of FPC patterns is cut out to form several bar-like materials, wherein each of the bar-like materials has a plurality of aligned FPCs thereon. Subsequently, the bar-like materials are wound onto a reel one by one to form a reel-type package so as to prevent the FPCs from crumpling, curving and deforming when suffering an external force.
摘要翻译：公开了一种卷绕式包装柔性印刷电路板（FPC）的方法。首先，切割具有多个FPC图案的柔性板以形成几个棒状材料，其中每个棒状材料上具有多个对准的FPC。随后，将棒状材料一个一个地缠绕在卷轴上，以形成卷轴式包装，以防止FPC在受到外力时弄皱，弯曲和变形。

10. 发明申请

US20050208435A1 METHOD FOR FABRICATING METALLIC STRUCTURE 审中-公开
标题翻译：制作金属结构的方法
公开(公告)号：US20050208435A1
公开(公告)日：2005-09-22
申请号：US10708702
申请日：2004-03-19
申请人： Irene Chen , Jyh-Huei Lay , Tien-Yu Chou , Yih-Far Chen , Yuan-Hung Wang , Jo-Wen Wu , Kuo-Hsiung Yen , Chin-Chen Yang , Chuan-Lun Hsu , Wei-Chih Ma , Hung-Lung Chuang
发明人： Irene Chen , Jyh-Huei Lay , Tien-Yu Chou , Yih-Far Chen , Yuan-Hung Wang , Jo-Wen Wu , Kuo-Hsiung Yen , Chin-Chen Yang , Chuan-Lun Hsu , Wei-Chih Ma , Hung-Lung Chuang
IPC分类号： G03F7/00 , G03F7/40
CPC分类号： G03F7/405 , G03F7/00 , G03F7/0015 , G03F7/0017
摘要： First, a substrate is provided and a photoresist layer is coated thereon. Then, a film having a pattern is used as a mask to perform an exposing and developing process for patterning the photoresist layer. Following that, LIGA technology is employed to form a thin film having a pattern corresponding to the pattern of the film.
摘要翻译：首先，提供基板并且在其上涂覆光致抗蚀剂层。然后，将具有图案的膜用作掩模，以进行用于图案化光致抗蚀剂层的曝光和显影处理。接下来，使用LIGA技术来形成具有与膜图案对应的图案的薄膜。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式