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    • 3. 发明授权
    • Wide bandwidth attenuator input circuit for a measurement probe
    • 用于测量探头的宽带衰减器输入电路
    • US07402991B2
    • 2008-07-22
    • US11693628
    • 2007-03-29
    • Ira G. PollockWilliam A. HagerupPaul G. ChastainWilliam Q. Law
    • Ira G. PollockWilliam A. HagerupPaul G. ChastainWilliam Q. Law
    • G01R1/20
    • H03H7/24G01R1/06766H03H11/24
    • A wide bandwidth attenuator input circuit for a measurement probe has a Z0 attenuator circuit coupled in series with a compensated RC attenuator circuit. The series attenuator elements of the Z0 and the compensated RC attenuator circuits are coupled via a controlled impedance transmission line to the shunt attenuator elements of the Z0 and the compensated RC attenuator circuits. The shunt element of the Z0 attenuator element terminates the transmission line in its characteristic impedance. The junction of the series and shunt attenuator elements are coupled to the input of a buffer amplifier. At low and intermediate frequencies, the compensated RC attenuator circuit attenuates an input signal while at high frequencies, the compensated RC attenuator circuit acts as a short and the Z0 attenuator circuits attenuates the input signal.
    • 用于测量探头的宽带衰减器输入电路具有与补偿的RC衰减器电路串联耦合的Z <0> 0 衰减器电路。 Z 0的串联衰减器元件和经补偿的RC衰减器电路通过受控阻抗传输线耦合到Z 0的分流衰减器元件和经补偿的RC衰减器 电路。 Z&lt; 0&gt;衰减器元件的分路元件在其特性阻抗中终止传输线。 串联和分流衰减器元件的结点耦合到缓冲放大器的输入端。 在低频和中频频率下,补偿的RC衰减器电路在高频时衰减输入信号,补偿后的RC衰减器电路作为短路,而Z <0> 0衰减器电路衰减输入信号。
    • 5. 发明授权
    • Attachable/detachable probing tip system for a measurement probing system
    • 用于测量探测系统的可附接/可拆卸探测尖端系统
    • US07056134B2
    • 2006-06-06
    • US10856230
    • 2004-05-27
    • Jim L. MartinMarc A. GessfordWilliam R. PooleyWilliam Q. LawIra G. PollockWilliam A. Hagerup
    • Jim L. MartinMarc A. GessfordWilliam R. PooleyWilliam Q. LawIra G. PollockWilliam A. Hagerup
    • G01R31/02
    • G01R1/06788G01R1/06711G01R1/06772
    • A attachable/detachable probing tip system (10) has a housing (12) that includes a probing tip mounting member (14) and opposing substantially orthogonal attachment (16, 18) arms extending from the probing tip mounting member. The attachment arms define an inner surface of the probing tip mounting member in which is disposed at least a first a non-compressive set, resilient member (56). First and second probing tips (42, 44) are disposed over the non-compressive, resilient member (56) and secured to the housing by latching means (60, 66, 92, 96, 100, 130). The attachable/detachable probing tip system allows mounting of the probing tips (42, 44) to probing contacts on a device under test without a probe body or probing tip member (38) being attached. The attachment arms (16, 18) allows a probe body or probing tip member (38) to be attached and detached to the probing tip system (10). The probing tip member (38) includes contact pins that engage contact areas (82, 82, 92) of the probing tips (42, 44).
    • 可附接/可拆卸探测尖端系统(10)具有壳体(12),该壳体包括探测尖端安装构件(14)和从探测尖端安装构件延伸的相对的基本正交的附件(16,18)臂。 连接臂限定探测尖端安装构件的内表面,其中至少设置有第一非压缩组合弹性构件(56)。 第一和第二探测尖端(42,44)设置在非压缩弹性构件(56)上方并且通过锁定装置(60,66,92,96,100,130)固定到壳体。 可附接/可拆卸探测尖端系统允许将探测尖端(42,44)安装在被测设备上的探测触点上,而无需探测主体或探测尖端部件(38)被附接。 附接臂(16,18)允许探针主体或探测尖端构件(38)被附接并分离到探测尖端系统(10)。 探测尖端构件(38)包括接合引脚,其接合探测尖端(42,44)的接触区域(82,82,92)。
    • 6. 发明授权
    • High speed differential attenuator using a low temperature co-fired ceramic substrate
    • 高速差分衰减器采用低温共烧陶瓷基板
    • US06373348B1
    • 2002-04-16
    • US09637173
    • 2000-08-11
    • William A. Hagerup
    • William A. Hagerup
    • H03H1124
    • H03H11/24H01L23/3677H01L24/48H01L24/49H01L24/73H01L25/072H01L2224/05554H01L2224/32225H01L2224/48091H01L2224/48227H01L2224/48463H01L2224/4903H01L2224/49051H01L2224/49175H01L2224/73265H01L2924/00014H01L2924/01004H01L2924/01005H01L2924/01027H01L2924/01079H01L2924/09701H01L2924/14H01L2924/15787H01L2924/19041H01L2924/3011H01L2924/3025H01L2924/00H01L2924/00012H01L2224/45099H01L2224/05599
    • A high speed differential attenuator is formed on low temperature co-fired ceramic substrate structure having first and second parallel resistor-capacitor divider networks with each divider network having first and second parallel resistors and capacitors. The substrate has first and second dielectric layers with the top surface of the first dielectric layer having a voltage potential lead formed thereon for receiving an integrated circuit device. Each divider network further has first and second conductive elements formed on the top surface of the first dielectric layer functioning as first capacitive plates for the first and second capacitors. A third conductive element is disposed between the first and second dielectric layers and positioned beneath the first conductive element functioning as the other capacitive plate for the first capacitor. A fourth conductive element is disposed between the first and second dielectric layers and positioned beneath both of the second conductive elements of the divider networks and the voltage potential lead and functions as the other capacitive plate for the second capacitors of the divider networks and as a heat transfer layer. At least a first thermally conductive via is formed between the top and bottom surfaces of the second dielectric layer and below the voltage potential lead with the via thermally coupled to the fourth conductive element. The thermal via or vias may be thermally coupled to a heat sink disposed adjacent to the bottom surface of the second dielectric layer.
    • 在具有第一和第二并联电阻器 - 电容器分压器网络的低温共烧陶瓷衬底结构上形成高速差分衰减器,每个分压网络具有第一和第二并联电阻器和电容器。 衬底具有第一和第二电介质层,其中第一介电层的顶表面具有形成在其上的电压电位引线用于接收集成电路器件。 每个分压网络还具有形成在第一电介质层的顶表面上的第一和第二导电元件,其用作第一和第二电容器的第一电容板。 第三导电元件设置在第一和第二电介质层之间并且位于用作第一电容器的另一电容板的第一导电元件下方。 第四导电元件设置在第一和第二电介质层之间,并且位于分隔网络的第二导电元件和电压电位引线之下,并且用作分隔网络的第二电容器的另一个电容板,并作为热 转移层。 至少第一导热通孔形成在第二电介质层的顶表面和底表面之间,并且在通过热耦合到第四导电元件的通孔的下方形成电压电位引线。 热通孔或通孔可以热耦合到邻近第二电介质层的底表面设置的散热器。
    • 8. 发明授权
    • Signal acquisition probing system using a micro-cavity laser
    • 信号采集探测系统采用微腔激光器
    • US07187187B2
    • 2007-03-06
    • US11077692
    • 2005-03-10
    • Christopher P. YakymyshynWilliam Q. LawWilliam A. Hagerup
    • Christopher P. YakymyshynWilliam Q. LawWilliam A. Hagerup
    • G01R31/302G01R31/308
    • G01R15/241G01R1/071
    • A signal acquisition probing system uses a micro-cavity laser to acquire an electrical signal from a device under test. The micro-cavity laser has a VCSEL gain medium and an electro-optic optical resonant cavity. The micro-cavity laser is pumped by an external laser source and generates a frequency modulated optical signal derived from the device under test electrical signal creating an electro-magnetic field distribution in electro-optic material in the micro-cavity laser that overlaps the optical path of the optical signal propagating in the electro-optic material. The frequency modulated optical signal is coupled to an optical receiver which converts the frequency modulated optical signal to an electrical signal. The electrical signal is coupled to measurement test instrument for processing and displaying of the electrical signal.
    • 信号采集探测系统使用微腔激光器从被测设备获取电信号。 微腔激光器具有VCSEL增益介质和电光学光学谐振腔。 微腔激光器被外部激光源泵浦,并产生从被测器件电信号得到的调频光信号,从而产生与光路重叠的微腔激光器中的电光材料中的电磁场分布 的光信号在电光材料中传播。 调频光信号耦合到将调频光信号转换成电信号的光接收器。 电信号耦合到测量测试仪器,用于处理和显示电信号。
    • 10. 发明授权
    • Attachable/detachable variable spacing probing tip system
    • 可连接/可拆卸的可变间距探头系统
    • US06967473B1
    • 2005-11-22
    • US10856376
    • 2004-05-27
    • Gary W. ReedJim L. MartinWilliam R. PooleyWilliam A. Hagerup
    • Gary W. ReedJim L. MartinWilliam R. PooleyWilliam A. Hagerup
    • G01R1/06G01R1/067G01R31/02
    • G01R1/06788G01R1/06711
    • An attachable/detachable variable spacing probing tip system has a housing that receives pivoting probing arms. Each probing arm has a support member and a probing arm portion of a flexible substrate having a conductive trace thereon. One end of each conductive trace is coupled to a probing contact and the other end coupled to an electrical contact pad on a electrical contact pad portion of the flexible substrate. Each of the probing arm portions has a generally S-shaped fold therein extending from the support members to the electrical contact portion of the flexible substrate. The housing includes means for pivoting the probing arms. The rear surface of the housing has a resilient member disposed therein. Latching means in the housing secures the electrical contact pad portion of the flexible substrate to the rear surface of the housing. Opposing attachment arms from a rear surface of the housing.
    • 可附接/可拆卸的可变间距探测尖端系统具有容纳枢转探测臂的壳体。 每个探测臂具有在其上具有导电迹线的柔性基板的支撑构件和探测臂部分。 每个导电迹线的一端耦合到探测触点,另一端耦合到柔性基板的电接触焊盘部分上的电接触焊盘。 每个探测臂部分具有从支撑部件延伸到柔性基板的电接触部分的大致S形折叠部。 壳体包括用于枢转探测臂的装置。 壳体的后表面具有布置在其中的弹性构件。 壳体中的闩锁装置将柔性基板的电接触垫部分固定到壳体的后表面。 从外壳的后表面对置的连接臂。