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1. 发明申请

US20180060633A1 CAPACITIVE FINGERPRINT SENSING MODULE 审中-公开
公开(公告)号：US20180060633A1
公开(公告)日：2018-03-01
申请号：US15248586
申请日：2016-08-26
申请人： Wu-Hsu Lin
发明人： Wu-Hsu Lin
IPC分类号： G06K9/00
CPC分类号： G06K9/0002 , G06K9/00006 , G06K9/00053
摘要： A capacitive fingerprint sensing module includes a flexible printed circuit board, a lower conductive adhesive layer, an upper conductive adhesive layer, and a positioning frame. The flexible printed circuit board has an upper surface and a lower surface. The upper surface has a finger pressing region and a first sensing layer. The lower surface has a second sensing layer. The lower conductive adhesive layer is formed on the second sensing layer and provided to cover second sensing electrodes mounted on the second sensing layer. The upper conductive adhesive layer is formed on the finger pressing region. The positioning frame has an opening facing upward and a slot. The flexible printed circuit board is inserted through the slot and embedded in the positioning frame. Accordingly, effects of conductivity enhancement and accuracy improvement of the capacitive fingerprint sensing module are produced.

2. 发明授权

US10037453B2 Capacitive fingerprint sensing module 有权
公开(公告)号：US10037453B2
公开(公告)日：2018-07-31
申请号：US15248586
申请日：2016-08-26
申请人： Wu-Hsu Lin
发明人： Wu-Hsu Lin
IPC分类号： G06K9/00
CPC分类号： G06K9/0002 , G06K9/00006 , G06K9/00053 , G06K9/209
摘要： A capacitive fingerprint sensing module includes a flexible printed circuit board, a lower conductive adhesive layer, an upper conductive adhesive layer, and a positioning frame. The flexible printed circuit board has an upper surface and a lower surface. The upper surface has a finger pressing region and a first sensing layer. The lower surface has a second sensing layer. The lower conductive adhesive layer is formed on the second sensing layer and provided to cover second sensing electrodes mounted on the second sensing layer. The upper conductive adhesive layer is formed on the finger pressing region. The positioning frame has an opening facing upward and a slot. The flexible printed circuit board is inserted through the slot and embedded in the positioning frame. Accordingly, effects of conductivity enhancement and accuracy improvement of the capacitive fingerprint sensing module are produced.

3. 发明授权

US09760773B1 Smart card with a retina identifying module 有权
公开(公告)号：US09760773B1
公开(公告)日：2017-09-12
申请号：US15169823
申请日：2016-06-01
申请人： Wu-Hsu Lin
发明人： Wu-Hsu Lin
IPC分类号： G06K9/00
CPC分类号： G06K9/00597
摘要： A smart card has a bottom layer, a circuit board, a microprocessor, a retina identifying module, an operation unit, and a top layer. The microprocessor is mounted on the circuit board. The operation unit is mounted on the circuit board and is electrically connected with the microprocessor. The retina identifying module is mounted on the circuit board, is electrically connected with the microprocessor, and has a retina identifying chip and an encapsulation. The retina identifying chip is mounted on the circuit board and is electrically connected with the microprocessor. The encapsulation body is transparent, is mounted on and encloses the retina identifying chip, and has a convex top face. The top layer is mounted on the circuit board to cover the microprocessor, the operation unit and the retina identifying module.

4. 发明授权

US09813803B1 Electrical speaker assembly 有权
公开(公告)号：US09813803B1
公开(公告)日：2017-11-07
申请号：US15145974
申请日：2016-05-04
申请人： Wu-Hsu Lin
发明人： Wu-Hsu Lin
IPC分类号： H04R1/28 , H04R1/24
CPC分类号： H04R1/2811 , H04R1/025 , H04R1/227 , H04R1/24 , H04R2201/029 , H04R2499/11 , H04R2499/13
摘要： An electrical speaker assembly has a speaker element and two caps. The speaker element has two sides. The caps are attached respectively to the two sides of the speaker element, and each cap has a resonance space between the cap and a corresponding one of the sides of the speaker element, wherein one of the caps has a wire notch defined in the cap.

5. 发明授权

US09342774B1 Smart card with a fingerprint identifying module 有权
标题翻译：智能卡带指纹识别模块
公开(公告)号：US09342774B1
公开(公告)日：2016-05-17
申请号：US14794463
申请日：2015-07-08
申请人： Wu-Hsu Lin
发明人： Wu-Hsu Lin
IPC分类号： G06K19/06 , G06K19/07 , G06K19/077
CPC分类号： G06K19/0718 , G06K19/07728
摘要： The smart card has a supporting body, a flexible circuit board, a holding frame, a fingerprint identifying module, and a cover sheet. The flexible circuit board is attached to the top of the supporting body and has a data chip. The holding frame is mounted on the flexible circuit board and has a holding recess and an opening. The fingerprint identifying module is mounted in the holding frame and has an identifying chip, a flexible electrical connection sheet, and a hard supporting board to provide a supporting effect to the identifying chip. The cover sheet is attached to the top of the flexible circuit board and has an identifying window. The identifying window is defined through the cover sheet and corresponds to the identifying chip in position to allow the identifying chip to be exposed from the identifying window.
摘要翻译：智能卡具有支撑体，柔性电路板，保持框架，指纹识别模块和盖板。柔性电路板连接到支撑体的顶部并具有数据芯片。保持框架安装在柔性电路板上并具有保持凹部和开口。指纹识别模块安装在保持框架中，并具有识别芯片，柔性电连接片和硬支撑板，以向识别芯片提供支撑效果。盖板安装在柔性电路板的顶部并具有识别窗口。识别窗口通过盖板定义并且对应于识别芯片的位置，以允许识别芯片从识别窗口露出。

6. 发明授权

US11270183B2 Transitional layer for electronic modules and producing method thereof 有权
公开(公告)号：US11270183B2
公开(公告)日：2022-03-08
申请号：US16344378
申请日：2017-12-29
申请人： Wu-Hsu Lin
发明人： Wu-Hsu Lin
IPC分类号： G06K19/077 , G06K19/07
摘要： An electronic module preparation layer (A) and a manufacturing method therefor. The electronic module preparation layer (A) comprises a substrate (10), multiple electronic modules (20) and two release layers (30, 40). The multiple electronic modules (20) are coated in the substrate (10) by means of the two release layers (30, 40) so as to provide a protective effect. When a user needs to input a program code to various electronic modules (20), since one of the release layers, i.e. the release layer (40), is provided with an operation hole (42), a chip (21) and a fingerprint identification element (23) provided on various electronic modules (20) can communicate with the outside, and the user can directly carry out an operation of inputting the program code by means of the electronic module preparation layer (A), thereby effectively improving the defect in the prior art that various electronic modules (20) can easily be bent and damaged when directly inputting into the electronic modules (20), and an electronic module preparation layer (A) is thus provided.

7. 发明申请

US20210210362A1 Transitional Layer for Electronic Modules and Producing Method Thereof 有权
公开(公告)号：US20210210362A1
公开(公告)日：2021-07-08
申请号：US16344378
申请日：2017-12-29
申请人： Wu-Hsu Lin
发明人： Wu-Hsu Lin
IPC分类号： H01L21/52 , H01L21/56 , H01L23/31
摘要： An electronic module preparation layer (A) and a manufacturing method therefor. The electronic module preparation layer (A) comprises a substrate (10), multiple electronic modules (20) and two release layers (30, 40). The multiple electronic modules (20) are coated in the substrate (10) by means of the two release layers (30, 40) so as to provide a protective effect. When a user needs to input a program code to various electronic modules (20), since one of the release layers, i.e. the release layer (40), is provided with an operation hole (42), a chip (21) and a fingerprint identification element (23) provided on various electronic modules (20) can communicate with the outside, and the user can directly carry out an operation of inputting the program code by means of the electronic module preparation layer (A), thereby effectively improving the defect in the prior art that various electronic modules (20) can easily be bent and damaged when directly inputting into the electronic modules (20), and an electronic module preparation layer (A) is thus provided.

8. 发明授权

US09760775B1 Retina identifying module 有权
公开(公告)号：US09760775B1
公开(公告)日：2017-09-12
申请号：US15165769
申请日：2016-05-26
申请人： Wu-Hsu Lin
发明人： Wu-Hsu Lin
IPC分类号： G06K9/00
CPC分类号： G06K9/00604
摘要： A retina identifying module has a retina identifying chip and an encapsulation body. The encapsulation body is transparent, is mounted on and enclosing the retina identifying chip, and has a convex top face. Accordingly, the thickness of the retina identifying module can be effectively reduced.

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